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TESLA300 On-Wafer Power Semiconductor

TESLA300 On-Wafer Power Semiconductor

The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables the collection of accurate high-voltage and high-current measurement data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current), with complete operator safety.


Introducing the TESLA300 On-Wafer Power Semiconductor

The TESLA300 provides lab automation capabilities and enables high-power electrical measurements for device characterization, high-volume engineering and highly challenging applications. It is also ideally suited to customized solutions, niche production applications, and emerging markets.

Patented AttoGuard technology built in TESLA300 significantly improves low-leakage and low-capacitance measurements. In combination with FormFactor’s patented TESLA FemtoGuard™ thermal chuck technology, the TESLA300 provides a fully guarded and shielded test environment. The high-power TESLA FemtoGuard chuck also incorporates MicroVac™ technology enabling low-contact resistance, thin wafer handling and maximum power dissipation.

TESLA300 On-Wafer Power Semiconductor

TESLA300 On-Wafer Power Semiconductor

Key Features

Gold-plated TESLA High-power MicroVac™ Chucks:

  • Prevent thin wafers from curling and breaking
  • Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
  • Accurate Rds(on) measurement at high current
  • Accurate UIS measurements at high temperature

TUV-certified probing environment:

  • Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
  • Front, side and rear opening doors for ergonomic test setup and operation
  • Side panel with cable pass-through for easy equipment configuration
  • Full enclosure design (no light curtain) prevents accidentally tripping the safety interlock and stopping the test

Top-lift wafer loading:

  • Eliminates lift-pins from chuck for best-in-class power device measurements
  • Provides the lowest contact resistance from the wafer to the chuck
  • Supports fully automated testing up to 10kV by eliminating arcing point
  • Superior performance for vertical device measurements (no lift pin holes under device)

Rollout stage with quick access to auxiliary sites:

  • Full wafer access via locking roll-out stage
  • Two patented auxiliary chucks
  • Auxiliary chucks: High voltage 10 kV compatible multi-purpose mounts for substrates (cleaning, contact)
  • Automated probe cleaning capabilities

High-voltage/current Probes:

  • On-wafer power device characterization up to 10,000 V DC / 600 A
  • Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
  • Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement

Connection panels:

  • Coaxial, triaxial, and pin jack feed troughs are available
  • Limit cable strain and motion for measurement stability
  • Instrument stays connected to the back of the panel
  • Probe connection made at the front of a panel
  • Simple to re-arrange cabling when needed

Seamless Integration:

  • Convenient instrument connection kits
  • Seamless integration between Velox and analyzers/measurement software
  • Easy and safe system integration with Keysight and Keithley power device analyzers

3D Manual Controls:

  • Virtual Platen Lift and XY knobs at the front
  • Intuitive, and precise movement of the chuck in X, Y, and Z-direction
  • Platen Lift enables an extremely rapid and intuitive way of performing many alignment tasks like setting up the contact height

Material Handling Unit (MHU301):

  • For fast handling of 200/300 mm wafers
  • Load/unload wafer to hot/cold chuck (-60° C to +300° C)
  • Integrated pre-aligner for flat/notch detection
  • Barcode/2D Matrix code/OCR wafer code recognition from both sides (option)
  • Quick Access Port option for higher throughput and additional wafer storage
  • SEMI-compliant load port for up to 25 wafers
  • For FOUP and FOSB 300 mm wafer cassettes

Thermal Measurements:

  • Wide range of extremely performant, reliable thermal chuck systems from ATT
  • Flexibility from hot only to full thermal range of -60°C to +300°C
  • Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
  • Up to 15% faster transition times than other systems in the market
  • Patented MicroVac™ and FemtoGuard™ Technologies, providing ultra-low noise measurements and controlled leakage, the low residual capacitance for repeatability and advanced measurement accuracy and speed
  • Field-upgradeable: grows with your needs

Remote operation from home or anywhere in the world:

  • Safely and easily place probes down in contact with the test pads (full capability with motorized positioners)
  • Safely move the wafer to different test sites
  • View and manage live microscope viewing of the probes and the wafer
  • View Wafer Map test plans
  • Initiate remote test programs to gather and analyze test data

Velox Probe Station Control Software:

  • User-centred design minimizes training costs and enhances efficiency
  • Windows 10 compatibility enables the highest performance and safe operation with state-of-the-art hardware
  • Comprehensive alignment functions – from simple wafer alignment and mapping to advanced probe-to-pad alignment over multiple temperatures for autonomous semiconductor test
  • Simplified operation for inexperienced users: Reduced training costs with Workflow Guide and condensed graphical user interface
  • VeloxPro option: SEMI E95-compliant test executive software that enables simplified and safe automation of the entire wafer test cycle

Key Benefits

  • Scalable from semi-automated operation to the fully-automated prober
  • Superior high-voltage and high-current measurements
  • Safe and accurate hands-off testing with reliable and repeatable contact
  • Contact Intelligence enables unattended tests on small pads
  • Thermally-induced drift can be automatically corrected, enabling automated temperature transitions over the full temperature range using VueTrack (the effective temperature range and minimum obtainable pad size depend on the probe card and probe card holder or positioner used)
  • Fast delivery of a wide variety of precise model parameters to enhance the process and device development
  • Power semiconductor device characterization, DC/RF device characterization, WLR
  • The full thermal range of -60°C to +300°C, supported by a high thermal stability design
  • Usage of manual positioners and probe cards within an EMI-shielded environment

TESLA300 On-Wafer Power Semiconductor

Trust the Experts at ACA TMetrix Inc.

ACA TMetrix Inc. is a leading Canadian distributor of test and measurement instruments and design tools. For over 55 years we have provided products manufactured by the world’s leading instrument manufacturers. Leading Distributor of Design Tools and Test Equipment in Canada.


TESLA300 Specifications

TESLA300 Specifications

Download the datasheet for more information.



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