Products

Featuring an ultra-compact 0.35”microLED display with high-brightnessand high-resolution technology,delivering dynamic visuals and seamlessintegration for next-generationautomotive heads-up display (HUD).

Key Features of High Brightness High Resolution 0.35″ Micro-Display:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Power-Efficient Design: Consumes significantly less powercompared to traditional display technologies, extendingbattery life for wearable devices.

Showcasing a large 10” panel withultra-bright, energy-efficientmicroLED technology, deliveringdynamic visuals and seamlessintegration for next-generationintelligent vehicles.

Ket Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Vibrant RGB Color Reproduction: Delivers rich, high-contrast visuals with precise color accuracy, enhancingvisuals for display applications.

Advancing automotive displayswith ultra-bright, energy-efficientmicroLED technology, enablingdynamic visuals and seamlessintegration for next-generationintelligent vehicles.

Key Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Vibrant RGB Color Reproduction: Delivers rich, high-contrast visuals with precise color accuracy, enhancingvisuals for display applications.

Revolutionizing automotivelighting with ultra-bright, energy-efficient microLED displays,enabling adaptive illuminationand seamless integration for next-generation intelligent vehicles.

Key Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Segment-Driven Intelligence: Enables optimal messagingthrough precisely controlled lighting segments, enhancingintelligent lighting capabilities for smart automotiveapplications and other high-performance devices.

Transforming automotive lightingwith ultra-bright, energy-efficientmicroLED displays, deliveringprecision illumination andseamless integration for next-generation vehicles.

Key Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellentvisibility in both indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Power-Efficient Design: Consumes significantly lesspower compared to traditional display technologies.

The DCP-X probe is designed for engineers and scientists in device characterization, R&D, and testing, offering highly accurate and repeatable on-wafer electrical measurements (IV, CV, LFN). It uses MEMS technology to measure advanced devices (2, 3, 5 nm) on various pad materials, micro-bumps, and pads as small as 20 μm, reducing the need for retesting and cleaning while covering the full thermal range at lower testing costs. Compared to traditional probes, the DCP-X provides 1000x lower contact resistance, minimal skate, and over 500,000 contact cycles, ensuring precise measurements and longer probe life.

The EMI 64k software allows to embed the TDEMI systems in a fully automated test environment.

• Full automation of EMI testing according to all commercial and military standards
• Automated control of turntable, antenna and other equipment
• Height and Angular Scan
• Procedures according to standards as well as customized procedures
• Reducing the cost for EMC and communication testing and certification by tailored packages

The measurement system for all emission measurments in the frequency range 1 Hz – 44 GHz.

• Frequency Range  1 Hz – 30MHz, 1GHz, 3GHz, 6GHz, 9GHz, 18GHz, 26GHz, 40 GHz and 44GHz
• 225 MHz Real-time Analysis Bandwidth
• Weighted Real-time Spectrogram up to 44 GHz
• CISPR Bandwidths 200 Hz, 9 kHz, 120 kHz, 1 MHz
• MIL/DO Bandwidths 10 Hz, 100 Hz, 1 kHz, 10 kHz, 100 kHz, 1 MHz

The measurement system for all emission measurments in the frequency range 1 Hz – 44 GHz.

• Full compliance EMI Reciever according to standard CISPR 16-1· 1, ANSI C63.2, MIL->461, and DO·160
• Spectrum Analyzer
• Integrated LOW Noise Ampllfier (lNAI)
• Integrated Preselect1on
• Tradttional and FFT·based Mode
• Automatic Stepped Attenuator
• Ultra Low Noise Floor
• Excellent spurious Performance
• Real-time Spectrum Analyzer optional
• Vast IQ-Bandwidth

TDEMI Mobile+. The ultra mobile EMI receiver – Emission measurements everytime, everywhere. Fully stand-alone operable.

• Frequency Ranges 10Hz – 1GHz, 3GHz, 6GHz or 7GHz
• 16000x faster than conventional receivers
• Super compact design and 12V supply
• 225 MHz fully gapless real-time analysis bandwidth
• Weighted Real-time Spectrogram

Ultra High Performance RT Spectrum Analyzer. Ultrafast EMI Measurements.

• Frequency Range from 1 Hz up to 50 GHz
• 225 MHz Real-time analysis bandwidth
• 100 dB Dynamic Range
• Ultrahigh performance preselection in all modes
• Up to 510 MHz Real-time IQ-Analysis bandwidth
• Ultra High Performance Spectrum Analyzer

• Reliable and Repeatable solid state signal generation
• Standard Internal/external pulse modulation
• USB/Ethernet Control
• 10 MHz external or internal reference
• 100 Hz Frequency Resolution
• Easily portable
• Sized to fit into a single rack unit for ATE applications

• Reliable and Repeatable solid state digital attenuation
• Includes GUI, Windows and Linux SDK, LabVIEW driver
• Programmable attenuation ramp and fading profiles
• Operate multiple devices directly from a PC or self-powered hub
• Easily portable USB powered device
• USB and Ethernet control interfaces

The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables the collection of accurate high-voltage and high-current measurement data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current), with complete operator safety.

• Vector Network Analyzer (option up to 26.5GHz)
• WinCal XE calibration software
• Uses best measurement practices for optimized measurements
• Known measurement accuracy traced back to independent standards
• Supported by the measurement experts to make you successful
• Best in class RF performance
• Small benchtop footprint
• Industry standard calibration techniques
• Extended 2 Year warranty on FormFactor products for educational customers

• Re-configurable for DC, RF, mmW, FA, WLR and more
• table and repeatable measurements over a wide thermal range
• Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
• Minimize AC and spectral noise
• Manual 3-axis stage with ergonomic controls
• Fast, accurate “hands on” wafer positioning
• Quick, safe, and comfortable wafer access