Products

Cascade PM8 200 mm Manual Probe System

Key Features:

• Stable granite base for vibration-free measurements.
• Submicron precision with 1 µm repeatable separation stroke.
• Configurable for DC, RF, mmW, sub-THz, FA, MEMS, and opto-engineering.
• 40 mm platen height adjustability for flexible setups.
• Supports thermal chucks, motorized microscopes, and dark box options.
• Double-side probing for frontside and backside device access.
• Ergonomic and low-profile design for easy wafer handling.
• Upgradeable platform with accessories for future needs.

Cascade PMC200 Cryogenic Probe Station – advanced manual solution for wafer probing down to cryogenic levels with unmatched flexibility and accuracy.

Key Features:

• 200 mm cryogenic manual probe station with probes inside chamber
• Supports wafers up to 200 mm or single dies
• Probe cards and up to eight positioners for advanced measurements
• Operates with liquid nitrogen (77 K) or helium (< 7 K)
• Optional microscope bridge and 300 mm wafer upgrade
• Front-loading capability for fast and ergonomic device changes
• Independently cooled cold shield for stable cryogenic performance
• Precise probe positioning with vibration-isolated frame
• Covers DC, RF, MEMS, OPTO, and superconducting device tests

A high-precision vacuum probe station engineered for advanced wafer and substrate testing up to 200 mm in demanding laboratory and industrial environments.

Key Features:

• Supports wafers and substrates up to 200 mm or single dies
• Up to eight positioners and probe card compatibility
• Optional thermal chuck (-60°C to 300°C) with pressure regulation
• Accessories available: black bodies and optical motion analysis tools
• Upgradeable to 300 mm wafer capability
• Built-in vibration isolation for precise, stable measurements
• Ideal for DC, RF, MEMS, and optoelectronic testing
• Ergonomic manual drives with front-loading capability
• High throughput with software-controlled chuck for fast step-and-repeat

Cascade Summit 200 mm Manual Probe System

Key Features:

• High-precision manual on-wafer device and process characterization.
• Wide thermal range from -60°C to +300°C.
• Moisture-free, light-tight, EMI-shielded test environment with MicroChamber®.
• PureLine™ and AttoGuard® technologies for low-noise performance.
• Configurable for DC, RF, mmW, WLR, and FA applications.
• Locking roll-out stage for safe wafer access.
• Ergonomic 3-axis manual stage with intuitive controls.
• Dedicated Velox software with Augmented Align for accurate RF probing.

Cascade SUMMIT200 Advanced 200 mm Probe Station

Key Features:

• High-accuracy electrical measurements for DC, RF, mmW, and THz applications.
• Up to 5X faster time to accurate data with automated wafer handling.
• Wide thermal range from -60°C to +300°C with IceShield™.
• PureLine™, AttoGuard®, and MicroChamber® technologies for ultra-low noise performance.
• Precision sub-micron positioning with advanced 4-axis stage and VueTrack PRO.
• Flexible platform for device characterization, FA, WLR, and design debug.
• Velox control software with modern UI, workflow guide, and automation tools.
• Ergonomic operation with quick manual wafer access and roll-out stage.

Cascade TESLA300 is a 300 mm semi- and fully-automated probe system for advanced on-wafer power device characterization, ensuring safe, precise, and high-power testing.

Key Features:

• On-wafer device testing up to 10,000 V DC / 600 A
• AttoGuard™ and FemtoGuard™ chuck technologies for low-leakage, high-accuracy measurements
• MicroVac™ chuck ensures thin wafer stability and minimal contact resistance
• TÜV-certified safety system with full enclosure and interlocks
• Wide thermal range: -60°C to +300°C with TopHat chamber
• Roll-out chuck and auxiliary mounts for flexible wafer handling
• Remote operation and full software integration with Velox and analyzers
• Material Handling Unit (MHU301) for automated wafer loading and barcode recognition

Cascade CM300xi-SiPh Probe System – 300 mm Wafer and Die-Level Photonics Testing

Key Features:

• Integrated silicon photonics wafer and die-level probing solution.
• Autonomous SiPh Measurement Assistant for hands-free calibration.
• OptoVue™ technology for real-time, in-situ optical calibrations.
• Supports vertical, horizontal edge, and wafer-level edge coupling.
• Dark, shielded, frost-free environment with SiPh TopHat.
• Thermal capability from -40°C to +125°C.
• Exclusive SiPh-Tools and Photonics Controller Interface (PCI) software.
• Partnerships with Keysight and PI for precision instrumentation.
• Easy setup and automation with Velox and Velox Dash™ interface.

Cascade CM300xi-ULN Probe System – Ultra Low Noise 300 mm Wafer Prober

Key Features:

• Ultra-low noise measurements with patented PureLine™ 3 technology.
• Ideal for flicker noise (1/f), RTN, and phase noise testing of ultra-sensitive devices.
• Fully shielded MicroChamber™ for EMI/RFI protection and frost-free low-temperature operation.
• Plug-and-Go TestCell Power Management eliminating ground-loop noise.
• Autonomous 24/7 operation with optimized motorized probe positioners.
• Wide thermal range from -65°C to +300°C with fA/fF measurement precision.
• Integrated Velox software for simple, efficient automation.

The CRBM EMC software by NEXIO is an advanced solution designed to automate electromagnetic compatibility testing in reverberation chambers. Built on the BAT-EMC platform, it simplifies complex measurement processes while ensuring full compliance with major international standards for immunity and emission testing.

Key Features

• Automated reverberation chamber testing for EMC immunity and emission
• Supports ISO 11452-11, ISO 11451-5, MIL STD, DO 160, and IEC 61000-4-21 standards
• Advanced statistical calculation engine for accurate test results
• Configurable stirrer control with continuous or step rotation modes
• Vacuum, loaded, and EUT calibration support for precise validation
• Real time field and power measurement monitoring
• Optimized chamber efficiency without absorbing materials
• Automated reporting and easy export of test results
• Compatible with modern EMC laboratory workflows and instruments
• Designed for aerospace, automotive, defense, and industrial applications

A compact and flexible semi-automated wafer probe system designed for RF/DC modeling, device characterization, and advanced measurement needs.

Key Features:

• Mechanical platen lift for safer RF set-ups and reduced operator errors
• Fully compatible with Autonomous RF/DC measurement assistants and Velox Dash™ app
• Reconfigurable platen inserts (TopHat, PCH, IceShield) for versatile test configurations
• Spacious platen design supporting RF and DC setups with ease
• Compact footprint with field-upgradable components
• Integrated Low-Volume MicroChamber and FemtoGuard thermal triaxial chuck

Featuring an ultra-compact 0.35”microLED display with high-brightnessand high-resolution technology,delivering dynamic visuals and seamlessintegration for next-generationautomotive heads-up display (HUD).

Key Features of High Brightness High Resolution 0.35″ Micro-Display:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Power-Efficient Design: Consumes significantly less powercompared to traditional display technologies, extendingbattery life for wearable devices.

Key Features

• Supports wafers up to 200 mm (optional 300 mm upgrade)
• Operates at cryogenic temperatures down to 10 K
• Semi-automated with optional full automation via autoloader
• Compatible with liquid nitrogen, liquid helium, or cryo-cooler
• Ice- and condensation-free probing for stable performance
• Up to eight probe positioners or probe card integration
• Solid vibration-isolated frame for precision measurements
• Velox software with intuitive alignment and automation

Key Features

• Entry-level manual wafer probing in vacuum < 1×10⁻⁴ mbar
• Supports wafers up to 150 mm or single dies
• Up to six probe positioners for flexible testing
• Optional thermal chuck from -60°C to +300°C
• Probing possible with open chamber lid at atmosphere
• Stable, vibration-isolated frame for precise results
• Ergonomic design with hinged topside lid for easy access
• Independent control of chuck stage and positioners
• Fast, manual step-and-repeat wafer testing

Cascade PM300 – 300 mm Analytical Probe Station

Key Features:

• Industry benchmark for manual wafer probing and failure analysis.
• Superior mechanical stability with granite base for precision and repeatability.
• High-precision probe positioning with independent X-Y coarse and fine adjustments.
• Configurable for DC, RF, mmW, WLR, FA, and 3D IC testing.
• Wide thermal range: -60°C to +200°C (PM300PS) / +15°C to +300°C (PM300).
• Optional electromagnetic shielding (PM300PS) for ultra-low-noise environments.
• Spacious, ergonomic design supporting up to 12 positioners.
• Upgradeable platform to support future testing needs.

The RADIO EMC software by NEXIO is a powerful automation platform designed for RF and electromagnetic compliance testing. It enables fully automated radio frequency measurements, spurious emission analysis, and standardized testing workflows for modern wireless communication systems.

Key Features

• Automated RF and radio compliance testing workflow
• Supports ETSI standards including 300 328, 300 220, and 301 908 series
• Spurious and unwanted emission detection with automatic remeasurement
• Integrated chamber calibration for accurate EIRP and ERP calculations
• Supports GSM, LTE, 5G, WiFi, Bluetooth, and SRD technologies
• Automated antenna mast and turntable control for full scan coverage
• Configurable bandwidth and sub-band sequencing optimization
• Substitution method for precise radiated power measurement
• Real time detection of limit-exceeding emissions
• Automatic generation of detailed RF compliance test reports

Showcasing a large 10” panel withultra-bright, energy-efficientmicroLED technology, deliveringdynamic visuals and seamlessintegration for next-generationintelligent vehicles.

Ket Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Vibrant RGB Color Reproduction: Delivers rich, high-contrast visuals with precise color accuracy, enhancingvisuals for display applications.