17629-10-B1 9foot, 1875 watt 15A 125V power cord

The TT 1.0 PF Turn Table is a precision turntable designed for EMC and RF testing in anechoic and electromagnetic absorption chambers.

Key Features:

• Diameter: 1.0 m; height: 190 mm
• Load capacity up to 100 kg
• Free-standing design for chamber floor installation
• Adjustable rotation speed: 0.1–2.5 rpm
• Positioning accuracy: ±0.5°
• Rotating angle range: -200° to 400°
• Central 50 mm opening for power supply connections
• Controlled via LAN (TCP/IP) with FCU3.0 or NCD Controllers
• Durable PVC integral skin-foam cover plate
• Synchronous servo motor with toothed belt and worm gear drive

Key Features:

• Portable USB-C to JTAG controller with 40 I/O pins
• Supports up to 8 separate JTAG TAP chains with independent frequencies
• Compact and rugged aluminium casing for lab, production, or field use
• Configurable JTAG pin-out to suit any Unit Under Test (UUT)
• Electrical protection against –30 V to +30 V input
• Four programmable I/O voltages (1.2 V to 3.3 V, in 0.1 V steps)
• Built-in voltmeter and frequency counter on all pins
• High-speed operation with TCK up to 166 MHz
• USB bus-powered with locking Type-C connector
• Self-contained licence for maximum flexibility

A reliable optical link for automotive Ethernet signals, optimized for EMC testing with Broadcom BCM89811 chipset compatibility.

Key Features:

• Designed for 100Base-T1 automotive Ethernet applications
• Compatible with Broadcom BCM89811 PHY chipset
• Supports T1-to-T1 or T1-to-Tx with integrated media converter
• Equipped with Rosenberger HSD connectors and FSMA optical ports
• Shielded aluminum housing for EMI protection
• Battery powered with >10 hours runtime
• Complies with ISO 11452-2 and MIL-STD-461 standards
• Ideal for automotive, military, RF, and aerospace industries

The TESLA200 is a semi- or fully-automated 200 mm on-wafer probing solution designed for advanced power semiconductor testing.

Key Features:

• On-wafer device testing up to 10,000 V DC and 600 A.
• Supports IGBT, GaN, SiC, and Si devices.
• Advanced MicroVac™ and FemtoGuard™ technologies for low-noise, accurate measurements.
• Wide thermal range from -55°C to +300°C.
• Safety-certified interlock system with ergonomic clear enclosure.
• Compatible with T.I.P.S. “LuPo” High Voltage / High Power Probe Cards.
• Fully automated wafer handling, including thinned/warped wafers.
• Field-upgradeable to scale with growing test requirements.