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FormFactor (Cascade Microtech)- TESLA200- 200 mm semi-automated or fully-automated on-wafer power device characterization system

FormFactor (Cascade Microtech)- TESLA200- 200 mm semi-automated or fully-automated on-wafer power device characterization system

  • On-wafer power device characterization up to 10,000 V DC / 600 A
  • Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
  • Prevent thin wafers from curling and breaking
  • Accurate Rds(on) measurement at high current
  • Accurate UIS measurements at high temperature
  • Roll-out stage for full wafer access and easy wafer loading/unloading
  • Seamless integration between Velox and analyzers/measurement software
  • High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
  • Easy on-screen navigation, wafer mapping, and operation of accessories with Velox
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Description

Cascade TESLA200 automated wafer power device characterization

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TESLA200 Overview

Designed specifically for IGBT/power MOSFET (GaN, SiC, Si) device measurements at the wafer level, the new TESLA200 on-wafer power semiconductor probing system is engineered to provide accurate data up to 3, kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current). With next generation test capabilities, anti-arcing solutions, wafer automation, and support for both engineering probes and production probe cards, the TESLA200 now enables complete thermal testing (-55°C to 300 °C) with fully-automatic thinned/warped/TAIKO wafer loading. One system covers all on-wafer high power test needs, from R&D to niche production.

Applications: High Power

TESLA200 Key Features


High-voltage/current Probes

tesla-features-probes
  • On-wafer power device characterization up to 10,000 V DC / 600 A
  • Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
  • Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement

Gold-plated TESLA High-power MicroVac™ Chucks

  • Prevent thin wafers from curling and breaking
  • Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
  • Accurate Rds(on) measurement at high current
  • Accurate UIS measurements at high temperature
tesla200-feature-microvac-chuck
tesla200-feature-enclosure

Safety for Operator

  • Safety interlock system with clear enclosure for operator safety during device measurements
  • Roll-out stage for full wafer access and easy wafer loading/unloading

Seamless Integration

  • Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
  • Seamless integration between Velox and analyzers/measurement software
tesla200-feature-integration

Productivity

  • High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
  • Contact Intelligence enables higher yield, accurate Rds vertical device measurements over temperature automatically
  • Easy on-screen navigation, wafer mapping, and operation of accessories with Velox
Cascade TESLA200 automated wafer power device characterization
Get in touch with us to inquire about our tailored consulting services.
Get in touch with us to inquire about our tailored consulting services.