Description
PAC200 Cryogenic Probe System Overview
The PAC200 cryogenic probe system is a high-performance solution engineered for precision wafer probing at cryogenic temperatures. Designed for wafers and substrates up to 200 mm, with an upgrade option for 300 mm, the PAC200 provides exceptional flexibility and accuracy for advanced testing environments. It enables semi-automated probing and can be upgraded with an autoloader to achieve fully automated cryogenic wafer probing, making it ideal for both research institutions and industrial laboratories.
Unmatched Flexibility for Advanced Testing
The PAC200 cryogenic probe system is built to support a wide range of applications, including DC, RF, MEMS, optoelectronic, and superconducting device characterization. Researchers can choose between liquid nitrogen, liquid helium, or a cryo-cooler for dry cooling, ensuring stable operation at temperatures as low as 10 K. Its flexible platform allows integration of up to eight probe positioners or a probe card, along with accessories such as black body radiation sources and optical motion analysis tools.
Precision and Stability at Every Step
Engineered for reliability, the PAC200 offers ice- and condensation-free probing down to 10 K. Its probe positioners are placed directly inside the vacuum chamber, minimizing signal loss and ensuring stable, repeatable measurements. The system’s robust frame with built-in vibration isolation and optional microscope bridge further enhances accuracy, delivering superior imaging quality for high-resolution microscopy.
User-Friendly Design with Powerful Software
The PAC200 combines ergonomic hardware with intelligent software for streamlined operation. A front-loading design makes handling wafers and DUTs fast and efficient, while manual positioners with rotary feed-throughs offer precise control. The integrated Velox Probe Station Control Software simplifies wafer alignment, mapping, and automated test execution. With features like the Workflow Guide and VeloxPro SEMI E95-compliant automation, users benefit from reduced training costs and improved productivity.
Whether for cutting-edge semiconductor research or high-volume industrial testing, the PAC200 cryogenic probe system delivers accuracy, reliability, and adaptability at cryogenic levels.
PAC200 Cryogenic Probe System Specifications
| Feature | Details |
| Wafer Size | Up to 200 mm (optional 300 mm) |
| Temperature Range | Down to 77 K (LN2) / 10 K (LHe or cryo-cooler) |
| Cooling Options | Liquid nitrogen, liquid helium, or dry cooling |
| Automation | Semi-automated, optional autoloader for full automation |
| Probe Capacity | Up to 8 positioners and/or probe card |
| Stability | Ice- and condensation-free probing below 7 K |
| Frame | Solid with built-in vibration isolation |
| Software | Velox Probe Station Control, VeloxPro automation option |
| Applications | DC, RF, MEMS, optoelectronics, superconductors |
| Ergonomics | Front loading, joystick control, quick DUT exchange |
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