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FRT GmbH MICROPROF® FS

FRT GmbH MICROPROF® FS

Highlights MicroProf® FS

  • multi-sensor technology and hybrid metrology for MEMS and Foundries
  • customisable for a wide range of applications within the Wafer Foundry
  • standardised and customer-specific solutions
  • greatest possible flexibility
  • handling of diverse substrate types
  • powerful software for fully-automated 2D and 3D surface metrology
  • equipment Front End Module (EFEM)

 

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Introducing the FRT GmbH MICROPROF® FS

The tool is run by the SEMI-compliant FRT Acquire Automation XT software. This software allows recipe based measurement and data analysis of structured and unstructured wafers. Choose the suitable measurement and evaluation routine for your measuring task from a variety of packages.  For recurring structures, a layout wizard with a graphical user interface (GUI) can support you in teaching the measuring positions. In addition, fine sample alignment via pattern recognition is available as an option.

 

 

 

 

FRT GmbH MICROPROF<sup>®</sup> FS



FRT GmbH MICROPROF<sup>®</sup> FS

Key Features

The standard fully automated wafer metrology tools – FE, FS, AP and DIThe standard fully automated  wafer metrology tools – FE, FS, AP and DI –  combine the capabilities of the worldwide established MicroProf® 300, with a wafer handling system within an Equipment Front End Module (EFEM). With fully SEMI-compliant metrology  solutions and almost maintenance-free hardware components,  the MicroProf® with EFEM is configurable for any front end high-volume fab (FE), for a wide range of applications in the silicon wafer foundry (FS), applications at different  3D packaging process steps (AP) or comprehensive inspection applications (DI).The MicroProf® FS is a fully-automated wafer metrology tool. It can be configured for a wide range of applications within the Wafer Foundry or the MEMS Fab and uses both standardised and customer-specific solutions. Its enormous versatility makes the MicroProf® FS a real “all-rounder” in the cutting-edge Foundry. That is why we call it the Foundry Star!

SYSTEM CHARACTERISTICS

  • multi-sensor technology and hybrid metrology for MEMS and Foundries
  • customisable for a wide range of applications within the Wafer Foundry
  • standardised and customer-specific solutions
  • greatest possible flexibility
  • handling of diverse substrate types
  • powerful software for fully-automated 2D and 3D surface metrology
  • equipment Front End Module (EFEM)

 



Key Benefits

This software provides comprehensive capabilities, from manual measurement on the device to fully automated measurement with one-button operation and integration into production control systems, e.g. via a SECS/GEM interface. You can easily configure various measurement tasks using different sensors to run consecutively as a measurement sequence. This includes the execution of measurements, processing and analysis using intelligent algorithms, output and visualization of results in the form of reports and the export of results in various data formats.

TYPICAl APPLICATION

  • coated wafers
  • structured wafers at various lithographic process steps, measurement of conductor tracks, bumps, etc.
  • MEMS product wafers featuring acceleration sensors, pressure sensors, micro optics, etc.
  • wafers at different 3D packaging process steps, e.g. with through silicon vias or trenches after etching
  • thin film layer stacks

FRT GmbH MICROPROF<sup>®</sup> FS


Trust the Experts at ACA TMetrix Inc.

ACA TMetrix Inc. is a leading Canadian distributor of test and measurement instruments and design tools. For over 55 years we have provided products manufactured by the world’s leading instrument manufacturers. Leading Distributor of Design Tools and Test Equipment in Canada.

Specifications

Metrology unit
MicroProf® 300
Chromatic point sensors FRT CWL
TTV Setup
Film thickness sensor FRT CWL FT/IRT
Thin film sensor FRT FTR
Chromatic line sensor FRT SLS
Confocal microscope FRT CFM/CFM DT
White light interferometer FRT WLI FL/WLI PL
Standard positioning camera with illumination
High resolution camera with illumination
Brightfield IR illumination + IR camera for inspection
Pattern recognition software
3-point fixture for 1 or 2 wafer sizes
Thermo unit (controlled hot & cold chuck)
WAfer HAndling unit
Single arm robot unit
Pre-aligner
2 load ports for open cassette SEMI-standard
     > for 150 mm (6 inch) wafers
     > for 200 mm (8 inch) wafers
     > for 300 mm (12 inch) wafers
     > Bridge tool option
RFID reader
Vaccum end-effector handling
Edge grip handling
Handling of warped wafers (e.g. eWLB)
Bernoulli-handling (non-contact)
OCR reader (front/back)
Ionizer bar
SoftWAre
FRT Acquire Automation XT incl. one evaluation package + additional packages (if needed):
    > Step Height and Film Thickness
    > TTV, Bow, Warp
    > Bumps
    > Wafer Geometry
    > Roughness and Waviness
    > Saw Marks
    > Customized Evaluation Package
    > Nanotopography
SECS/GEM Interface (standard or customized)
Analysis software FRT Mark III
Measurement software FRT Acquire

 

 

Datasheet


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