Description
High Current Probe
FormFactor Beaverton High-Current Probe |
| Maximum voltage | 500 V DC Maximum current (DC) 10 A |
| Maximum current (pulse) | 100 A, 1 msec max PW, 1% max duty cycle (BNC: 40 A, 1 msec max PW, 1% max duty cycle) |
| Total resistance with tip | 10 mΩ (typical) |
| Operating temperature range | -55°C to 300°C |
| Isolation resistance | > 100 GΩ at 500 V |
| Connector type | Dual banana jack or BNC |
| Length of cable | 1 m (BNC: 0.76 m) |
| Positioner compatibility | Summit RF positioner |
contact points and is joined by a single heat sink that pulls pull heat from the probe tip.High Current Probe Overview
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip. FormFactor Beaverton High-Current Probe
High Current Probe Key Features
- Enables wafer probing up to 60A pulsed/10A DC
- Innovative multi-fingertip design provides even distribution of current
- Supports up to 500V
- Replaceable Tungsten probe tips
- Temperature range of -55 to 300ºC
- Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
- Prevents against thermal runaway
- Measure devices on wafer at higher currents than ever before
- Small scrub minimizes damage to aluminum pad
- Small footprint – tip fits on a 1mm pad
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