FormFactor CM300xi 300 mm semi-/ fully-automated probe system

Introducing the FormFactor CM300xi 300 mm semi-/ fully-automated probe system

CM300xi Overview

Best-in-class measurement performance at a high level of automation in the lab*

The CM300xi probe station meets the measurement challenges brought on by extremely complex environments, such as unattended testing on small pads over time and at multiple temperatures. Best-in-class measurement performance is achieved for a wide range of applications in an EMI-shielded, light-tight and moisture-free test environment. Thermal management enhancements and lab automation capabilities result in improved yields and faster time to data.

The CM300xi supports Contact Intelligence™ – a unique technology which enables autonomous semiconductor test. A powerful combination of innovative system design and state of the art image processing provides an operator-independent solution to achieve highly-reliable measurement data at any time and temperature.

With the material handling unit, the CM300xi probe station combines fully-automated wafer test with highest accuracy and flexibilty. The system can handle up to fifty 200 or 300 mm wafers provided in SEMI-standard wafer cassettes

Key Features

Flexibility

• DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
• Full thermal range of -60°C to +300°C
• Usage of manual and motorized positioners, probe cards within EMI-shielded environment
• Upgrade path to meet your future needs
• Stable and repeatable measurements over a wide thermal range

High accuracy and repeatability

• Reliable and repeatable contact
• Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
• Advanced EMI-shielding with PureLine and AttoGuard technologies available
• Superior low-leakage and low-noise measurements
• Safe and accurate hands-off testing
• Minimizes settling times for efficient measurements over full thermal range

Easy manual wafer loading

• Chuck mounted on rollout stage that can be opened manually
• Enables full access to the chuck and the auxiliary sites
• For fast and safe manual loading and unloading of wafers

3D Manual Controls

• Virtual Platen Lift and XY knobs at front
• Intuitive, and precise movement of chuck in X, Y, and Z-direction
• Platen Lift enables extremely rapid and intuitive way in performing many alignment tasks like setting up the contact height

ntact Intelligence Technology

• High thermal stability components
• On-axis probe-to-pad alignment
• Automated temperature ramp
• Soak time management
• Enables CM300xi to sense, learn and react to multiple temperatures and small pad layouts
• Provides the most accurate probe to pad alignment

Thermal Measurements

• Wide range of extremly performant, reliable thermal chuck systems from ATT
• Flexibility from hot only to full thermal range of -60°C to +300°C
• Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
• Up to 15% faster transition times than other systems in the market
• Patented MicroVac™ and FemtoGuard™ Technologies, providing ultra-low noise measurements and controlled leakage, low residual capacitance for repeatability and advanced measurement accuracy and speed
• Field-upgradeable: grows with your needs

Automated test

• Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
• Enables unattended tests on small pads down to 30 μm over time and at multiple temperatures
• Faster time to data

Key Benefits

Specifications

* Measured at edge of 300 mm chuck