Hioki POWER METER PW3337
Description
TESLA200 Probe System for High Power Testing
The Cascade TESLA200 Probe System is engineered to set new standards in high-power on-wafer device characterization. Designed for IGBT and power MOSFET devices across GaN, SiC, and Si technologies, TESLA200 delivers reliable testing up to 10,000 V DC and 600 A, making it an ideal choice for both research and production environments.
Accuracy and Safety in Power Device Measurements
At its core, TESLA200 integrates AttoGuard®, MicroChamber®, and FemtoGuard™ thermal chuck technology to ensure ultra-low noise, high accuracy, and safe high-voltage operation. With advanced MicroVac™ technology, the system prevents wafer curling and enables accurate Rds(on) and UIS measurements, even at high current and elevated temperatures. A TÜV-certified interlock system with a clear enclosure enhances operator safety during high-power testing.
Flexible Automation and Wafer Handling
TESLA200 is available in semi-automatic and fully-automatic models, with full automation supporting thinned, warped, or TAIKO wafers. Its fast 200 mm stage and wafer loader streamline throughput while maintaining precision. The system is field-upgradeable, ensuring it adapts to evolving test needs while staying budget-friendly.
Seamless Software Integration and User Experience
Powered by Velox Probe Station Control Software, TESLA200 ensures simple operation for new users and efficient workflows for experienced engineers. From wafer alignment to probe-to-pad calibration across temperature ranges, Velox simplifies the entire test cycle. Optional VeloxPro SEMI E95-compliant software offers full automation capabilities, while the intuitive Velox Dash™ touchscreen provides quick access to probe station controls.
A Complete Solution for Power Semiconductor Testing
Whether in R&D labs, device characterization, or niche production, TESLA200 provides everything needed for fast, accurate, and safe on-wafer testing. By combining automation, precision, safety, and scalability, it empowers engineers and scientists to accelerate innovation in high-power semiconductor design.
Tabular Data
| Specification | TESLA200 Probe System Details |
| Wafer Size | 200 mm |
| Voltage Range | Up to 10,000 V DC |
| Current Range | Up to 600 A (200 A standard) |
| Thermal Range | -55°C to +300°C |
| Supported Devices | IGBT, GaN, SiC, Si |
| Wafer Handling | Thinned, warped, TAIKO wafers |
| Safety | TÜV-certified interlock system |
| Probe Card Compatibility | T.I.P.S. “LuPo” High Power Cards |
| Key Technologies | AttoGuard®, MicroChamber®, FemtoGuard™, MicroVac™ |
| Software | Velox, VeloxPro, Velox Dash™ |
| Automation | Semi-automatic / Fully-automatic |
| Applications | R&D, device characterization, niche production |
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