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  • The DCP-X probe is designed for engineers and scientists in device characterization, R&D, and testing, offering highly accurate and repeatable on-wafer electrical measurements (IV, CV, LFN). It uses MEMS technology to measure advanced devices (2, 3, 5 nm) on various pad materials, micro-bumps, and pads as small as 20 μm, reducing the need for retesting and cleaning while covering the full thermal range at lower testing costs. Compared to traditional probes, the DCP-X provides 1000x lower contact resistance, minimal skate, and over 500,000 contact cycles, ensuring precise measurements and longer probe life.

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    • Reliable and Repeatable solid state signal generation
    • Standard Internal/external pulse modulation
    • USB/Ethernet Control
    • 10 MHz external or internal reference
    • 100 Hz Frequency Resolution
    • Easily portable
    • Sized to fit into a single rack unit for ATE applications

     

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    • Reliable and Repeatable solid state digital attenuation
    • Includes GUI, Windows and Linux SDK, LabVIEW driver
    • Programmable attenuation ramp and fading profiles
    • Operate multiple devices directly from a PC or self-powered hub
    • Easily portable USB powered device
    • USB and Ethernet control interfaces

     

  • The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables the collection of accurate high-voltage and high-current measurement data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current), with complete operator safety.

    • Customizable & savable test setups
    • Program & Datalog Storage
    • User Defined Temperature Limits
    • Local & Remote Operations
    • LabView™ drivers
    • IEEE-488, RS232 ports

     

     

    • 20 Amp Operation: Full performance with 20 amp service
    • Automatic Power Reduction: Reduces power usage during idle periods
    • Heat Only Mode: Reduces power usage when cold temperatures are not used
    • WhisperStream Technology: quieter, smooth-sounding operation, 56 dBA
    • Frost Free Test Environment: dry air purge for tester interface, prevents condensation:
      0.5 to 3scfm (0.25 to 1.5 l/s)
    • Heated Defrost: quickly removes moisture buildup from internal chiller
    • DUT Temperature Control : Proprietary control algorithm enables DUT temperature to be directly controlled
    • Transition Rate*
      -55 to +125°C, approx. 10 seconds
      125 to -55°C, approx. 10 seconds
    • System Airflow Output*
      4 to 18scfm (1.9 to 8.5 l/s) Continuous
    • Temperature Range*
      -80 to +225°C (60Hz) No LN2 or LCO2 Required

     

    • High reliability thermal cycling without thermoelectric modules
    • Temperature range: -65 to 175°C
    • Cooling power:
      • 40W at -40°C for lower power devices
      • 55W at -55°C and 120W at -40°C.
    • Transition rate: up to <35 sec over 25 to -40°C
    • Easy and secure thermal connection to in-circuit or test socked DUT
    • Touch-screen controller: user-programmable temperatures, graphing, data logging
    • Communications options: Ethernet, USB, IEEE, RS232

     

  • -60° to +200°C

    • Economy model with high thermal capacity
    • Precise temperatures with fast transitions from -60 to 200°C
    • No annual leak testing required per EU 517/2014 F-Gas Regulation
    • Effective testing and conditioning of electronic components, boards, and modules
    • Available for 50 and 60Hz operation
    • No need for Liquid Nitrogen (LN2) or Liquid Carbon Dioxide (LCO2)
    • Remote communications and set up and touch screen operation
    • User Defined Temperature Limits

     

     

    • Vector Network Analyzer (option up to 26.5GHz)
    • WinCal XE calibration software
    • Uses best measurement practices for optimized measurements
    • Known measurement accuracy traced back to independent standards
    • Supported by the measurement experts to make you successful
    • Best in class RF performance
    • Small benchtop footprint
    • Industry standard calibration techniques
    • Extended 2 Year warranty on FormFactor products for educational customers

     

    • Re-configurable for DC, RF, mmW, FA, WLR and more
    • table and repeatable measurements over a wide thermal range
    • Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
    • Minimize AC and spectral noise
    • Manual 3-axis stage with ergonomic controls
    • Fast, accurate “hands on” wafer positioning
    • Quick, safe, and comfortable wafer access

     

    • Comfortable and ergonomic operation
    • Thermal range ambient to +300°C
    • RF/microwave device characterization, FA and design debug
    • Seamless integration between Velox and analyzers/measurement software
    • Complete solutions using probe positioners and probe cards
    • Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
    • Shortest signal path test integration for accurate, thermally stable, and low-error data collection
    • Powerful automation tools, reduce total test time on wafers, singulated dies, and modules
    • Faster time to first data for standard and “hard to test” devices such as thin wafer, small pad and high power
    • Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact

     

  • Genius Education Kits Overview

     

    • Flexibility
      • Temperatures range from -60°C to +300°C
      • Surfaces are nickel or gold-plated
      • Hybrid chuck design – operation with and without cooling unit
      • Field-upgradeable: On-site cold upgrades for all main prober platforms
    • Highest Efficiency for Reduced Cost of Test
      • Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
      • Up to 15% faster transition times than other systems on the market
    • Low Thermal Resistance
      • Low Thermal Resistance Technology
      • MultiSense with multiple temperature sensors
      • Best temperature accuracy and uniformity
    • Superior Electrical Performance
      • Isolated from ground
      • Includes a jack for grounding and biasing
      • Highly planar chuck surface for consistant contact force and overtravel

     

  • PureLine 3 Technology

    First automated probe station to achieve -190dB spectral noise*

    Plug In and Go

    Integrated TestCell Power Management provides fully managed and filtered AC power to the entire system, prober and instruments

    Autonomous 24/7 Operation

    Up to 4x faster flicker noise thermal testing on 30 μm pads

    Reduce Setup Time and Costs
    Exclusive low noise site survey, and system verification services

     

    • Quick and easy probe tip navigation
    • Maximizes field-of-view
    • High magnification
    • Shadow-free view of the corresponding features
    • Automatically configure and optimize performance
    • cTUVus certified and CE
    • Compatible with TopHat for perfect shielding
    • 24/7 operating, Increased MTBF
    • Stops all system motion and warns of unobserved contact

     

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    Contact Intelligence

    • Ease of use –  Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
    • Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
    • Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.