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FormFactor (Cascade Microtech)- TESLA200- 200 mm semi-automated or fully-automated on-wafer power device characterization system

FormFactor (Cascade Microtech)- TESLA200- 200 mm semi-automated or fully-automated on-wafer power device characterization system

  • On-wafer power device characterization up to 10,000 V DC / 600 A
  • Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
  • Prevent thin wafers from curling and breaking
  • Accurate Rds(on) measurement at high current
  • Accurate UIS measurements at high temperature
  • Roll-out stage for full wafer access and easy wafer loading/unloading
  • Seamless integration between Velox and analyzers/measurement software
  • High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
  • Easy on-screen navigation, wafer mapping, and operation of accessories with Velox
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Description

Cascade TESLA200 automated wafer power device characterization

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TESLA200 Overview

Designed specifically for IGBT/power MOSFET (GaN, SiC, Si) device measurements at the wafer level, the new TESLA200 on-wafer power semiconductor probing system is engineered to provide accurate data up to 3, kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current). With next generation test capabilities, anti-arcing solutions, wafer automation, and support for both engineering probes and production probe cards, the TESLA200 now enables complete thermal testing (-55°C to 300 °C) with fully-automatic thinned/warped/TAIKO wafer loading. One system covers all on-wafer high power test needs, from R&D to niche production.

Applications: High Power

TESLA200 Key Features


High-voltage/current Probes

tesla-features-probes
  • On-wafer power device characterization up to 10,000 V DC / 600 A
  • Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
  • Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement

Gold-plated TESLA High-power MicroVac™ Chucks

  • Prevent thin wafers from curling and breaking
  • Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
  • Accurate Rds(on) measurement at high current
  • Accurate UIS measurements at high temperature
tesla200-feature-microvac-chuck
tesla200-feature-enclosure

Safety for Operator

  • Safety interlock system with clear enclosure for operator safety during device measurements
  • Roll-out stage for full wafer access and easy wafer loading/unloading

Seamless Integration

  • Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
  • Seamless integration between Velox and analyzers/measurement software
tesla200-feature-integration

Productivity

  • High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
  • Contact Intelligence enables higher yield, accurate Rds vertical device measurements over temperature automatically
  • Easy on-screen navigation, wafer mapping, and operation of accessories with Velox
Cascade TESLA200 automated wafer power device characterization

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