Description
PLV50 Vacuum Probe System Overview
The PLV50 vacuum probe system is an entry-level yet highly precise manual probe station designed for laboratory environments that require wafer testing in vacuum conditions below 1×10⁻⁴ mbar. Supporting wafers and substrates up to 150 mm, the PLV50 combines cost-effectiveness with advanced stability and accuracy, making it an ideal choice for academic research labs, R&D teams, and early-stage device characterization.
Flexible and Adaptable Testing Capabilities
The PLV50 vacuum probe system supports a variety of applications including DC, RF, MEMS, and optoelectronic measurements. With the ability to handle both full wafers and single dies, researchers gain maximum flexibility. Up to six probe positioners can be integrated, and optional upgrades such as a thermal chuck (operating from -60°C to +300°C) and pressure regulation expand testing versatility. Users can even probe with the chamber lid open under atmospheric conditions, providing ease of access without compromising performance.
Stability and Accuracy for Reliable Results
Engineered with precision in mind, the PLV50 ensures stable probe placement through short and rigid probe arms placed directly inside the vacuum chamber. Its vibration-isolated frame delivers superior measurement repeatability, while precise probe positioning minimizes errors during delicate measurements. This stability makes it suitable for advanced MEMS and optoelectronic device characterization.
User-Centered Ergonomic Design
Designed for straightforward use, the PLV50 features a hinged topside lid and intuitive manual operation. Researchers benefit from quick DUT exchanges, comfortable topside access to samples, and simplified microscope adjustments. Independent control of the chuck stage and probe positioners allows for step-and-repeat wafer testing, with simultaneous contacting and separation of probes enhancing throughput.
By combining precision, stability, and user-friendly design, the Cascade PLV50 vacuum probe system provides laboratories with a powerful and affordable platform for accurate wafer characterization.
PLV50 Technical Highlights Table
| Specification | Details |
| Wafer Size Capacity | Up to 150 mm or single dies |
| Operating Environment | Vacuum < 1×10⁻⁴ mbar |
| Positioners | Up to 6 |
| Temperature Range (option) | -60°C to +300°C with thermal chuck |
| Pressure Regulation | Optional |
| Probe Environment | Vacuum with option for atmospheric probing |
| Frame Design | Solid, vibration-isolated |
| Operation | Manual, ergonomic, microscope support |
| Throughput | Step-and-repeat wafer testing with simultaneous probe separation |
| Applications | DC, RF, MEMS, OPTO |
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