FormFactor CM300xi 300 mm semi-/ fully-automated probe system

FormFactor CM300xi 300 mm semi-/ fully-automated probe system

200 mm semi-/ fully-automated production probe system

  • Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
  • Faster time to data
  • Highest Z-axis resolution of any production prober
  • Highest Z-axis resolution of any production prober
  • Interfaces to all major analysis instrumentation, optics software and testers
  • Backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
  • Highly accurate light measurement

 

 

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Introducing the FormFactor CM300xi 300 mm semi-/ fully-automated probe system

CM300xi Overview

Best-in-class measurement performance at a high level of automation in the lab*

The CM300xi probe station meets the measurement challenges brought on by extremely complex environments, such as unattended testing on small pads over time and at multiple temperatures. Best-in-class measurement performance is achieved for a wide range of applications in an EMI-shielded, light-tight and moisture-free test environment. Thermal management enhancements and lab automation capabilities result in improved yields and faster time to data.

The CM300xi supports Contact Intelligence™ – a unique technology which enables autonomous semiconductor test. A powerful combination of innovative system design and state of the art image processing provides an operator-independent solution to achieve highly-reliable measurement data at any time and temperature.

With the material handling unit, the CM300xi probe station combines fully-automated wafer test with highest accuracy and flexibilty. The system can handle up to fifty 200 or 300 mm wafers provided in SEMI-standard wafer cassettes

FormFactor CM300xi 300 mm semi-/ fully-automated probe system



FormFactor CM300xi 300 mm semi-/ fully-automated probe system

Key Features

Flexibility

  • DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
  • Full thermal range of -60°C to +300°C
  • Usage of manual and motorized positioners, probe cards within EMI-shielded environment
  • Upgrade path to meet your future needs
  • Stable and repeatable measurements over a wide thermal range

High accuracy and repeatability

  • Reliable and repeatable contact
  • Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
  • Advanced EMI-shielding with PureLine and AttoGuard technologies available
  • Superior low-leakage and low-noise measurements
  • Safe and accurate hands-off testing
  • Minimizes settling times for efficient measurements over full thermal range

Easy manual wafer loading

  • Chuck mounted on rollout stage that can be opened manually
  • Enables full access to the chuck and the auxiliary sites
  • For fast and safe manual loading and unloading of wafers

3D Manual Controls

  • Virtual Platen Lift and XY knobs at front
  • Intuitive, and precise movement of chuck in X, Y, and Z-direction
  • Platen Lift enables extremely rapid and intuitive way in performing many alignment tasks like setting up the contact height

ntact Intelligence Technology

  • High thermal stability components
  • On-axis probe-to-pad alignment
  • Automated temperature ramp
  • Soak time management
  • Enables CM300xi to sense, learn and react to multiple temperatures and small pad layouts
  • Provides the most accurate probe to pad alignment

Thermal Measurements

  • Wide range of extremly performant, reliable thermal chuck systems from ATT
  • Flexibility from hot only to full thermal range of -60°C to +300°C
  • Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
  • Up to 15% faster transition times than other systems in the market
  • Patented MicroVac™ and FemtoGuard™ Technologies, providing ultra-low noise measurements and controlled leakage, low residual capacitance for repeatability and advanced measurement accuracy and speed
  • Field-upgradeable: grows with your needs

Automated test

  • Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
  • Enables unattended tests on small pads down to 30 μm over time and at multiple temperatures
  • Faster time to data

 



Key Benefits

Higher efficiency and lower cost of test Scalable from semi-automated operation to fully-automated prober or dual-prober system
High accuracy and repeatability Superior low-leakage and low-noise measurements
Safe and accurate hands-off testing with reliable and repeatable contact
Automated test Contact Intelligence enables unattended tests on small pads
•Thermally induced drift can be automatically corrected, enabing automated temperature transitions over the full temperature range using VueTrack or ReAlign (the effective temperature range and minimum obtainable pad size depend on probe card and probe card holder or positioner used)
Test productivity Fast delivery of a wide variety of precise model parameters to enhance process and device development
Flexibility DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
Full thermal range of -60°C to +300°C, supported by high thermal stability design
Usage of manual and motorized positioners, probe cards within EMI-shielded environment

 


FormFactor CM300xi 300 mm semi-/ fully-automated probe system


Trust the Experts at ACA TMetrix Inc.

ACA TMetrix Inc. is a leading Canadian distributor of test and measurement instruments and design tools. For over 55 years we have provided products manufactured by the world’s leading instrument manufacturers. Leading Distributor of Design Tools and Test Equipment in Canada.

Specifications

X-Y Stage
Travel XY 301 mm x 501 mm (11.9 in. x 19.7 in.)
Resolution 0.2 µm (0.008 mils)
Repeatability ≤ 1 µm (0.04 mils)
Accuracy Standard mode: ≤ 2 µm (0.08 mils), Precision mode: ≤ 0.3 μm (0.012 mils)
Speed 50 mm/sec (2 in./sec)
Bearings Precision balls bearings
Motor-drive system High-performance micro stepper motor
Feedback system Ceramic ultra-low thermal expansion linear encoder
Z Stage
Travel 10.0 mm (.39 in.)
Resolution 0.2 µm (0.008 mils)
Repeatability ≤ 1 µm (0.04 mils)
Accuracy ≤ 2 µm (0.08 mils)
Speed 20 mm/sec (0.8 in./sec)
Lifting capacity 20 kg (44 lb.)
Probe-force deflection (measured at the chuck edge) ≤ 0.0007 µm/µm slope per 10 kg load (0.0007 in./ in./22 lb)
Theta Stage
Travel
± 3.75°
Resolution 0.2 µm (0.008 mils)*; 0.00008°
Repeatability ≤ 1 µm (0.04 mils)*; ≤ 0.0004°
Accuracy of fine correction ≤ 2 µm (0.08 mils)*; ≤ 0.0008°
Accuracy of large movement (>2°) ≤ 5 µm (0.20 mils)*; ≤ 0.0019°

* Measured at edge of 300 mm chuck

 

Datasheet


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