Metrology

Highlights MicroProf^® AP

• flexible multi-sensor metrology tool for advanced packaging
• for every process step from TSV etching, RDL/UBM/bumping to Cu nail reveal, dicing, stacking and molding

• wafer handling unit with SEMI-standard FOUPs/FOSBs and open cassettes
• individual configuration for your specific applications
• retrofit on demand

Highlights MicroProf^® DI

• High-precision optical surface inspection for semiconductor applications
• Metrology and Inspection flexibly combined in one fully automated platform
• Defect inspection with singleshot module, step camera and microscope station
• Fast and reliable inspection of defects down to sub-μm range
• Dark field micro inspection and bright field macro inspection

Highlights MicroProf^® FS

• multi-sensor technology and hybrid metrology for MEMS and Foundries
• customisable for a wide range of applications within the Wafer Foundry
• standardised and customer-specific solutions
• greatest possible flexibility
• handling of diverse substrate types
• powerful software for fully-automated 2D and 3D surface metrology
• equipment Front End Module (EFEM)

Highlights MicroProf^® FS

• fully automated 2D and 3D surface metrology for Front-End applications
• multi-sensor technology, based on the MicroProf^® 300
• specific inline solution
• wafer Handling Module
• equipment Front End Module (EFEM)

Highlights MicroProf^® MHU

• material handling unit with twin-arm robot
• high throughput, up to 220 w/h
• loading station for open cassettes
• OCR reader / Pre-aligner
• sorting function for the separation of good and bad samples
• optional SECS/GEM interface

• optical surface metrology at different sample temperatures
• programmable temperature control
• from 10°C to 400°C
• high heating and cooling rate
• temperature stability: < 1°C
• fully automated

• stand-alone tool
• 415 mm x 305 mm measuring range (lateral)
• high throughput, max. measuring speed 300 mm/sec
• fully automated and integrated production tool (optional)
• individually configurable
• TTV option for double-sided measurement

Highlights MicroProf^® 200

• stand-alone tool
• 200 mm x 250 mm measuring range (lateral)
• high throughput, max. measuring speed 300 mm/sec
• the standard – several hundred systems installed worldwide
• fully automated and integrated manufacturing device (optional)
• individually configurable

• compact desktop tool
• 150 mm x 100 mm measuring range (lateral)
• high measuring speed, max. 200 mm/s
• manual and automated measurement and evaluation
• individually configurable
• TTV option for double-sided measurement