Probe Systems

The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables the collection of accurate high-voltage and high-current measurement data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current), with complete operator safety.

• Vector Network Analyzer (option up to 26.5GHz)
• WinCal XE calibration software
• Uses best measurement practices for optimized measurements
• Known measurement accuracy traced back to independent standards
• Supported by the measurement experts to make you successful
• Best in class RF performance
• Small benchtop footprint
• Industry standard calibration techniques
• Extended 2 Year warranty on FormFactor products for educational customers

• Re-configurable for DC, RF, mmW, FA, WLR and more
• table and repeatable measurements over a wide thermal range
• Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
• Minimize AC and spectral noise
• Manual 3-axis stage with ergonomic controls
• Fast, accurate “hands on” wafer positioning
• Quick, safe, and comfortable wafer access

• Comfortable and ergonomic operation
• Thermal range ambient to +300°C
• RF/microwave device characterization, FA and design debug
• Seamless integration between Velox and analyzers/measurement software
• Complete solutions using probe positioners and probe cards
• Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
• Shortest signal path test integration for accurate, thermally stable, and low-error data collection
• Powerful automation tools, reduce total test time on wafers, singulated dies, and modules
• Faster time to first data for standard and “hard to test” devices such as thin wafer, small pad and high power
• Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact

Genius Education Kits Overview

• Probe station
• Keysight Streamline Vector Network Analyzer (option up to 53 GHz)
• Choice of probes
• WinCal XE calibration software
• Extended 2 Year warranty on FormFactor products for educational customers
• Optional laptop

• Flexibility
  • Temperatures range from -60°C to +300°C
  • Surfaces are nickel or gold-plated
  • Hybrid chuck design – operation with and without cooling unit
  • Field-upgradeable: On-site cold upgrades for all main prober platforms
• Highest Efficiency for Reduced Cost of Test
  • Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
  • Up to 15% faster transition times than other systems on the market
• Low Thermal Resistance
  • Low Thermal Resistance Technology
  • MultiSense with multiple temperature sensors
  • Best temperature accuracy and uniformity
• Superior Electrical Performance
  • Isolated from ground
  • Includes a jack for grounding and biasing
  • Highly planar chuck surface for consistant contact force and overtravel

PureLine 3 Technology

First automated probe station to achieve -190dB spectral noise*

Plug In and Go

Integrated TestCell Power Management provides fully managed and filtered AC power to the entire system, prober and instruments

Autonomous 24/7 Operation

Up to 4x faster flicker noise thermal testing on 30 μm pads

Reduce Setup Time and Costs
Exclusive low noise site survey, and system verification services

• Quick and easy probe tip navigation
• Maximizes field-of-view
• High magnification
• Shadow-free view of the corresponding features
• Automatically configure and optimize performance
• cTUVus certified and CE
• Compatible with TopHat for perfect shielding
• 24/7 operating, Increased MTBF
• Stops all system motion and warns of unobserved contact

Contact Intelligence

• Ease of use –  Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
• Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
• Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.

• Ease of use –  Less experienced operators can perform an RF calibration up to 330 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
• Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
• Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
• Calibration Monitor and Re-calibration – System will continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.

• Comprehensive,
• Turn-key Integrated Measurement System (IMS)
• with Keysight PNA for On-wafer R&D Measurements
• from RF to millimeter wave to Terahertz

Tables from simple to highly sensitive

• Designed for use with specific Probe Systems
• Tables to suit all facility requirements and applications
• Stable probing, even in submicron range
• Granite platen ensures rigidity and temperature stability
• Can be combined with the Shield Enclosures

• SlimVue Microscope
  • Combined eye-pieces and CCD camera mount
  • 3x zoom and quick lens exchange
  • Quick lens exchange
  • 1 um optical resolution
  • Minimized scope footprin
• Application Specific Sigma Kits
  • Optical feedback on platen position (gauge)
  • Adaptable to any mmW/sub-THz applications
  • Seamless integration with any mmW modules and tuners
  • Fast mounting and setup change
• THz measurement capability
  • Rock-solid mechanical design
  • Submicron stage accuracy
  • Optical feedback on platen and probe position (gauge)
  • Motorized positioner

• Three Probe Technologies
  • nfinity Probe: best for Al (Si)
  • ACP Probe: best for AU (III-Vs)
  • |Z| Probe: robust solution (long lifetime)
• Precise Contact Solution
  •  Precision probe alignment
  • Consistent contact force and overtravel
  • Stable contact performance
• WinCal XE Calibration Software
  • Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
  • Automated calibration monitoring
  • Unique measurement & analysis methods

200 mm semi-/ fully-automated production probe system

• Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
• Faster time to data
• Highest Z-axis resolution of any production prober
• Highest Z-axis resolution of any production prober
• Interfaces to all major analysis instrumentation, optics software and testers
• Backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
• Highly accurate light measurement

• Flexibility
  • Different substrate carriers for wafers up to 200 mm or single dies
  • Probe cards and/or up to eight positioners
  • Use with liquid nitrogen or helium, depending on the target temperature
• Stability
  • Probe positioners placed inside vacuum chamber
  • Short and stable probe arms
  • Solid station frame with built-in vibration-isolation
  • Optional microscope bridge
  • Precise probe positioning
• Ease of Use
  • Joystick controller
  • Manual probe positioners with rotary feed-throughs
  • Front loading capability through load door
  • Comfortable and easy operation