Description
Cascade TESLA300 Probe System Overview
The Cascade TESLA300 Probe System is a high-power, 300 mm wafer probing platform designed for accurate and safe characterization of next-generation power devices. Capable of handling voltages up to 10 kV and currents up to 600 A, the TESLA300 is the industry benchmark for high-power semiconductor testing in both engineering and production environments.
At the core of the system is FormFactor’s patented AttoGuard™ and FemtoGuard™ technologies, which deliver ultra-low leakage and capacitance for precise measurement results. The MicroVac™ chuck surface provides excellent wafer handling, prevents curling or breakage of thin wafers, and minimizes contact resistance for reliable Rds(on) and UIS measurements.
Safety is built into every detail. The TÜV-certified interlock system ensures operator protection, while the full enclosure design prevents accidental interruptions. The top-lift wafer loading system eliminates lift pins, providing best-in-class accuracy for vertical device testing and supporting automation up to 10 kV.
The TESLA300 is optimized for versatility, offering auxiliary chucks, advanced high-voltage/current probes, and configurable connection panels for coaxial, triaxial, and pin-jack setups. With a thermal range of -60°C to +300°C, it supports both cryogenic and high-temperature testing with fast transition times and reduced air consumption.
For productivity, the system integrates seamlessly with Keysight and Keithley analyzers and supports remote operation, enabling engineers to place probes, move wafers, and run test programs from anywhere in the world. Combined with Velox and Velox Dash™ software, the platform ensures simplified workflows, intuitive operation, and robust automation, reducing training time and improving throughput.
The Cascade TESLA300 Probe System is not just a probe station—it is a complete, production-ready solution for high-power device characterization, accelerating innovation while maintaining the highest standards of accuracy, safety, and efficiency.
Technical Highlights of TESLA300
| Feature Category | Specification / Capability |
| Wafer Size Support | 200 mm / 300 mm |
| Voltage Capacity | Up to 10,000 V DC |
| Current Capacity | Up to 200 A (standard) / 600 A (high current) |
| Chuck Technology | MicroVac™ and FemtoGuard™ with low resistance and wafer protection |
| Thermal Range | -60°C to +300°C |
| Safety Certification | TÜV-certified with interlock and full enclosure |
| Loading Method | Top-lift wafer loading with roll-out chuck |
| Automation & Remote | Remote operation, Velox and Velox Dash™ software |
| Integration | Keysight and Keithley analyzer compatibility |
| Applications | Power device characterization, Rds(on), UIS, high-volume and custom solutions |
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