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The MicroProf® FE is FRT’s standard fully automated 2D/3D wafer metrology tool. It combines the capabilities of the worldwide established MicroProf® 300 with a wafer handling system within an Equipment Front End Module (EFEM). With it’s fully SEMI-compliant metrology solutions and almost maintenance-free hardware components, providing high throughput inspection, the MicroProf® FE is the perfect workhorse in any front end HVM fab.
Besides the standard configuration, the tool can be equipped with numerous additional features, which can also be retrofit at a later time. The MicroProf® FE enables you keeping pace with technology’s progression fast and at reduced investment cost!
Key Features
The standard fully automated wafer metrology tools – FE, FS, AP and DI
The standard fully automated wafer metrology tools – FE, FS, AP and DI – combine the capabilities of the worldwide established MicroProf® 300, with a wafer handling system within an Equipment Front End Module (EFEM). With fully SEMI-compliant metrology solutions and almost maintenance-free hardware components, the MicroProf® with EFEM is configurable for any front end high-volume fab (FE), for a wide range of applications in the silicon wafer foundry (FS), applications at different 3D packaging process steps (AP) or comprehensive inspection applications (DI).
SYSTEM CHARACTERISTICS
fully automated 2D and 3D surface metrology for Front-End applications
multi-sensor technology, based on the MicroProf® 300
specific inline solution
wafer Handling Module
equipment Front End Module (EFEM)
Key Benefits
The MicroProf® FE is the standardised, fully-automated 2D / 3D wafer metrology tool. Due to its entirely SEMI conformal metrology solutions as well as nearly maintenance-free hardware components, which allow a high throughput, the MicroProf® FE is the perfect “workhorse” for every Front-End fab. The standard configuration can be enhanced by many optional functions, even as on site upgrade at a later date. Keep pace with the rapid technological development at reduced investment costs – with the MicroProf® FE!
Typical samples are:
Bare wafers: post grinding and post polishing
Coated wafers
Structured wafers: various lithographic process steps, measurement of conducting traces, bumps etc.
MEMS product wafers: acceleration sensors, pressure sensors, micro optics, etc.
3D packaging: wafers at different 3D packaging process steps, e.g. with through silicon vias or trenches after etching
Trust the Experts at ACA TMetrix Inc.
ACA TMetrix Inc. is a leading Canadian distributor of test and measurement instruments and design tools. For over 55 years we have provided products manufactured by the world’s leading instrument manufacturers. Leading Distributor of Design Tools and Test Equipment in Canada.
Specifications
Metrology unit
high-resolution camera
pattern recognition software
TTV Setup
film thickness sensor IRT
Thin film sensor FRT FTR
field of view sensor CFM, CFM DT, WLI FL, WLI PL
chromatic line sensor SLS
brightfield IR illumination + IR camera for inspection
Standard positioning camera with illumination
High resolution camera with illumination
Brightfield IR illumination + IR camera for inspection
3 point wafer fixture for two wafer sizes
3-point fixture for 1 or 2 wafer sizes
fully supported wafer fixture with vacuum for one or two wafer sizes
thermo unit (controlled hot & cold chuck
AFM
WAfer HAndling unit
load ports for open cassette handling (150 or 200 mm wafers)
bridge tool option (two wafer sizes in one tool)
edge grip handling option
warped wafer handling option for thin wafers
Bernoulli (non-contact) handling option for thin wafers
