Products

AIM-TTi 1908 Series – 5.5 Digit Dual Display Multimeter
High-performance, bench-top or portable multimeter for professional-grade precision and versatility.

Key Features:

• 5.5-digit resolution with dual display
• True RMS AC + frequency, capacitance & temperature measurements
• Dual measurement capability for parallel data monitoring
• USB standard (1908); USB, RS232, LAN/LXI on 1908P
• Optional GPIB interface (1908P)
• Powered by AC mains or internal rechargeable batteries
• High accuracy up to 0.02%, resolution down to 1µV and 0.1µA
• Ideal for both laboratory and field applications
• PC-Link software included for remote control and data logging

A precision AC power supply designed for EMC testing, pre-compliance setups, and product development labs.

Key Features:

• 1000W power output at 230V
• Low harmonic distortion for clean AC testing
• Delivers up to 4.4A RMS and 10A peak currents
• EN61000–3–2 compliant for harmonic emissions
• Available with UK, Schuko, or USA sockets
• Comprehensive built-in overload protection
• Simple connection via standard power connectors

Reliable, flexible, and programmable power delivery for bench, system, and ATE applications.

Key Features:

• PowerFlex technology for variable V/A within power limits
• Up to 60V and 20A, 180W or 420W per output
• Dual or single isolated outputs
• CV or CC operation with settings lock (S-Lock)
• Selectable OVP trips and remote sense terminals
• RS232, USB, LAN/LXI standard on P models
• GPIB available as option (P models only)
• Compact, rugged 3U quarter or half rack design
• Analog remote control (CPX400SA model)

Broadband RF Amplifiers from Exodus Advanced Communications deliver powerful and reliable signal amplification across a wide frequency spectrum. Designed for demanding RF environments, these solid state power amplifiers provide excellent gain stability, wide bandwidth coverage, and scalable output power. With support for advanced semiconductor technologies and flexible system formats, these broadband RF amplifiers are ideal for defense electronics, RF communications, radar systems, and EMC testing platforms.

Key Features

• Wide frequency coverage from 1 MHz to 18 GHz
• Solid state power amplifier architecture for reliable RF performance
• Output power scalable up to 300 W for modules and 1300 W for systems
• Advanced semiconductor technologies including LDMOS, GaN, and GaAsFET
• Continuous wave and linearized amplifier designs for signal accuracy
• High gain stability for consistent RF signal amplification
• Octave and decade bandwidth capability for flexible RF applications
• Rugged components designed for demanding environments
• Available in benchtop, rackmount, and modular configurations
• Suitable for radar systems, RF immunity testing, and communication platforms

Cascade Autonomous DC delivers fully automated DC wafer probing with unmatched precision and efficiency powered by Contact Intelligence™.

Key Features:

• Autonomous DC wafer probing with hands-free 24/7 operation
• Contact Intelligence™ technology for dynamic probe correction and reliable pad placement
• High throughput with up to 4x faster flicker noise thermal testing on pads as small as 30 µm
• Unattended operation for overnight or weekend testing without user intervention
• Automatic probe alignment compensating for thermal drift to reduce soak time
• Flexible probe layouts supporting single DUT and multi-DUT configurations
• Ease of use – start testing with just one button, ideal for operators at all levels

Cascade Autonomous RF delivers fully automated RF and mm-wave wafer probing with Contact Intelligence™ for unmatched accuracy and efficiency.

Key Features:

• Autonomous RF wafer probing with hands-free 24/7 operation
• Contact Intelligence™ for on-the-fly probe correction and pad placement
• Automatic calibration up to 500 GHz with WinCal XE software
• Calibration drift monitoring with auto re-calibration when needed
• Reduced soak time through dynamic probe re-alignment across temperatures
• Unattended operation for continuous overnight and weekend testing
• Supports 200 mm and 300 mm probe stations including CM300xi, SUMMIT200, Summit 12000, and Elite 300
• Simplified one-button operation, suitable for operators at all levels

Cascade Autonomous Silicon Photonics delivers fully automated wafer and die-level photonics probing with Contact Intelligence™ for unmatched accuracy.

Key Features:

• Flexible vertical and edge coupling with single fibers or fiber arrays
• OptoVue™ technology for real-time in-situ calibrations
• Exclusive TopHat environment for dark, frost-free thermal testing (-40°C to +125°C)
• Sub-micron placement accuracy with Z displacement sensing
• Collision avoidance technology for safe fiber alignment
• SiPh-Tools software for automated alignment, calibration, and data management
• Partnership with Keysight and PI for seamless instrumentation and precision positioning
• Available on CM300xi-SiPh and SUMMIT200 probe stations

Cascade CM300xi – 300 mm Semi-/Fully-Automated Probe System

Key Features:

• Supports DC, AC, RF/microwave, WLR, FA, and design debug applications
• Wide thermal range from -60°C to +300°C with IceShield or TopHat compatibility
• Reliable, repeatable probe contact in a moisture-free, EMI-shielded environment
• Contact Intelligence™ technology for autonomous alignment and accurate measurements
• Modular design with upgrade paths for semi- or fully-automated configurations
• Handles up to 50 wafers with SEMI-standard cassette automation
• Fast transition times with MicroVac™ and FemtoGuard™ low-noise technologies
• Intuitive Velox software and Velox Dash™ touchscreen interface for simplified operation

Engineered for precision and safety, the EPS150TESLA delivers accurate on-wafer power device characterization up to 3,000 V and 100 A, making it a trusted choice for high-voltage and high-current testing.

Key Features:

• On-wafer power device characterization up to 3,000 V (triaxial) / 10,000 V (optional coaxial).
• High-current probing up to 100 A with ultra-low contact resistance.
• Triax chuck design for accurate low-leakage measurements.
• Shielded test environment with advanced grounding and arcing protection.
• Seamless integration with analyzers via SIGMA kit and optimized signal path.
• Safe probe tip exchange and thin-wafer handling capability.

Cascade EPS200MMW mmW and THz Probe System

Key Features:

• Complete mmW, THz, and load-pull measurement solution.
• Accurate probing up to 500 GHz with T-Wave Probes and VDI Extenders.
• SlimVue Microscope with 1 μm resolution and quick lens exchange.
• Resolves pads smaller than 50 μm with precision optics.
• Sigma Application Kits for broadband, load-pull, coax RF, and waveguide setups.
• Rock-solid mechanical design with submicron stage accuracy.
• Motorized positioner with ±1 μm separation repeatability.
• Stable and repeatable probe placement for THz frequencies.

Cascade EPS200RF 200 mm Manual Probe System

Key Features:

• Complete RF measurement package up to 67 GHz.
• Based on the PM8 platform for stability and flexibility.
• Supports Infinity, ACP, and |Z| probe technologies for different material types.
• High precision probing with RF chuck ±3 μm planarity.
• 500 μm platen stroke with ≤±1 μm accuracy for repeatable contact.
• Reliable probing for pads as small as 25 µm x 35 µm.
• Includes matching cables, substrates, and WinCal XE calibration software.
• Delivers accurate S-parameter measurements with automated calibration.

Key Features:

• 150 mm modular probe station with customizable base and starter kits.
• Flexible options for IV/CV, RF, mmWave, THz, high power, and failure analysis.
• Solid frame with built-in vibration isolation for measurement stability.
• Supports advanced microscopes, triax, coax, and RF chucks.
• Seamless integration with leading measurement instruments.
• Ergonomic design with quick pull-out stage for fast device handling.
• Re-configurable and upgradable to grow with future testing needs.

Cascade MPS150-SiPh Manual Silicon Photonics Probe Station

Key Features:

• Cost-effective entry-level photonics probe station.
• Supports surface coupling and horizontal edge coupling.
• Retro-mirror technology for precise fiber alignment.
• Tip-tilt base positioner with 6 degrees of freedom.
• Compatible with single fibers and fiber arrays.
• Optional eVue digital imaging or SlimVue high-performance microscope.
• Modular, upgradable design with platen extensions.
• Ergonomic and intuitive for users of all experience levels.

Cascade PAV200 – 200 mm Semi-Automated Vacuum Probe System

Key Features:

• Supports wafers and substrates up to 200 mm (optional upgrade to 300 mm)
• Operates in high vacuum down to < 1×10⁻⁴ mbar
• Semi-automated control with joystick and software-driven chuck movement
• Up to eight probe positioners and/or probe card integration
• Optional thermal chuck with -60°C to 300°C range
• Solid frame with vibration isolation for stable, accurate measurements
• Wide application support: DC, RF, MEMS, and optoelectronics
• Velox software for wafer alignment, mapping, and simplified automation

The Cascade PLC50 is a precise, cost-effective cryogenic wafer probing system designed for research labs. It enables testing down to 77 K with liquid nitrogen or below 7 K with liquid helium, supporting DC, RF, MEMS, and optoelectronic measurements.

Key Features:

• Compatible with wafers up to 100 mm and single dies.
• Operates at 77 K (LN₂) or < 7 K (LHe).
• Up to six positioners for flexible probing.
• Independently cooled cold shield ensures stable, accurate results.
• Ice- and condensation-free probing in vacuum conditions.
• Ergonomic design with hinged lid and easy microscope access.
• Independent chuck stage and positioner control for high throughput.

Cascade PM8 200 mm Manual Probe System

Key Features:

• Stable granite base for vibration-free measurements.
• Submicron precision with 1 µm repeatable separation stroke.
• Configurable for DC, RF, mmW, sub-THz, FA, MEMS, and opto-engineering.
• 40 mm platen height adjustability for flexible setups.
• Supports thermal chucks, motorized microscopes, and dark box options.
• Double-side probing for frontside and backside device access.
• Ergonomic and low-profile design for easy wafer handling.
• Upgradeable platform with accessories for future needs.