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ThermoSpot Systems

ThermoSpot Systems

ThermoSpot Systems – Benchtop Direct Contact Cooling and Heating Solution

The Temptronic® ThermoSpot® delivers high-performance temperature control for IC testing and high-Watt devices with unmatched cooling capacity.

Key Features:

  • Reliable thermal cycling without thermoelectric modules
  • Wide temperature range: -65°C to +175°C
  • Cooling power: 40W at -40°C, 55W at -55°C, 120W at -40°C
  • Fast transitions: <35 seconds from +25°C to -40°C
  • Secure thermal contact with ThermoBridge™ design
  • Touch-screen with data logging and programmable settings
  • Multiple communication ports: Ethernet, USB, IEEE, RS232

 

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Description

ThermoSpot Systems for Advanced IC Temperature Characterization

The Temptronic® ThermoSpot® Systems are engineered for precise, reliable, and efficient direct contact temperature control in demanding electronics testing environments. Designed to support ICs and other high-power devices, ThermoSpot delivers superior cooling performance compared to traditional thermoelectric systems. Its advanced refrigeration technology ensures consistent results and eliminates cooling degradation, a common limitation in competing solutions.

At the heart of the system lies the ThermoBridge™ thermal probe, which creates a secure and efficient connection between the device under test (DUT) and the cooling source. This enables accurate and stable temperature cycling, even in high-Watt applications. With a temperature range of -65°C to +175°C and cooling power of up to 120W at -40°C, ThermoSpot offers unmatched flexibility for a variety of applications.

The system’s rapid transition capability allows users to shift from +25°C to -40°C in under 35 seconds, ensuring fast and efficient testing cycles. The integrated touch-screen controller makes operation intuitive with programmable temperature settings, real-time graphing, and automated data logging. Engineers benefit from multiple connectivity options, including Ethernet, USB, IEEE, and RS232, which make the ThermoSpot adaptable to modern lab setups.

Whether for semiconductor characterization, reliability testing, or thermal stress validation, ThermoSpot Systems set the benchmark for benchtop direct contact cooling and heating technology. With their high reliability, efficiency, and ease of use, they empower engineers to achieve precise results while optimizing testing workflows.

Technical Specifications

Feature Specification
Temperature Range -65°C to +175°C
Cooling Power 40W at -40°C (low power), 55W at -55°C, 120W at -40°C
Transition Rate <35 seconds from +25°C to -40°C
Probe Design Interchangeable ThermoBridge™ for secure DUT connection
Control System Touch-screen with programmable settings, graphing, and data logging
Communications Options Ethernet, USB, IEEE, RS232
Reliability No thermoelectric modules, robust refrigeration for consistent performance
Applications IC testing, semiconductor characterization, thermal stress testing, reliability validation

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