Date: Thursday, September 12th
Time: 7:00 PM – 7:30 PM EDT
Location: Online
Event Overview:
As silicon-based transistors continue to scale down, achieving precise and repeatable wafer measurements has become increasingly challenging. The reduction in the size of aluminum-capped copper test pads, aimed at cutting lithography, prototyping, and production costs, further complicates the process of re-probing devices with low contact resistance.
Join Dr. Choon Beng Sia, Technical Director at FormFactor Singapore Pte Ltd, for an insightful session on the next-generation true-Kelvin MEMS analytical DC probes. Dr. Sia will present new test and modeling strategies to address these emerging challenges, offering solutions for accurate and consistent wafer measurements.
Speaker Details:
Dr. Choon Beng Sia, a renowned expert in semiconductor wafer testing, holds 13 international patents and has published over 50 scientific papers. He serves on the IEEE MTT-3 technical committee and specializes in RF and 5G wafer tests.
REGISTER and don’t miss this opportunity to enhance your knowledge on cutting-edge wafer measurement techniques!