Cascade PAP200 Probe Station

Cascade PAP200 Probe Station

Key Features:

  • Supports wafers and substrates up to 200 mm
  • Operates in high vacuum down to <1×10⁻⁵ mbar or overpressure up to 4.0 bar
  • Flexible setup with probe cards or up to eight positioners
  • Optional thermal chuck from -60°C to +300°C with pressure regulation
  • Accessories include IR black bodies and optical motion analysis tools
  • Upgrade path to 300 mm wafers
  • Solid station frame with built-in vibration isolation for stable measurements
  • Ergonomic front-side loading with joystick control
  • Velox software for efficient wafer alignment and step-and-repeat automation
  • Ideal for MEMS, DC, RF, C-V, and optoelectronic testing

 

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SKU: Cascade_PAP200_Probe_Station Category:



Description

The Cascade PAP200 vacuum and pressure probe station is a semi-automated solution designed for advanced wafer characterization in demanding research and industrial environments. Supporting wafers and substrates up to 200 mm, it operates in both ultra-high vacuum conditions (<1×10⁻⁵ mbar) and overpressure environments up to 4.0 bar (abs.), making it exceptionally versatile for a wide range of electrical and optoelectronic measurements.

Engineered with a solid station frame and built-in vibration isolation, the PAP200 ensures high stability, accuracy, and repeatability for precision measurements. Probe positioners are placed inside the chamber, minimizing probe arm length and improving stability, making the system well-suited for testing delicate MEMS structures and small geometries.

The station offers extensive flexibility with compatibility for probe cards, up to eight positioners, and various substrate carriers. Users can expand capabilities with an optional thermal chuck (-60°C to +300°C) and a suite of accessories such as IR black bodies and optical analysis tools. For evolving research demands, the PAP200 also provides an upgrade path to 300 mm wafer testing.

Ease of use is built into the design with front-side loading, a joystick controller, and manual rotary feed-throughs, allowing fast and ergonomic device changes. Combined with Velox control software, the PAP200 enables automated step-and-repeat wafer testing, advanced alignment, and simplified workflows, reducing training time while boosting throughput.

Whether for MEMS testing, RF measurements, or optoelectronic analysis, the Cascade PAP200 offers unmatched performance, stability, and adaptability, making it a trusted solution for labs and industries requiring precise probing under vacuum or pressure conditions.

Technical Highlights – Cascade PAP200

Specification Detail
Wafer Size Up to 200 mm (optional upgrade to 300 mm)
Environment Range Vacuum <1×10⁻⁵ mbar or overpressure up to 4.0 bar (abs.)
Probe Configuration Up to 8 positioners and/or probe card
Thermal Range -60°C to +300°C (optional chuck)
Accessories IR black bodies, optical motion analysis tools
Stability Solid station frame with built-in vibration isolation
Probe Positioning Inside chamber with short stable probe arms
Loading Ergonomic front-side loading with joystick control
Software Velox control software, VeloxPro automation option
Applications MEMS, DC, RF, C-V, and optoelectronic testing

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