Products

Featuring an ultra-compact 0.35”microLED display with high-brightnessand high-resolution technology,delivering dynamic visuals and seamlessintegration for next-generationautomotive heads-up display (HUD).

Key Features of High Brightness High Resolution 0.35″ Micro-Display:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Power-Efficient Design: Consumes significantly less powercompared to traditional display technologies, extendingbattery life for wearable devices.

Showcasing a large 10” panel withultra-bright, energy-efficientmicroLED technology, deliveringdynamic visuals and seamlessintegration for next-generationintelligent vehicles.

Ket Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Vibrant RGB Color Reproduction: Delivers rich, high-contrast visuals with precise color accuracy, enhancingvisuals for display applications.

Advancing automotive displayswith ultra-bright, energy-efficientmicroLED technology, enablingdynamic visuals and seamlessintegration for next-generationintelligent vehicles.

Key Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Vibrant RGB Color Reproduction: Delivers rich, high-contrast visuals with precise color accuracy, enhancingvisuals for display applications.

Revolutionizing automotivelighting with ultra-bright, energy-efficient microLED displays,enabling adaptive illuminationand seamless integration for next-generation intelligent vehicles.

Key Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Segment-Driven Intelligence: Enables optimal messagingthrough precisely controlled lighting segments, enhancingintelligent lighting capabilities for smart automotiveapplications and other high-performance devices.

Transforming automotive lightingwith ultra-bright, energy-efficientmicroLED displays, deliveringprecision illumination andseamless integration for next-generation vehicles.

Key Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellentvisibility in both indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Power-Efficient Design: Consumes significantly lesspower compared to traditional display technologies.

The DCP-X probe is designed for engineers and scientists in device characterization, R&D, and testing, offering highly accurate and repeatable on-wafer electrical measurements (IV, CV, LFN). It uses MEMS technology to measure advanced devices (2, 3, 5 nm) on various pad materials, micro-bumps, and pads as small as 20 μm, reducing the need for retesting and cleaning while covering the full thermal range at lower testing costs. Compared to traditional probes, the DCP-X provides 1000x lower contact resistance, minimal skate, and over 500,000 contact cycles, ensuring precise measurements and longer probe life.

The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables the collection of accurate high-voltage and high-current measurement data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current), with complete operator safety.

• Highly Damped Step Respond
• Simple installation – No tuning require
• Application-specific designs/products/
• Capabilities to meet your needs
• Ability to support massive machines, tools, systems

• 6 degrees of freedom
• Active gain starting from 0.5Hz
• Variable Damping (patent pending)
• Build In Artificial Intelligence Feature
• Adjustable by software active bandwidth
• Remote control
• Built in real time diagnostic tools
  • Spectrum analyzer
  • Oscilloscope
• Shaker Mode

• 6 degrees of freedom
• Active gain starting from 0.5Hz
• Variable Damping (patent pending)
• Build In Artificial Intelligence Feature
• Adjustable by software active bandwidth
• Remote control
• Built in real time diagnostic tools
  • Spectrum analyzer
  • Oscilloscope
• Shaker Mode

• Highly Damped Step Respond
• Simple installation – No tuning require
• Application-specific designs/products/
• Capabilities to meet your needs
• Ability to support massive machines, tools, systems

• Vector Network Analyzer (option up to 26.5GHz)
• WinCal XE calibration software
• Uses best measurement practices for optimized measurements
• Known measurement accuracy traced back to independent standards
• Supported by the measurement experts to make you successful
• Best in class RF performance
• Small benchtop footprint
• Industry standard calibration techniques
• Extended 2 Year warranty on FormFactor products for educational customers

• Re-configurable for DC, RF, mmW, FA, WLR and more
• table and repeatable measurements over a wide thermal range
• Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
• Minimize AC and spectral noise
• Manual 3-axis stage with ergonomic controls
• Fast, accurate “hands on” wafer positioning
• Quick, safe, and comfortable wafer access

• Comfortable and ergonomic operation
• Thermal range ambient to +300°C
• RF/microwave device characterization, FA and design debug
• Seamless integration between Velox and analyzers/measurement software
• Complete solutions using probe positioners and probe cards
• Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
• Shortest signal path test integration for accurate, thermally stable, and low-error data collection
• Powerful automation tools, reduce total test time on wafers, singulated dies, and modules
• Faster time to first data for standard and “hard to test” devices such as thin wafer, small pad and high power
• Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact

Genius Education Kits Overview

• Probe station
• Keysight Streamline Vector Network Analyzer (option up to 53 GHz)
• Choice of probes
• WinCal XE calibration software
• Extended 2 Year warranty on FormFactor products for educational customers
• Optional laptop

• Flexibility
  • Temperatures range from -60°C to +300°C
  • Surfaces are nickel or gold-plated
  • Hybrid chuck design – operation with and without cooling unit
  • Field-upgradeable: On-site cold upgrades for all main prober platforms
• Highest Efficiency for Reduced Cost of Test
  • Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
  • Up to 15% faster transition times than other systems on the market
• Low Thermal Resistance
  • Low Thermal Resistance Technology
  • MultiSense with multiple temperature sensors
  • Best temperature accuracy and uniformity
• Superior Electrical Performance
  • Isolated from ground
  • Includes a jack for grounding and biasing
  • Highly planar chuck surface for consistant contact force and overtravel