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The DCP-X probe is designed for engineers and scientists in device characterization, R&D, and testing, offering highly accurate and repeatable on-wafer electrical measurements (IV, CV, LFN). It uses MEMS technology to measure advanced devices (2, 3, 5 nm) on various pad materials, micro-bumps, and pads as small as 20 μm, reducing the need for retesting and cleaning while covering the full thermal range at lower testing costs. Compared to traditional probes, the DCP-X provides 1000x lower contact resistance, minimal skate, and over 500,000 contact cycles, ensuring precise measurements and longer probe life.

• Compact, air-cooled OEM style
• Superior pulse repeatability
• Simple parallel operation for higher power
• Optional Active PFC (pf = 0.98)
• Full remote control interface
• High EMI-RFI immunity

• Advanced semiconductor technology
• High-quality construction
• Rapid capacitor and pulse-forming network charging
• Compact and lightweight design
• Simple parallel operation for higher power needs
• Compatible with worldwide input voltages and frequencies
• Fully adjustable output voltage
• Comprehensive remote control interface

• High-Speed Current Control: No dynamic overshoot or oscillation
• High Slew-Rate: Up to 30A/*s for fast load changes
• Low Voltage Operation: Stable operation with no turn-on delay
• Multi-Functional: Seven load modes and four operating modes
• Parallel Operation: Up to 10kW with 10 units
• User-Friendly Interface: Built-in USB and optional IEEE interfaces
• Compliance: EN61010-1 compliant with a two-year warranty

• 20 Amp Operation: Full performance with 20 amp service
• Automatic Power Reduction: Reduces power usage during idle periods
• Heat Only Mode: Reduces power usage when cold temperatures are not used
• WhisperStream Technology: quieter, smooth-sounding operation, 56 dBA
• Frost Free Test Environment: dry air purge for tester interface, prevents condensation:
  0.5 to 3scfm (0.25 to 1.5 l/s)
• Heated Defrost: quickly removes moisture buildup from internal chiller
• DUT Temperature Control : Proprietary control algorithm enables DUT temperature to be directly controlled
• Transition Rate*
  -55 to +125°C, approx. 10 seconds
  125 to -55°C, approx. 10 seconds
• System Airflow Output*
  4 to 18scfm (1.9 to 8.5 l/s) Continuous
• Temperature Range*
  -80 to +225°C (60Hz) No LN2 or LCO2 Required

• High reliability thermal cycling without thermoelectric modules
• Temperature range: -65 to 175°C
• Cooling power:
  • 40W at -40°C for lower power devices
  • 55W at -55°C and 120W at -40°C.
• Transition rate: up to <35 sec over 25 to -40°C
• Easy and secure thermal connection to in-circuit or test socked DUT
• Touch-screen controller: user-programmable temperatures, graphing, data logging
• Communications options: Ethernet, USB, IEEE, RS232

-60° to +200°C

• Economy model with high thermal capacity
• Precise temperatures with fast transitions from -60 to 200°C
• No annual leak testing required per EU 517/2014 F-Gas Regulation
• Effective testing and conditioning of electronic components, boards, and modules
• Available for 50 and 60Hz operation
• No need for Liquid Nitrogen (LN2) or Liquid Carbon Dioxide (LCO2)
• Remote communications and set up and touch screen operation
• User Defined Temperature Limits

• Vector Network Analyzer (option up to 26.5GHz)
• WinCal XE calibration software
• Uses best measurement practices for optimized measurements
• Known measurement accuracy traced back to independent standards
• Supported by the measurement experts to make you successful
• Best in class RF performance
• Small benchtop footprint
• Industry standard calibration techniques
• Extended 2 Year warranty on FormFactor products for educational customers

Genius Education Kits Overview

• Probe station
• Keysight Streamline Vector Network Analyzer (option up to 53 GHz)
• Choice of probes
• WinCal XE calibration software
• Extended 2 Year warranty on FormFactor products for educational customers
• Optional laptop

• Flexibility
  • Temperatures range from -60°C to +300°C
  • Surfaces are nickel or gold-plated
  • Hybrid chuck design – operation with and without cooling unit
  • Field-upgradeable: On-site cold upgrades for all main prober platforms
• Highest Efficiency for Reduced Cost of Test
  • Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
  • Up to 15% faster transition times than other systems on the market
• Low Thermal Resistance
  • Low Thermal Resistance Technology
  • MultiSense with multiple temperature sensors
  • Best temperature accuracy and uniformity
• Superior Electrical Performance
  • Isolated from ground
  • Includes a jack for grounding and biasing
  • Highly planar chuck surface for consistant contact force and overtravel

PureLine 3 Technology

First automated probe station to achieve -190dB spectral noise*

Plug In and Go

Integrated TestCell Power Management provides fully managed and filtered AC power to the entire system, prober and instruments

Autonomous 24/7 Operation

Up to 4x faster flicker noise thermal testing on 30 μm pads

Reduce Setup Time and Costs
Exclusive low noise site survey, and system verification services

• Quick and easy probe tip navigation
• Maximizes field-of-view
• High magnification
• Shadow-free view of the corresponding features
• Automatically configure and optimize performance
• cTUVus certified and CE
• Compatible with TopHat for perfect shielding
• 24/7 operating, Increased MTBF
• Stops all system motion and warns of unobserved contact

Contact Intelligence

• Ease of use –  Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
• Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
• Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.

• Highest accuracy with backlash-free positioning
• Drift-free measurements over temperature and time*
• Easy, and safe swapping between arms
• Best signal integrity using optimized probe cabling systems
• Full thermal capability*
• Manual or progammable

• Ease of use –  Less experienced operators can perform an RF calibration up to 330 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
• Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
• Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
• Calibration Monitor and Re-calibration – System will continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.

• Comprehensive,
• Turn-key Integrated Measurement System (IMS)
• with Keysight PNA for On-wafer R&D Measurements
• from RF to millimeter wave to Terahertz