FormFactor Beaverton Inc

Cascade Autonomous DC delivers fully automated DC wafer probing with unmatched precision and efficiency powered by Contact Intelligence™.

Key Features:

• Autonomous DC wafer probing with hands-free 24/7 operation
• Contact Intelligence™ technology for dynamic probe correction and reliable pad placement
• High throughput with up to 4x faster flicker noise thermal testing on pads as small as 30 µm
• Unattended operation for overnight or weekend testing without user intervention
• Automatic probe alignment compensating for thermal drift to reduce soak time
• Flexible probe layouts supporting single DUT and multi-DUT configurations
• Ease of use – start testing with just one button, ideal for operators at all levels

Cascade Autonomous RF delivers fully automated RF and mm-wave wafer probing with Contact Intelligence™ for unmatched accuracy and efficiency.

Key Features:

• Autonomous RF wafer probing with hands-free 24/7 operation
• Contact Intelligence™ for on-the-fly probe correction and pad placement
• Automatic calibration up to 500 GHz with WinCal XE software
• Calibration drift monitoring with auto re-calibration when needed
• Reduced soak time through dynamic probe re-alignment across temperatures
• Unattended operation for continuous overnight and weekend testing
• Supports 200 mm and 300 mm probe stations including CM300xi, SUMMIT200, Summit 12000, and Elite 300
• Simplified one-button operation, suitable for operators at all levels

Cascade Autonomous Silicon Photonics delivers fully automated wafer and die-level photonics probing with Contact Intelligence™ for unmatched accuracy.

Key Features:

• Flexible vertical and edge coupling with single fibers or fiber arrays
• OptoVue™ technology for real-time in-situ calibrations
• Exclusive TopHat environment for dark, frost-free thermal testing (-40°C to +125°C)
• Sub-micron placement accuracy with Z displacement sensing
• Collision avoidance technology for safe fiber alignment
• SiPh-Tools software for automated alignment, calibration, and data management
• Partnership with Keysight and PI for seamless instrumentation and precision positioning
• Available on CM300xi-SiPh and SUMMIT200 probe stations

Cascade CM300xi – 300 mm Semi-/Fully-Automated Probe System

Key Features:

• Supports DC, AC, RF/microwave, WLR, FA, and design debug applications
• Wide thermal range from -60°C to +300°C with IceShield or TopHat compatibility
• Reliable, repeatable probe contact in a moisture-free, EMI-shielded environment
• Contact Intelligence™ technology for autonomous alignment and accurate measurements
• Modular design with upgrade paths for semi- or fully-automated configurations
• Handles up to 50 wafers with SEMI-standard cassette automation
• Fast transition times with MicroVac™ and FemtoGuard™ low-noise technologies
• Intuitive Velox software and Velox Dash™ touchscreen interface for simplified operation

Engineered for precision and safety, the EPS150TESLA delivers accurate on-wafer power device characterization up to 3,000 V and 100 A, making it a trusted choice for high-voltage and high-current testing.

Key Features:

• On-wafer power device characterization up to 3,000 V (triaxial) / 10,000 V (optional coaxial).
• High-current probing up to 100 A with ultra-low contact resistance.
• Triax chuck design for accurate low-leakage measurements.
• Shielded test environment with advanced grounding and arcing protection.
• Seamless integration with analyzers via SIGMA kit and optimized signal path.
• Safe probe tip exchange and thin-wafer handling capability.

Cascade EPS200MMW mmW and THz Probe System

Key Features:

• Complete mmW, THz, and load-pull measurement solution.
• Accurate probing up to 500 GHz with T-Wave Probes and VDI Extenders.
• SlimVue Microscope with 1 μm resolution and quick lens exchange.
• Resolves pads smaller than 50 μm with precision optics.
• Sigma Application Kits for broadband, load-pull, coax RF, and waveguide setups.
• Rock-solid mechanical design with submicron stage accuracy.
• Motorized positioner with ±1 μm separation repeatability.
• Stable and repeatable probe placement for THz frequencies.

Cascade EPS200RF 200 mm Manual Probe System

Key Features:

• Complete RF measurement package up to 67 GHz.
• Based on the PM8 platform for stability and flexibility.
• Supports Infinity, ACP, and |Z| probe technologies for different material types.
• High precision probing with RF chuck ±3 μm planarity.
• 500 μm platen stroke with ≤±1 μm accuracy for repeatable contact.
• Reliable probing for pads as small as 25 µm x 35 µm.
• Includes matching cables, substrates, and WinCal XE calibration software.
• Delivers accurate S-parameter measurements with automated calibration.

Key Features:

• 150 mm modular probe station with customizable base and starter kits.
• Flexible options for IV/CV, RF, mmWave, THz, high power, and failure analysis.
• Solid frame with built-in vibration isolation for measurement stability.
• Supports advanced microscopes, triax, coax, and RF chucks.
• Seamless integration with leading measurement instruments.
• Ergonomic design with quick pull-out stage for fast device handling.
• Re-configurable and upgradable to grow with future testing needs.

Cascade MPS150-SiPh Manual Silicon Photonics Probe Station

Key Features:

• Cost-effective entry-level photonics probe station.
• Supports surface coupling and horizontal edge coupling.
• Retro-mirror technology for precise fiber alignment.
• Tip-tilt base positioner with 6 degrees of freedom.
• Compatible with single fibers and fiber arrays.
• Optional eVue digital imaging or SlimVue high-performance microscope.
• Modular, upgradable design with platen extensions.
• Ergonomic and intuitive for users of all experience levels.

Cascade PAV200 – 200 mm Semi-Automated Vacuum Probe System

Key Features:

• Supports wafers and substrates up to 200 mm (optional upgrade to 300 mm)
• Operates in high vacuum down to < 1×10⁻⁴ mbar
• Semi-automated control with joystick and software-driven chuck movement
• Up to eight probe positioners and/or probe card integration
• Optional thermal chuck with -60°C to 300°C range
• Solid frame with vibration isolation for stable, accurate measurements
• Wide application support: DC, RF, MEMS, and optoelectronics
• Velox software for wafer alignment, mapping, and simplified automation

The Cascade PLC50 is a precise, cost-effective cryogenic wafer probing system designed for research labs. It enables testing down to 77 K with liquid nitrogen or below 7 K with liquid helium, supporting DC, RF, MEMS, and optoelectronic measurements.

Key Features:

• Compatible with wafers up to 100 mm and single dies.
• Operates at 77 K (LN₂) or < 7 K (LHe).
• Up to six positioners for flexible probing.
• Independently cooled cold shield ensures stable, accurate results.
• Ice- and condensation-free probing in vacuum conditions.
• Ergonomic design with hinged lid and easy microscope access.
• Independent chuck stage and positioner control for high throughput.

Cascade PM8 200 mm Manual Probe System

Key Features:

• Stable granite base for vibration-free measurements.
• Submicron precision with 1 µm repeatable separation stroke.
• Configurable for DC, RF, mmW, sub-THz, FA, MEMS, and opto-engineering.
• 40 mm platen height adjustability for flexible setups.
• Supports thermal chucks, motorized microscopes, and dark box options.
• Double-side probing for frontside and backside device access.
• Ergonomic and low-profile design for easy wafer handling.
• Upgradeable platform with accessories for future needs.

Cascade PMC200 Cryogenic Probe Station – advanced manual solution for wafer probing down to cryogenic levels with unmatched flexibility and accuracy.

Key Features:

• 200 mm cryogenic manual probe station with probes inside chamber
• Supports wafers up to 200 mm or single dies
• Probe cards and up to eight positioners for advanced measurements
• Operates with liquid nitrogen (77 K) or helium (< 7 K)
• Optional microscope bridge and 300 mm wafer upgrade
• Front-loading capability for fast and ergonomic device changes
• Independently cooled cold shield for stable cryogenic performance
• Precise probe positioning with vibration-isolated frame
• Covers DC, RF, MEMS, OPTO, and superconducting device tests

A high-precision vacuum probe station engineered for advanced wafer and substrate testing up to 200 mm in demanding laboratory and industrial environments.

Key Features:

• Supports wafers and substrates up to 200 mm or single dies
• Up to eight positioners and probe card compatibility
• Optional thermal chuck (-60°C to 300°C) with pressure regulation
• Accessories available: black bodies and optical motion analysis tools
• Upgradeable to 300 mm wafer capability
• Built-in vibration isolation for precise, stable measurements
• Ideal for DC, RF, MEMS, and optoelectronic testing
• Ergonomic manual drives with front-loading capability
• High throughput with software-controlled chuck for fast step-and-repeat

Cascade Summit 200 mm Manual Probe System

Key Features:

• High-precision manual on-wafer device and process characterization.
• Wide thermal range from -60°C to +300°C.
• Moisture-free, light-tight, EMI-shielded test environment with MicroChamber®.
• PureLine™ and AttoGuard® technologies for low-noise performance.
• Configurable for DC, RF, mmW, WLR, and FA applications.
• Locking roll-out stage for safe wafer access.
• Ergonomic 3-axis manual stage with intuitive controls.
• Dedicated Velox software with Augmented Align for accurate RF probing.

Cascade SUMMIT200 Advanced 200 mm Probe Station

Key Features:

• High-accuracy electrical measurements for DC, RF, mmW, and THz applications.
• Up to 5X faster time to accurate data with automated wafer handling.
• Wide thermal range from -60°C to +300°C with IceShield™.
• PureLine™, AttoGuard®, and MicroChamber® technologies for ultra-low noise performance.
• Precision sub-micron positioning with advanced 4-axis stage and VueTrack PRO.
• Flexible platform for device characterization, FA, WLR, and design debug.
• Velox control software with modern UI, workflow guide, and automation tools.
• Ergonomic operation with quick manual wafer access and roll-out stage.