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  • Cascade Autonomous DC delivers fully automated DC wafer probing with unmatched precision and efficiency powered by Contact Intelligence™.

    Key Features:

    • Autonomous DC wafer probing with hands-free 24/7 operation
    • Contact Intelligence™ technology for dynamic probe correction and reliable pad placement
    • High throughput with up to 4x faster flicker noise thermal testing on pads as small as 30 µm
    • Unattended operation for overnight or weekend testing without user intervention
    • Automatic probe alignment compensating for thermal drift to reduce soak time
    • Flexible probe layouts supporting single DUT and multi-DUT configurations
    • Ease of use – start testing with just one button, ideal for operators at all levels

     

  • Cascade Autonomous RF delivers fully automated RF and mm-wave wafer probing with Contact Intelligence™ for unmatched accuracy and efficiency.

    Key Features:

    • Autonomous RF wafer probing with hands-free 24/7 operation
    • Contact Intelligence™ for on-the-fly probe correction and pad placement
    • Automatic calibration up to 500 GHz with WinCal XE software
    • Calibration drift monitoring with auto re-calibration when needed
    • Reduced soak time through dynamic probe re-alignment across temperatures
    • Unattended operation for continuous overnight and weekend testing
    • Supports 200 mm and 300 mm probe stations including CM300xi, SUMMIT200, Summit 12000, and Elite 300
    • Simplified one-button operation, suitable for operators at all levels

     

  • Cascade Autonomous RF delivers fully automated RF and mm-wave wafer probing with Contact Intelligence™ for unmatched accuracy and efficiency.

    Key Features:

    • Autonomous RF wafer probing with hands-free 24/7 operation
    • Contact Intelligence™ for on-the-fly probe correction and pad placement
    • Automatic calibration up to 500 GHz with WinCal XE software
    • Calibration drift monitoring with auto re-calibration when needed
    • Reduced soak time through dynamic probe re-alignment across temperatures
    • Unattended operation for continuous overnight and weekend testing
    • Supports 200 mm and 300 mm probe stations including CM300xi, SUMMIT200, Summit 12000, and Elite 300
    • Simplified one-button operation, suitable for operators at all levels

     

  • Cascade Autonomous Silicon Photonics delivers fully automated wafer and die-level photonics probing with Contact Intelligence™ for unmatched accuracy.

    Key Features:

    • Flexible vertical and edge coupling with single fibers or fiber arrays
    • OptoVue™ technology for real-time in-situ calibrations
    • Exclusive TopHat environment for dark, frost-free thermal testing (-40°C to +125°C)
    • Sub-micron placement accuracy with Z displacement sensing
    • Collision avoidance technology for safe fiber alignment
    • SiPh-Tools software for automated alignment, calibration, and data management
    • Partnership with Keysight and PI for seamless instrumentation and precision positioning
    • Available on CM300xi-SiPh and SUMMIT200 probe stations

     

  • Cascade CM300xi – 300 mm Semi-/Fully-Automated Probe System

    Key Features:

    • Supports DC, AC, RF/microwave, WLR, FA, and design debug applications
    • Wide thermal range from -60°C to +300°C with IceShield or TopHat compatibility
    • Reliable, repeatable probe contact in a moisture-free, EMI-shielded environment
    • Contact Intelligence™ technology for autonomous alignment and accurate measurements
    • Modular design with upgrade paths for semi- or fully-automated configurations
    • Handles up to 50 wafers with SEMI-standard cassette automation
    • Fast transition times with MicroVac™ and FemtoGuard™ low-noise technologies
    • Intuitive Velox software and Velox Dash™ touchscreen interface for simplified operation

     

  • Engineered for precision and safety, the EPS150TESLA delivers accurate on-wafer power device characterization up to 3,000 V and 100 A, making it a trusted choice for high-voltage and high-current testing.

    Key Features:

    • On-wafer power device characterization up to 3,000 V (triaxial) / 10,000 V (optional coaxial).
    • High-current probing up to 100 A with ultra-low contact resistance.
    • Triax chuck design for accurate low-leakage measurements.
    • Shielded test environment with advanced grounding and arcing protection.
    • Seamless integration with analyzers via SIGMA kit and optimized signal path.
    • Safe probe tip exchange and thin-wafer handling capability.

     

  • Cascade EPS200MMW mmW and THz Probe System

    Key Features:

    • Complete mmW, THz, and load-pull measurement solution.
    • Accurate probing up to 500 GHz with T-Wave Probes and VDI Extenders.
    • SlimVue Microscope with 1 μm resolution and quick lens exchange.
    • Resolves pads smaller than 50 μm with precision optics.
    • Sigma Application Kits for broadband, load-pull, coax RF, and waveguide setups.
    • Rock-solid mechanical design with submicron stage accuracy.
    • Motorized positioner with ±1 μm separation repeatability.
    • Stable and repeatable probe placement for THz frequencies.

     

  • Cascade EPS200RF 200 mm Manual Probe System

    Key Features:

    • Complete RF measurement package up to 67 GHz.
    • Based on the PM8 platform for stability and flexibility.
    • Supports Infinity, ACP, and |Z| probe technologies for different material types.
    • High precision probing with RF chuck ±3 μm planarity.
    • 500 μm platen stroke with ≤±1 μm accuracy for repeatable contact.
    • Reliable probing for pads as small as 25 µm x 35 µm.
    • Includes matching cables, substrates, and WinCal XE calibration software.
    • Delivers accurate S-parameter measurements with automated calibration.

     

  • Key Features:

    • 150 mm modular probe station with customizable base and starter kits.
    • Flexible options for IV/CV, RF, mmWave, THz, high power, and failure analysis.
    • Solid frame with built-in vibration isolation for measurement stability.
    • Supports advanced microscopes, triax, coax, and RF chucks.
    • Seamless integration with leading measurement instruments.
    • Ergonomic design with quick pull-out stage for fast device handling.
    • Re-configurable and upgradable to grow with future testing needs.

     

  • Cascade MPS150-SiPh Manual Silicon Photonics Probe Station

    Key Features:

    • Cost-effective entry-level photonics probe station.
    • Supports surface coupling and horizontal edge coupling.
    • Retro-mirror technology for precise fiber alignment.
    • Tip-tilt base positioner with 6 degrees of freedom.
    • Compatible with single fibers and fiber arrays.
    • Optional eVue digital imaging or SlimVue high-performance microscope.
    • Modular, upgradable design with platen extensions.
    • Ergonomic and intuitive for users of all experience levels.

     

  • Cascade PAV200 – 200 mm Semi-Automated Vacuum Probe System

    Key Features:

    • Supports wafers and substrates up to 200 mm (optional upgrade to 300 mm)
    • Operates in high vacuum down to < 1×10⁻⁴ mbar
    • Semi-automated control with joystick and software-driven chuck movement
    • Up to eight probe positioners and/or probe card integration
    • Optional thermal chuck with -60°C to 300°C range
    • Solid frame with vibration isolation for stable, accurate measurements
    • Wide application support: DC, RF, MEMS, and optoelectronics
    • Velox software for wafer alignment, mapping, and simplified automation

     

  • The Cascade PLC50 is a precise, cost-effective cryogenic wafer probing system designed for research labs. It enables testing down to 77 K with liquid nitrogen or below 7 K with liquid helium, supporting DC, RF, MEMS, and optoelectronic measurements.

    Key Features:

    • Compatible with wafers up to 100 mm and single dies.
    • Operates at 77 K (LN₂) or < 7 K (LHe).
    • Up to six positioners for flexible probing.
    • Independently cooled cold shield ensures stable, accurate results.
    • Ice- and condensation-free probing in vacuum conditions.
    • Ergonomic design with hinged lid and easy microscope access.
    • Independent chuck stage and positioner control for high throughput.

     

  • Cascade PM8 200 mm Manual Probe System

    Key Features:

    • Stable granite base for vibration-free measurements.
    • Submicron precision with 1 µm repeatable separation stroke.
    • Configurable for DC, RF, mmW, sub-THz, FA, MEMS, and opto-engineering.
    • 40 mm platen height adjustability for flexible setups.
    • Supports thermal chucks, motorized microscopes, and dark box options.
    • Double-side probing for frontside and backside device access.
    • Ergonomic and low-profile design for easy wafer handling.
    • Upgradeable platform with accessories for future needs.

     

  • Cascade PMC200 Cryogenic Probe Station – advanced manual solution for wafer probing down to cryogenic levels with unmatched flexibility and accuracy.

    Key Features:

    • 200 mm cryogenic manual probe station with probes inside chamber
    • Supports wafers up to 200 mm or single dies
    • Probe cards and up to eight positioners for advanced measurements
    • Operates with liquid nitrogen (77 K) or helium (< 7 K)
    • Optional microscope bridge and 300 mm wafer upgrade
    • Front-loading capability for fast and ergonomic device changes
    • Independently cooled cold shield for stable cryogenic performance
    • Precise probe positioning with vibration-isolated frame
    • Covers DC, RF, MEMS, OPTO, and superconducting device tests

     

  • A high-precision vacuum probe station engineered for advanced wafer and substrate testing up to 200 mm in demanding laboratory and industrial environments.

    Key Features:

    • Supports wafers and substrates up to 200 mm or single dies
    • Up to eight positioners and probe card compatibility
    • Optional thermal chuck (-60°C to 300°C) with pressure regulation
    • Accessories available: black bodies and optical motion analysis tools
    • Upgradeable to 300 mm wafer capability
    • Built-in vibration isolation for precise, stable measurements
    • Ideal for DC, RF, MEMS, and optoelectronic testing
    • Ergonomic manual drives with front-loading capability
    • High throughput with software-controlled chuck for fast step-and-repeat

     

  • Cascade Summit 200 mm Manual Probe System

    Key Features:

    • High-precision manual on-wafer device and process characterization.
    • Wide thermal range from -60°C to +300°C.
    • Moisture-free, light-tight, EMI-shielded test environment with MicroChamber®.
    • PureLine™ and AttoGuard® technologies for low-noise performance.
    • Configurable for DC, RF, mmW, WLR, and FA applications.
    • Locking roll-out stage for safe wafer access.
    • Ergonomic 3-axis manual stage with intuitive controls.
    • Dedicated Velox software with Augmented Align for accurate RF probing.