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    • Available in 4.5-digit (60,000 count) and 6.5-digit (2,200,000 count) resolutions.
    • Wide measurement range:
      • DC Voltage: Up to 1000V
      • AC Voltage: Up to 750V (True RMS)
      • Current: 10A (AC/DC)
      • Resistance: 100MΩ (2-wire/4-wire)
      • Capacitance: 2nF – 100mF
      • Temperature measurements with TC and RTD sensor support.
    • High-speed measurements:
      • T3DMM4-5: 150 readings per second
      • T3DMM6-5: 10,000 readings per second
    • Advanced mathematical functions such as Max, Min, Standard Deviation, dBm/dB, Relative Measurement, Pass/Fail Analysis, and Histograms.
    • Connectivity: USB Device, USB Host, and LAN for remote operation via SCPI commands.
    • Data Storage: 1GB NAND flash memory for saving configuration files and test data.
    • Built-in cold junction compensation for accurate temperature measurements.
    • File management system supporting U-disc and local storage for convenient data access.
    • Comprehensive user interface with a dual-display system for easy navigation.
    • Automatic measurement functions, including statistical analysis, gating, and reference functions.

     

  • The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables the collection of accurate high-voltage and high-current measurement data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current), with complete operator safety.

    • Re-configurable for DC, RF, mmW, FA, WLR and more
    • table and repeatable measurements over a wide thermal range
    • Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
    • Minimize AC and spectral noise
    • Manual 3-axis stage with ergonomic controls
    • Fast, accurate “hands on” wafer positioning
    • Quick, safe, and comfortable wafer access

     

    • Comfortable and ergonomic operation
    • Thermal range ambient to +300°C
    • RF/microwave device characterization, FA and design debug
    • Seamless integration between Velox and analyzers/measurement software
    • Complete solutions using probe positioners and probe cards
    • Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
    • Shortest signal path test integration for accurate, thermally stable, and low-error data collection
    • Powerful automation tools, reduce total test time on wafers, singulated dies, and modules
    • Faster time to first data for standard and “hard to test” devices such as thin wafer, small pad and high power
    • Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact

     

  • 3-Channel AC/DC Power Meter for Single-Phase to 3P4W Equipment such as Motors, Inverters, Power Conditioners, and Power Supplies

    • Voltage/current/power basic accuracy of ±0.1% *
    • Direct input up to 1000 V AC/DC / 65 A
    • Harmonic measurement as standard feature, IEC61000-4-7 compliant
    • Little instrument loss, even with large currents. DCCT input with an input resistance of 1 mΩ or less.
    • Power factor effect of ±0.1% f.s. delivers highly accurate measurements even for no-load testing of transformers with a low power factor
    • Measurement of multiple connections in the optimal range for each due to independent ranges for each channel
    • Measure up to 5000 A AC with optional current sensor

     

    • On-wafer power device characterization up to 10,000 V DC / 600 A
    • Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
    • Prevent thin wafers from curling and breaking
    • Accurate Rds(on) measurement at high current
    • Accurate UIS measurements at high temperature
    • Roll-out stage for full wafer access and easy wafer loading/unloading
    • Seamless integration between Velox and analyzers/measurement software
    • High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
    • Easy on-screen navigation, wafer mapping, and operation of accessories with Velox
  • Enabling single-contact high-current/high-voltage test

    • Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
    • Even distribution of high current with innovative multi-fingertip design
    • Compatible with Tesla 200/300 mm power device characterization system
    • Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
    • Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
    • Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)