Discount Products: Look through products available for a 25% – 50% discount in 2020. The items provided on a first come, first serve basis. View Discounted Products
The DCP100 delivers the measurement accuracy needed for advanced on-wafer process, device characterization and reliability testing. With superior guarding and shielding, these probes overcome the performance limitations of non-coaxial needle probes. They are integrally designed as part of a complete measurement solution, these probes are highly reliable, stable and repeatable.
Advantages
Ultra-low, fA and fF measurements from -65 º C to 150 º C
Full electrical guard to the probe tip
Integrally designed as part of Cascade’s complete measurement solution
Highly reliable, stable and repeatable
Key Features
DCP 100 Series Probe Key Features
High-quality construction with low-noise electrical performance
Kelvin version for convenient 4-point measurements
Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
SSMC 50 connectors
Ultra-low, fA and fF measurements from -65 º C to 150 º C
Key Benefits
For full-triaxial current/voltage measurements using combined signal, guard and shield cables, the DCP-100 probe should be used with Cascade Microtech’s probing systems with MicroChamber®. The MicroChamber system provides full-EMI shielding around the wafer chuck and the probes, offering a fully-shielded, guarded, dark measurement environment. The triaxial connections from DC parametric semiconductor test instruments are then extended to the probe tip.
Trust the Experts at ACA TMetrix Inc.
ACA TMetrix Inc. is a leading Canadian distributor of test and measurement instruments and design tools. For over 55 years we have provided products manufactured by the world’s leading instrument manufacturers. Leading Distributor of Design Tools and Test Equipment in Canada.
The DCP-X probe is designed for engineers and scientists in device characterization, R&D, and testing, offering highly accurate and repeatable on-wafer electrical measurements (IV, CV, LFN). It uses MEMS technology to measure advanced devices (2, 3, 5 nm) on various pad materials, micro-bumps, and pads as small as 20 μm, reducing the need for retesting and cleaning while covering the full thermal range at lower testing costs. Compared to traditional probes, the DCP-X provides 1000x lower contact resistance, minimal skate, and over 500,000 contact cycles, ensuring precise measurements and longer probe life.
