P9082D RF AWG

High-Precision Current Measurement with BNC Connectivity

• Precision Current Sensing: ±1% accuracy ensures reliable real-time current monitoring.
• BNC Connector for Seamless Connectivity: Works with oscilloscopes, ADCs, spectrum analyzers, and power analyzers.
• Clamp-On Design for Non-Intrusive Measurement: Safely monitor live current flow without circuit disruption.
• 50 Ohm Termination Compatible: Output reduces by half when using a 50Ω termination.
• High-Voltage Safety Considerations: Conductive case requires adequate insulation for user safety.

Engineered for precision and safety, the EPS150TESLA delivers accurate on-wafer power device characterization up to 3,000 V and 100 A, making it a trusted choice for high-voltage and high-current testing.

Key Features:

• On-wafer power device characterization up to 3,000 V (triaxial) / 10,000 V (optional coaxial).
• High-current probing up to 100 A with ultra-low contact resistance.
• Triax chuck design for accurate low-leakage measurements.
• Shielded test environment with advanced grounding and arcing protection.
• Seamless integration with analyzers via SIGMA kit and optimized signal path.
• Safe probe tip exchange and thin-wafer handling capability.

The TESLA200 is a semi- or fully-automated 200 mm on-wafer probing solution designed for advanced power semiconductor testing.

Key Features:

• On-wafer device testing up to 10,000 V DC and 600 A.
• Supports IGBT, GaN, SiC, and Si devices.
• Advanced MicroVac™ and FemtoGuard™ technologies for low-noise, accurate measurements.
• Wide thermal range from -55°C to +300°C.
• Safety-certified interlock system with ergonomic clear enclosure.
• Compatible with T.I.P.S. “LuPo” High Voltage / High Power Probe Cards.
• Fully automated wafer handling, including thinned/warped wafers.
• Field-upgradeable to scale with growing test requirements.

Transforming automotive lightingwith ultra-bright, energy-efficientmicroLED displays, deliveringprecision illumination andseamless integration for next-generation vehicles.

Key Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellentvisibility in both indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Power-Efficient Design: Consumes significantly lesspower compared to traditional display technologies.