Showing 17–32 of 48 results


  • Cascade PAV200 – 200 mm Semi-Automated Vacuum Probe System

    Key Features:

    • Supports wafers and substrates up to 200 mm (optional upgrade to 300 mm)
    • Operates in high vacuum down to < 1×10⁻⁴ mbar
    • Semi-automated control with joystick and software-driven chuck movement
    • Up to eight probe positioners and/or probe card integration
    • Optional thermal chuck with -60°C to 300°C range
    • Solid frame with vibration isolation for stable, accurate measurements
    • Wide application support: DC, RF, MEMS, and optoelectronics
    • Velox software for wafer alignment, mapping, and simplified automation

     

  • The Cascade PLC50 is a precise, cost-effective cryogenic wafer probing system designed for research labs. It enables testing down to 77 K with liquid nitrogen or below 7 K with liquid helium, supporting DC, RF, MEMS, and optoelectronic measurements.

    Key Features:

    • Compatible with wafers up to 100 mm and single dies.
    • Operates at 77 K (LN₂) or < 7 K (LHe).
    • Up to six positioners for flexible probing.
    • Independently cooled cold shield ensures stable, accurate results.
    • Ice- and condensation-free probing in vacuum conditions.
    • Ergonomic design with hinged lid and easy microscope access.
    • Independent chuck stage and positioner control for high throughput.

     

  • Cascade PM8 200 mm Manual Probe System

    Key Features:

    • Stable granite base for vibration-free measurements.
    • Submicron precision with 1 µm repeatable separation stroke.
    • Configurable for DC, RF, mmW, sub-THz, FA, MEMS, and opto-engineering.
    • 40 mm platen height adjustability for flexible setups.
    • Supports thermal chucks, motorized microscopes, and dark box options.
    • Double-side probing for frontside and backside device access.
    • Ergonomic and low-profile design for easy wafer handling.
    • Upgradeable platform with accessories for future needs.

     

  • Cascade PMC200 Cryogenic Probe Station – advanced manual solution for wafer probing down to cryogenic levels with unmatched flexibility and accuracy.

    Key Features:

    • 200 mm cryogenic manual probe station with probes inside chamber
    • Supports wafers up to 200 mm or single dies
    • Probe cards and up to eight positioners for advanced measurements
    • Operates with liquid nitrogen (77 K) or helium (< 7 K)
    • Optional microscope bridge and 300 mm wafer upgrade
    • Front-loading capability for fast and ergonomic device changes
    • Independently cooled cold shield for stable cryogenic performance
    • Precise probe positioning with vibration-isolated frame
    • Covers DC, RF, MEMS, OPTO, and superconducting device tests

     

  • A high-precision vacuum probe station engineered for advanced wafer and substrate testing up to 200 mm in demanding laboratory and industrial environments.

    Key Features:

    • Supports wafers and substrates up to 200 mm or single dies
    • Up to eight positioners and probe card compatibility
    • Optional thermal chuck (-60°C to 300°C) with pressure regulation
    • Accessories available: black bodies and optical motion analysis tools
    • Upgradeable to 300 mm wafer capability
    • Built-in vibration isolation for precise, stable measurements
    • Ideal for DC, RF, MEMS, and optoelectronic testing
    • Ergonomic manual drives with front-loading capability
    • High throughput with software-controlled chuck for fast step-and-repeat

     

  • Cascade Summit 200 mm Manual Probe System

    Key Features:

    • High-precision manual on-wafer device and process characterization.
    • Wide thermal range from -60°C to +300°C.
    • Moisture-free, light-tight, EMI-shielded test environment with MicroChamber®.
    • PureLine™ and AttoGuard® technologies for low-noise performance.
    • Configurable for DC, RF, mmW, WLR, and FA applications.
    • Locking roll-out stage for safe wafer access.
    • Ergonomic 3-axis manual stage with intuitive controls.
    • Dedicated Velox software with Augmented Align for accurate RF probing.

     

  • Cascade SUMMIT200 Advanced 200 mm Probe Station

    Key Features:

    • High-accuracy electrical measurements for DC, RF, mmW, and THz applications.
    • Up to 5X faster time to accurate data with automated wafer handling.
    • Wide thermal range from -60°C to +300°C with IceShield™.
    • PureLine™, AttoGuard®, and MicroChamber® technologies for ultra-low noise performance.
    • Precision sub-micron positioning with advanced 4-axis stage and VueTrack PRO.
    • Flexible platform for device characterization, FA, WLR, and design debug.
    • Velox control software with modern UI, workflow guide, and automation tools.
    • Ergonomic operation with quick manual wafer access and roll-out stage.

     

  • Cascade TESLA300 is a 300 mm semi- and fully-automated probe system for advanced on-wafer power device characterization, ensuring safe, precise, and high-power testing.

    Key Features:

    • On-wafer device testing up to 10,000 V DC / 600 A
    • AttoGuard™ and FemtoGuard™ chuck technologies for low-leakage, high-accuracy measurements
    • MicroVac™ chuck ensures thin wafer stability and minimal contact resistance
    • TÜV-certified safety system with full enclosure and interlocks
    • Wide thermal range: -60°C to +300°C with TopHat chamber
    • Roll-out chuck and auxiliary mounts for flexible wafer handling
    • Remote operation and full software integration with Velox and analyzers
    • Material Handling Unit (MHU301) for automated wafer loading and barcode recognition

     

  • Cascade CM300xi-SiPh Probe System – 300 mm Wafer and Die-Level Photonics Testing

    Key Features:

    • Integrated silicon photonics wafer and die-level probing solution.
    • Autonomous SiPh Measurement Assistant for hands-free calibration.
    • OptoVue™ technology for real-time, in-situ optical calibrations.
    • Supports vertical, horizontal edge, and wafer-level edge coupling.
    • Dark, shielded, frost-free environment with SiPh TopHat.
    • Thermal capability from -40°C to +125°C.
    • Exclusive SiPh-Tools and Photonics Controller Interface (PCI) software.
    • Partnerships with Keysight and PI for precision instrumentation.
    • Easy setup and automation with Velox and Velox Dash™ interface.

     

  • Cascade CM300xi-ULN Probe System – Ultra Low Noise 300 mm Wafer Prober

    Key Features:

    • Ultra-low noise measurements with patented PureLine™ 3 technology.
    • Ideal for flicker noise (1/f), RTN, and phase noise testing of ultra-sensitive devices.
    • Fully shielded MicroChamber™ for EMI/RFI protection and frost-free low-temperature operation.
    • Plug-and-Go TestCell Power Management eliminating ground-loop noise.
    • Autonomous 24/7 operation with optimized motorized probe positioners.
    • Wide thermal range from -65°C to +300°C with fA/fF measurement precision.
    • Integrated Velox software for simple, efficient automation.

     

  • The CRBM EMC software by NEXIO is an advanced solution designed to automate electromagnetic compatibility testing in reverberation chambers. Built on the BAT-EMC platform, it simplifies complex measurement processes while ensuring full compliance with major international standards for immunity and emission testing.

    Key Features

    • Automated reverberation chamber testing for EMC immunity and emission
    • Supports ISO 11452-11, ISO 11451-5, MIL STD, DO 160, and IEC 61000-4-21 standards
    • Advanced statistical calculation engine for accurate test results
    • Configurable stirrer control with continuous or step rotation modes
    • Vacuum, loaded, and EUT calibration support for precise validation
    • Real time field and power measurement monitoring
    • Optimized chamber efficiency without absorbing materials
    • Automated reporting and easy export of test results
    • Compatible with modern EMC laboratory workflows and instruments
    • Designed for aerospace, automotive, defense, and industrial applications

     

  • Custom OEM Chillers are designed to meet the exact cooling requirements of manufacturers and end users. Engineered for precision and flexibility, these systems deliver reliable performance tailored to your unique process needs.

    Key Features

    • Fully customized cooling solutions for OEM and end users
    • Designed for specific temperature, flow rate, and pressure needs
    • Supports fluid, gas, and cryogenic cooling technologies
    • Flexible footprint and system integration options
    • Advanced remote communication capabilities
    • Suitable for a wide range of industries
    • High performance and reliability in demanding environments
    • Scalable solutions with OEM and volume pricing options
    • Built with decades of thermal engineering expertise

     

  • Custom Thermal Chambers are engineered to meet exact testing requirements for end users and OEM applications. Designed for flexibility and precision, these chambers deliver extreme temperature control with fully customizable configurations.

    Key Features

    • Temperature range from -185°C to +500°C
    • Rapid transition rates up to 100°C per minute
    • Fully customizable chamber size and footprint
    • Flexible test access with ports, shelves, and windows
    • Advanced controller with data logging capabilities
    • Multiple communication interfaces including Ethernet and RS232
    • Available in benchtop, rack mount, or stand configurations
    • Certified with ISO, RoHS, CE, and UL standards
    • Engineered specifically for your application needs

     

  • The ECO-710E/810E ThermoStream® systems are eco-friendly temperature forcing solutions designed for precise electronic testing, delivering fast temperature transitions with quiet, energy-efficient operation.

    Key Features:

    • Wide temperature range: -80°C to +225°C
    • Eco-friendly design compliant with EU 517/2014 (no annual leak testing)
    • Quiet operation at just 56 dBA
    • Energy-efficient performance on a 20-amp circuit
    • Rapid temperature transitions for consistent results
    • Touchscreen controls with embedded software (no Windows® OS)
    • No need for LN2 or LCO2 cooling agents
    • Remote setup and communication capabilities
    • Ideal for 24/7/365 lab or production use

     

  • A compact and flexible semi-automated wafer probe system designed for RF/DC modeling, device characterization, and advanced measurement needs.

    Key Features:

    • Mechanical platen lift for safer RF set-ups and reduced operator errors
    • Fully compatible with Autonomous RF/DC measurement assistants and Velox Dash™ app
    • Reconfigurable platen inserts (TopHat, PCH, IceShield) for versatile test configurations
    • Spacious platen design supporting RF and DC setups with ease
    • Compact footprint with field-upgradable components
    • Integrated Low-Volume MicroChamber and FemtoGuard thermal triaxial chuck

     

  • Gas Chillers are designed for precise and efficient cooling of nitrogen, argon, and clean dry air in demanding process applications. Built for reliability and flexibility, these systems deliver ultra-low temperatures with fast response times.

    Key Features

    • Cooling capability down to -95°C
    • Supports nitrogen, argon, air, and clean dry air
    • Open loop and closed loop configurations available
    • Fast temperature transitions for process efficiency
    • No LN2 or LCO2 required for operation
    • Auto cascade and cryogenic cooling options
    • Advanced control for consistent performance
    • Designed for industrial and high precision applications
    • Compliant with global industry standards

     


Showing 17–32 of 48 results