Description
Cascade MPS150 Modular Probe Station for Precision Testing
The Cascade MPS150 Modular Probe Station is a powerful, customizable solution for accurate on-wafer characterization and device testing. Built on a 150 mm manual open platform, it delivers precision, flexibility, and long-term value for engineers working in semiconductor, RF, mmWave, THz, high-power, and failure analysis applications.
Flexible and Future-Ready
Designed with a modular architecture, the MPS150 allows you to configure a station that matches your exact requirements today while leaving room for tomorrow’s advancements. Start with a base station and add application-specific starter kits for IV/CV characterization, RF testing, mmWave and THz probing, load-pull measurements, failure analysis, or high-power applications. This adaptability ensures you invest in a platform that grows with your testing needs.
Stability for Accurate Measurements
The MPS150 is built on a rigid, compact frame with integrated vibration isolation, delivering superior stability during sensitive measurements. Its solid microscope bridge and robust chuck stage guarantee high repeatability, while precision positioners with micron-level accuracy allow contact on the smallest test structures. With planarity adjustments and advanced chuck options, the system ensures consistent contact force and low-noise performance, even under demanding conditions.
Ease of Use and Productivity
The ergonomic design of the MPS150 reduces operator training time and improves workflow efficiency. Its pull-out chuck stage makes device handling quick and convenient, while interchangeable microscopes and modular accessories minimize setup time. Whether performing low-noise triax measurements, RF probing up to 67 GHz, mmWave and THz applications, or high-power characterization up to 10 kV and 100 A, the MPS150 combines flexibility with user-friendly operation.
The result is a future-proof probe station that minimizes downtime, lowers testing costs, and accelerates time to data across multiple industries including semiconductors, aerospace, telecommunications, and advanced materials research.
Technical Specifications
| Feature | Details |
| Wafer Size Capacity | 150 mm |
| Base Station Options | Basic, Advanced (mmWave / THz / Load-pull) |
| Microscope Options | Stereo Zoom, High Resolution, SlimVue (mmW/THz) |
| Application Kits | IV/CV, RF Basic, mmW Basic, Advanced mmW/THz, Failure Analysis, High Power |
| Chuck Options | Coax, Triax, RF, Thermal, High Power |
| Positioners | Magnetic or vacuum; micron-level accuracy with precision ball bearings |
| Measurement Range | From low-noise fA/pA to high-power 10 kV / 100 A |
| Stability Features | Solid frame, rigid microscope bridge, integrated vibration isolation |
| Ease of Use | Pull-out chuck stage, ergonomic controls, quick DUT changeover |
| Upgradeability | Re-configurable and upgradable for future applications |
