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FRT GmbH MICROPROF® AP

FRT GmbH MICROPROF® AP

Highlights MicroProf® AP

  • flexible multi-sensor metrology tool for advanced packaging
  • for every process step from TSV etching, RDL/UBM/bumping to Cu nail reveal, dicing, stacking and molding
  • wafer handling unit with SEMI-standard FOUPs/FOSBs and open cassettes
  • individual configuration for your specific applications
  • retrofit on demand

 

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Introducing the FRT GmbH MICROPROF® AP

The MicroProf® AP is a fully automated wafer metrology tool, for a wide range of applications at different 3D packaging process steps, e.g. for the measurement of photoresist (PR) coatings and structuring, through silicon vias (TSVs) or trenches after etching, μ-bumps and Cu pillars, as well as for the measurement in thinning, bonding and stacking processes. With its high flexibility and universality, enabled by its modular multi-sensor concept, it is ideally suited to perform a wide range of measurement tasks in advanced packaging within one metrology tool.

POWERFUL RECIPES FOR EVERY PROCESS STEP

The tool is run by the SEMI-compliant Acquire Automation XT software. In addition, fine sample alignment via pattern recognition is available. This software provides comprehensive capabilities, from manual measurement on the device to fully automated measurement with one-button-operation and integration into production control systems, e.g. via a SECS/GEM interface.

FRT GmbH MICROPROF<sup>®</sup> AP



FRT GmbH MICROPROF<sup>®</sup> AP

Key Features

Highlights MicroProf® AP

  • flexible multi-sensor metrology tool for advanced packaging
  • for every process step from TSV etching, RDL/UBM/bumping to Cu nail reveal, dicing, stacking and molding
  • wafer handling unit with SEMI-standard FOUPs/FOSBs and open cassettes
  • individual configuration for your specific applications
  • retrofit on demand

TYPICAL APPLICATIONS

  • PI and PR film thickness, PI and PR opening
  • CD and overlay
  • TSV metrology, fill monitoring, trenches
  • seed layer metal inspection
  • plated Cu thickness
  • flatness and uniformity after CMP
  • UBM height and roughness
  • RDL thickness, width and roughness
  • complement and enhance the performances of automated bump inspection systems
  • bump and nail height, diameter and coplanarity
  • bow and stress
  • carrier, adhesive, bonded wafer thickness, and TTV
  • final packaging topography and planarity
  • stacking deformation after thermal load
  • mold inspection

 



Key Benefits

AUTOMATED HANDLING

The MicroProf® AP is designed for fully automated processing of 300 mm FOUPS/FOSBs and 300 mm/200 mm/150 mm open cassettes. Moreover, the tool can be also configured for processing frame cassettes and handling of panels. The handling part features a robot with end-effector, two load ports including mapper and RFID reader, pre-aligner and optional OCR reader stations. The system is able to handle SEMI standard wafers, highly warped wafers (e.g. eLWB), bonded wafers, wafers on tape, TAIKO, bare and thinned wafers and even fan-out wafers. The EFEM is equipped with filter fan units (FFU) providing ISO class 3 clean room conditions within the tool.

 


FRT GmbH MICROPROF<sup>®</sup> AP


Trust the Experts at ACA TMetrix Inc.

ACA TMetrix Inc. is a leading Canadian distributor of test and measurement instruments and design tools. For over 55 years we have provided products manufactured by the world’s leading instrument manufacturers. Leading Distributor of Design Tools and Test Equipment in Canada.

Specifications

Metrology unit
MicroProf® 300
Chromatic point sensor CWL
TTV Setup
Film thickness sensor FRT CWL FT/IRT
Thin film sensor FRT FTR
Chromatic line sensor FRT SLS
Confocal microscope FRT CFM/CFM DT
White light interferometer FRT WLI FL/WLI PL
Standard positioning camera with illumination
High resolution camera with illumination
Brightfield IR illumination + IR camera for inspection
Pattern recognition software
3-point fixture for 1 or 2 wafer sizes
Thermo unit (controlled hot & cold chuck)
In-plane deformation sensor
WAfer HAndling unit
Robot unit
Pre-aligner
1 load port for 300 mm FOUPs/FOSBs SEMI-standard
1 load port for open cassette SEMI-standard
     > for 150 mm (6 inch) wafers
     > for 200 mm (8 inch) wafers
     > for 300 mm (12 inch) wafers
RFID reader
Vaccum end-effector handling
Edge grip handling
Handling of warped wafers (e.g. eWLB) and panels
Bernoulli-handling (non-contact)
OCR reader (front/back)
Ionizer bar
SoftWAre
FRT Acquire Automation XT incl. one evaluation package + additional packages (if needed):
    > TTV, Bow, Warp
    > Bumps, Vias, Trenches
    > Critical Dimension, Overlay
    > Roughness and Waviness, Flatness
    > Step Height
    > Saw Marks
    > Film Thickness
    >Wafer Stress
    >Angle Evaluation
    >Nanotopography
    > Fine Alignment
SECS/GEM Interface (standard or customized)
Analysis software FRT Mark III
Measurement software FRT Acquire

 

 



Contact ACA TMetrix Inc.

Address

3585 Laird Road, Unit 15 & 16, Mississauga ON L5L 5Z8

Phone: 1-800-665-7301

Fax: 1-905-890-1959

Email: info@tmetrix.com

About ACA TMetrix Inc.

ACA TMetrix Inc. is a leading supplier of test instruments and design tools in Canada. For over 50 years we have provided services and support for products that are manufactured by the world's leading instrument suppliers.

TMetrix Ltd. is Part of the ACA Group of Companies. Allan Crawford Associates (ACA), is one of Canada's largest distributors of electronic components, test equipment, and scientific solutions.

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