Products

The DCP-X probe is designed for engineers and scientists in device characterization, R&D, and testing, offering highly accurate and repeatable on-wafer electrical measurements (IV, CV, LFN). It uses MEMS technology to measure advanced devices (2, 3, 5 nm) on various pad materials, micro-bumps, and pads as small as 20 μm, reducing the need for retesting and cleaning while covering the full thermal range at lower testing costs. Compared to traditional probes, the DCP-X provides 1000x lower contact resistance, minimal skate, and over 500,000 contact cycles, ensuring precise measurements and longer probe life.

The EMI 64k software allows to embed the TDEMI systems in a fully automated test environment.

• Full automation of EMI testing according to all commercial and military standards
• Automated control of turntable, antenna and other equipment
• Height and Angular Scan
• Procedures according to standards as well as customized procedures
• Reducing the cost for EMC and communication testing and certification by tailored packages

The measurement system for all emission measurments in the frequency range 1 Hz – 44 GHz.

• Frequency Range  1 Hz – 30MHz, 1GHz, 3GHz, 6GHz, 9GHz, 18GHz, 26GHz, 40 GHz and 44GHz
• 225 MHz Real-time Analysis Bandwidth
• Weighted Real-time Spectrogram up to 44 GHz
• CISPR Bandwidths 200 Hz, 9 kHz, 120 kHz, 1 MHz
• MIL/DO Bandwidths 10 Hz, 100 Hz, 1 kHz, 10 kHz, 100 kHz, 1 MHz

The measurement system for all emission measurments in the frequency range 1 Hz – 44 GHz.

• Full compliance EMI Reciever according to standard CISPR 16-1· 1, ANSI C63.2, MIL->461, and DO·160
• Spectrum Analyzer
• Integrated LOW Noise Ampllfier (lNAI)
• Integrated Preselect1on
• Tradttional and FFT·based Mode
• Automatic Stepped Attenuator
• Ultra Low Noise Floor
• Excellent spurious Performance
• Real-time Spectrum Analyzer optional
• Vast IQ-Bandwidth

TDEMI Mobile+. The ultra mobile EMI receiver – Emission measurements everytime, everywhere. Fully stand-alone operable.

• Frequency Ranges 10Hz – 1GHz, 3GHz, 6GHz or 7GHz
• 16000x faster than conventional receivers
• Super compact design and 12V supply
• 225 MHz fully gapless real-time analysis bandwidth
• Weighted Real-time Spectrogram

Ultra High Performance RT Spectrum Analyzer. Ultrafast EMI Measurements.

• Frequency Range from 1 Hz up to 50 GHz
• 225 MHz Real-time analysis bandwidth
• 100 dB Dynamic Range
• Ultrahigh performance preselection in all modes
• Up to 510 MHz Real-time IQ-Analysis bandwidth
• Ultra High Performance Spectrum Analyzer

• High Power: Ranging from  750W to 15kW.
• User-Friendly: Easy connections via LAN (LXI 1.5), USB (2.0), RS-232/RS-485.
• Safe & Certified: CE/UKCA marked with built-in safety.
• Versatile: Ideal for various industries.
• Warranty: 5 years.

• Optional Interfaces: IEEE, EtherCAT, Modbus-TCP, Isolated Analog 4-20mA (IS420)
• Output Power Levels: 1kW to 15kW, low-noise performance
• Output Voltage/Current: Up to 1500V and 1500A
• AC Input Options: Single-phase and three-phase with Active Power Factor Correction
• Mechanical Options: Blank Front Panel, Air Filter Kits, Parallel Kits
• Certifications: CE/UKCA Marked, UL/cUL/IEC/EN 61010-1
• Warranty: 5 years

• High power density, lightweight, and portable
• Output power: 30kW, 45kW, 60kW; Output voltages: 10V to 600V
• Advanced features: Programmable V/I Slew-Rate, Constant-Power Limit, Arbitrary Waveform Generator
• Built-in interfaces: LAN (LXI 1.5), USB (2.0), RS-232/RS-485, Isolated Analog (5V/10V)
• Optional interfaces: IEEE, EtherCAT, Modbus-TCP, Isolated Analog 4-20mA
• CE and UKCA marked, worldwide safety approvals, 5-year warranty

• Compact, air-cooled OEM style
• Superior pulse repeatability
• Simple parallel operation for higher power
• Optional Active PFC (pf = 0.98)
• Full remote control interface
• High EMI-RFI immunity

• Advanced semiconductor technology
• High-quality construction
• Rapid capacitor and pulse-forming network charging
• Compact and lightweight design
• Simple parallel operation for higher power needs
• Compatible with worldwide input voltages and frequencies
• Fully adjustable output voltage
• Comprehensive remote control interface

• High-Speed Current Control: No dynamic overshoot or oscillation
• High Slew-Rate: Up to 30A/*s for fast load changes
• Low Voltage Operation: Stable operation with no turn-on delay
• Multi-Functional: Seven load modes and four operating modes
• Parallel Operation: Up to 10kW with 10 units
• User-Friendly Interface: Built-in USB and optional IEEE interfaces
• Compliance: EN61010-1 compliant with a two-year warranty

The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables the collection of accurate high-voltage and high-current measurement data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current), with complete operator safety.

• Vector Network Analyzer (option up to 26.5GHz)
• WinCal XE calibration software
• Uses best measurement practices for optimized measurements
• Known measurement accuracy traced back to independent standards
• Supported by the measurement experts to make you successful
• Best in class RF performance
• Small benchtop footprint
• Industry standard calibration techniques
• Extended 2 Year warranty on FormFactor products for educational customers

• Re-configurable for DC, RF, mmW, FA, WLR and more
• table and repeatable measurements over a wide thermal range
• Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
• Minimize AC and spectral noise
• Manual 3-axis stage with ergonomic controls
• Fast, accurate “hands on” wafer positioning
• Quick, safe, and comfortable wafer access

• Comfortable and ergonomic operation
• Thermal range ambient to +300°C
• RF/microwave device characterization, FA and design debug
• Seamless integration between Velox and analyzers/measurement software
• Complete solutions using probe positioners and probe cards
• Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
• Shortest signal path test integration for accurate, thermally stable, and low-error data collection
• Powerful automation tools, reduce total test time on wafers, singulated dies, and modules
• Faster time to first data for standard and “hard to test” devices such as thin wafer, small pad and high power
• Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact