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The innovative illumination concept of the MicroProf® DI makes a variety of defect types visible and detects local failures, inclusions and other defects regardless of their position. The MicroProf® DI includes several modules like optical inspection and classification of defects via single-shot and step module, review of defects via a high-precision microscope and comprehensive multi-sensor metrology with different topography and film thickness sensors.
Key Features
Highlights MicroProf® DI
High-precision optical surface inspection for semiconductor applications
Metrology and Inspection flexibly combined in one fully automated platform
Defect inspection with singleshot module, step camera and microscope station
Fast and reliable inspection of defects down to sub-μm range
Dark field micro inspection and bright field macro inspection
Key Benefits
Defect inspection software
Our defect inspection software provides effective visualization, versatile processing and fast generation of wafer maps as well as precise quantification and comprehensible documentation of defects. The software enables the user to display different views of a selected data set, e.g. wafer map and defect list with number, position, size and grey value of the respective defects. The software provides a wafer map showing the location of each defect in the selected data set. The defects are assigned according to user-defined criteria and synchronized with the defect list.
Trust the Experts at ACA TMetrix Inc.
ACA TMetrix Inc. is a leading Canadian distributor of test and measurement instruments and design tools. For over 55 years we have provided products manufactured by the world’s leading instrument manufacturers. Leading Distributor of Design Tools and Test Equipment in Canada.
Specifications
Metrology unit
MicroProf® 300
Single-shot inspection module with various illumination methods
Step inspection module (DIUSM)
Review microscope with motorized 5-fold objective revolver
