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  • The DCP-X probe is designed for engineers and scientists in device characterization, R&D, and testing, offering highly accurate and repeatable on-wafer electrical measurements (IV, CV, LFN). It uses MEMS technology to measure advanced devices (2, 3, 5 nm) on various pad materials, micro-bumps, and pads as small as 20 μm, reducing the need for retesting and cleaning while covering the full thermal range at lower testing costs. Compared to traditional probes, the DCP-X provides 1000x lower contact resistance, minimal skate, and over 500,000 contact cycles, ensuring precise measurements and longer probe life.

    • High Power: Ranging from  750W to 15kW.
    • User-Friendly: Easy connections via LAN (LXI 1.5), USB (2.0), RS-232/RS-485.
    • Safe & Certified: CE/UKCA marked with built-in safety.
    • Versatile: Ideal for various industries.
    • Warranty: 5 years.

     

    • Optional Interfaces: IEEE, EtherCAT, Modbus-TCP, Isolated Analog 4-20mA (IS420)
    • Output Power Levels: 1kW to 15kW, low-noise performance
    • Output Voltage/Current: Up to 1500V and 1500A
    • AC Input Options: Single-phase and three-phase with Active Power Factor Correction
    • Mechanical Options: Blank Front Panel, Air Filter Kits, Parallel Kits
    • Certifications: CE/UKCA Marked, UL/cUL/IEC/EN 61010-1
    • Warranty: 5 years

     

    • High power density, lightweight, and portable
    • Output power: 30kW, 45kW, 60kW; Output voltages: 10V to 600V
    • Advanced features: Programmable V/I Slew-Rate, Constant-Power Limit, Arbitrary Waveform Generator
    • Built-in interfaces: LAN (LXI 1.5), USB (2.0), RS-232/RS-485, Isolated Analog (5V/10V)
    • Optional interfaces: IEEE, EtherCAT, Modbus-TCP, Isolated Analog 4-20mA
    • CE and UKCA marked, worldwide safety approvals, 5-year warranty

     

     

    • Compact, air-cooled OEM style
    • Superior pulse repeatability
    • Simple parallel operation for higher power
    • Optional Active PFC (pf = 0.98)
    • Full remote control interface
    • High EMI-RFI immunity

     

    • Advanced semiconductor technology
    • High-quality construction
    • Rapid capacitor and pulse-forming network charging
    • Compact and lightweight design
    • Simple parallel operation for higher power needs
    • Compatible with worldwide input voltages and frequencies
    • Fully adjustable output voltage
    • Comprehensive remote control interface

     

  • High-Speed Current Control: No dynamic overshoot or oscillation
    High Slew-Rate: Up to 30A/*s for fast load changes
    Low Voltage Operation: Stable operation with no turn-on delay
    Multi-Functional: Seven load modes and four operating modes
    Parallel Operation: Up to 10kW with 10 units
    User-Friendly Interface: Built-in USB and optional IEEE interfaces
    Compliance: EN61010-1 compliant with a two-year warranty

  • The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables the collection of accurate high-voltage and high-current measurement data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current), with complete operator safety.

    • Vector Network Analyzer (option up to 26.5GHz)
    • WinCal XE calibration software
    • Uses best measurement practices for optimized measurements
    • Known measurement accuracy traced back to independent standards
    • Supported by the measurement experts to make you successful
    • Best in class RF performance
    • Small benchtop footprint
    • Industry standard calibration techniques
    • Extended 2 Year warranty on FormFactor products for educational customers

     

    • Re-configurable for DC, RF, mmW, FA, WLR and more
    • table and repeatable measurements over a wide thermal range
    • Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
    • Minimize AC and spectral noise
    • Manual 3-axis stage with ergonomic controls
    • Fast, accurate “hands on” wafer positioning
    • Quick, safe, and comfortable wafer access

     

    • Comfortable and ergonomic operation
    • Thermal range ambient to +300°C
    • RF/microwave device characterization, FA and design debug
    • Seamless integration between Velox and analyzers/measurement software
    • Complete solutions using probe positioners and probe cards
    • Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
    • Shortest signal path test integration for accurate, thermally stable, and low-error data collection
    • Powerful automation tools, reduce total test time on wafers, singulated dies, and modules
    • Faster time to first data for standard and “hard to test” devices such as thin wafer, small pad and high power
    • Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact

     

  • Genius Education Kits Overview

     

    • Flexibility
      • Temperatures range from -60°C to +300°C
      • Surfaces are nickel or gold-plated
      • Hybrid chuck design – operation with and without cooling unit
      • Field-upgradeable: On-site cold upgrades for all main prober platforms
    • Highest Efficiency for Reduced Cost of Test
      • Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
      • Up to 15% faster transition times than other systems on the market
    • Low Thermal Resistance
      • Low Thermal Resistance Technology
      • MultiSense with multiple temperature sensors
      • Best temperature accuracy and uniformity
    • Superior Electrical Performance
      • Isolated from ground
      • Includes a jack for grounding and biasing
      • Highly planar chuck surface for consistant contact force and overtravel

     

  • PureLine 3 Technology

    First automated probe station to achieve -190dB spectral noise*

    Plug In and Go

    Integrated TestCell Power Management provides fully managed and filtered AC power to the entire system, prober and instruments

    Autonomous 24/7 Operation

    Up to 4x faster flicker noise thermal testing on 30 μm pads

    Reduce Setup Time and Costs
    Exclusive low noise site survey, and system verification services

     

    • Quick and easy probe tip navigation
    • Maximizes field-of-view
    • High magnification
    • Shadow-free view of the corresponding features
    • Automatically configure and optimize performance
    • cTUVus certified and CE
    • Compatible with TopHat for perfect shielding
    • 24/7 operating, Increased MTBF
    • Stops all system motion and warns of unobserved contact

     

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    Contact Intelligence

    • Ease of use –  Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
    • Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
    • Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.