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The MicroProf® AP is a fully automated wafer metrology tool, for a wide range of applications at different 3D packaging process steps, e.g. for the measurement of photoresist (PR) coatings and structuring, through silicon vias (TSVs) or trenches after etching, μ-bumps and Cu pillars, as well as for the measurement in thinning, bonding and stacking processes. With its high flexibility and universality, enabled by its modular multi-sensor concept, it is ideally suited to perform a wide range of measurement tasks in advanced packaging within one metrology tool.
POWERFUL RECIPES FOR EVERY PROCESS STEP
The tool is run by the SEMI-compliant Acquire Automation XT software. In addition, fine sample alignment via pattern recognition is available. This software provides comprehensive capabilities, from manual measurement on the device to fully automated measurement with one-button-operation and integration into production control systems, e.g. via a SECS/GEM interface.
Key Features
Highlights MicroProf® AP
flexible multi-sensor metrology tool for advanced packaging
for every process step from TSV etching, RDL/UBM/bumping to Cu nail reveal, dicing, stacking and molding
wafer handling unit with SEMI-standard FOUPs/FOSBs and open cassettes
individual configuration for your specific applications
retrofit on demand
TYPICAL APPLICATIONS
PI and PR film thickness, PI and PR opening
CD and overlay
TSV metrology, fill monitoring, trenches
seed layer metal inspection
plated Cu thickness
flatness and uniformity after CMP
UBM height and roughness
RDL thickness, width and roughness
complement and enhance the performances of automated bump inspection systems
bump and nail height, diameter and coplanarity
bow and stress
carrier, adhesive, bonded wafer thickness, and TTV
final packaging topography and planarity
stacking deformation after thermal load
mold inspection
Key Benefits
AUTOMATED HANDLING
The MicroProf® AP is designed for fully automated processing of 300 mm FOUPS/FOSBs and 300 mm/200 mm/150 mm open cassettes. Moreover, the tool can be also configured for processing frame cassettes and handling of panels. The handling part features a robot with end-effector, two load ports including mapper and RFID reader, pre-aligner and optional OCR reader stations. The system is able to handle SEMI standard wafers, highly warped wafers (e.g. eLWB), bonded wafers, wafers on tape, TAIKO, bare and thinned wafers and even fan-out wafers. The EFEM is equipped with filter fan units (FFU) providing ISO class 3 clean room conditions within the tool.
Trust the Experts at ACA TMetrix Inc.
ACA TMetrix Inc. is a leading Canadian distributor of test and measurement instruments and design tools. For over 55 years we have provided products manufactured by the world’s leading instrument manufacturers. Leading Distributor of Design Tools and Test Equipment in Canada.
Specifications
Metrology unit
MicroProf® 300
Chromatic point sensor CWL
TTV Setup
Film thickness sensor FRT CWL FT/IRT
Thin film sensor FRT FTR
Chromatic line sensor FRT SLS
Confocal microscope FRT CFM/CFM DT
White light interferometer FRT WLI FL/WLI PL
Standard positioning camera with illumination
High resolution camera with illumination
Brightfield IR illumination + IR camera for inspection
