Description
Cascade Autonomous DC Wafer Probing System
The Cascade Autonomous DC measurement assistant sets a new standard in wafer probing automation by combining FormFactor’s industry-leading Contact Intelligence™ technology with a fully autonomous measurement process. Designed for advanced semiconductor research, device characterization, and ultra-low noise testing, this system maximizes throughput, accuracy, and reliability.
With Autonomous DC, operators can start a test and let the system run continuously — during a shift, overnight, or even over the weekend — without requiring supervision. Its Contact Intelligence technology dynamically corrects probe placement on-the-fly, ensuring accurate pad contact despite thermal expansion or device shifts. This minimizes soak times, reduces measurement errors, and increases productivity across multiple thermal ranges.
The system is highly versatile, supporting both single and multi-DUT probe layouts. Using the Test Executive software, layouts can be easily managed for complete automation across different temperatures and device structures. Even less experienced operators can achieve expert-level results, as measurements are initiated with a single button press.
When paired with noise test equipment such as flicker noise, RTN, or phase noise analyzers, and integrated with the CM300xi-ULN probe station, Autonomous DC achieves the highest test throughput in the industry for ultra-low noise probing. Its ability to handle pads as small as 30 μm with low contact resistance ensures reliable results that accelerate device characterization and time-to-market.
By automating complex processes like probe-to-pad alignment and thermal transition management, Cascade Autonomous DC not only reduces manual workload but also enhances data quality. This makes it an ideal solution for organizations seeking precision, scalability, and efficiency in semiconductor testing.
Technical Highlights of Cascade Autonomous DC
| Feature | Details |
| Operation Mode | Fully autonomous 24/7 wafer probing with Contact Intelligence™ |
| Pad Size Capability | Down to 30 µm |
| Thermal Drift Compensation | Automatic probe re-alignment during soak and temperature changes |
| Noise Testing Integration | Flicker noise, RTN, phase noise with CM300xi-ULN |
| Probe Layouts | Supports single DUT and multi-DUT configurations |
| Ease of Use | One-button operation, suitable for less experienced operators |
| Throughput Advantage | Up to 4x faster flicker noise thermal testing |
| Unattended Measurement | Continuous testing overnight or over the weekend without intervention |
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