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    • Available in 4.5-digit (60,000 count) and 6.5-digit (2,200,000 count) resolutions.
    • Wide measurement range:
      • DC Voltage: Up to 1000V
      • AC Voltage: Up to 750V (True RMS)
      • Current: 10A (AC/DC)
      • Resistance: 100MΩ (2-wire/4-wire)
      • Capacitance: 2nF – 100mF
      • Temperature measurements with TC and RTD sensor support.
    • High-speed measurements:
      • T3DMM4-5: 150 readings per second
      • T3DMM6-5: 10,000 readings per second
    • Advanced mathematical functions such as Max, Min, Standard Deviation, dBm/dB, Relative Measurement, Pass/Fail Analysis, and Histograms.
    • Connectivity: USB Device, USB Host, and LAN for remote operation via SCPI commands.
    • Data Storage: 1GB NAND flash memory for saving configuration files and test data.
    • Built-in cold junction compensation for accurate temperature measurements.
    • File management system supporting U-disc and local storage for convenient data access.
    • Comprehensive user interface with a dual-display system for easy navigation.
    • Automatic measurement functions, including statistical analysis, gating, and reference functions.

     

  • The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables the collection of accurate high-voltage and high-current measurement data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current), with complete operator safety.

    • Re-configurable for DC, RF, mmW, FA, WLR and more
    • table and repeatable measurements over a wide thermal range
    • Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
    • Minimize AC and spectral noise
    • Manual 3-axis stage with ergonomic controls
    • Fast, accurate “hands on” wafer positioning
    • Quick, safe, and comfortable wafer access

     

    • Comfortable and ergonomic operation
    • Thermal range ambient to +300°C
    • RF/microwave device characterization, FA and design debug
    • Seamless integration between Velox and analyzers/measurement software
    • Complete solutions using probe positioners and probe cards
    • Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
    • Shortest signal path test integration for accurate, thermally stable, and low-error data collection
    • Powerful automation tools, reduce total test time on wafers, singulated dies, and modules
    • Faster time to first data for standard and “hard to test” devices such as thin wafer, small pad and high power
    • Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact

     

  • 3-Channel AC/DC Power Meter for Single-Phase to 3P4W Equipment such as Motors, Inverters, Power Conditioners, and Power Supplies

    • Voltage/current/power basic accuracy of ±0.1% *
    • Direct input up to 1000 V AC/DC / 65 A
    • Harmonic measurement as standard feature, IEC61000-4-7 compliant
    • Little instrument loss, even with large currents. DCCT input with an input resistance of 1 mΩ or less.
    • Power factor effect of ±0.1% f.s. delivers highly accurate measurements even for no-load testing of transformers with a low power factor
    • Measurement of multiple connections in the optimal range for each due to independent ranges for each channel
    • Measure up to 5000 A AC with optional current sensor

     

    • On-wafer power device characterization up to 10,000 V DC / 600 A
    • Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
    • Prevent thin wafers from curling and breaking
    • Accurate Rds(on) measurement at high current
    • Accurate UIS measurements at high temperature
    • Roll-out stage for full wafer access and easy wafer loading/unloading
    • Seamless integration between Velox and analyzers/measurement software
    • High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
    • Easy on-screen navigation, wafer mapping, and operation of accessories with Velox
  • Enabling single-contact high-current/high-voltage test

    • Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
    • Even distribution of high current with innovative multi-fingertip design
    • Compatible with Tesla 200/300 mm power device characterization system
    • Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
    • Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
    • Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

     

  • XJDeveloper is a graphical application that allows you to quickly and easily set up and run tests on your circuit. With XJDeveloper you can reduce your time to market by reusing your test scripts all the way through the product design process and then in manufacturing.