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  • Cascade SUMMIT200 Advanced 200 mm Probe Station

    Key Features:

    • High-accuracy electrical measurements for DC, RF, mmW, and THz applications.
    • Up to 5X faster time to accurate data with automated wafer handling.
    • Wide thermal range from -60°C to +300°C with IceShield™.
    • PureLine™, AttoGuard®, and MicroChamber® technologies for ultra-low noise performance.
    • Precision sub-micron positioning with advanced 4-axis stage and VueTrack PRO.
    • Flexible platform for device characterization, FA, WLR, and design debug.
    • Velox control software with modern UI, workflow guide, and automation tools.
    • Ergonomic operation with quick manual wafer access and roll-out stage.

     

  • Cascade TESLA300 is a 300 mm semi- and fully-automated probe system for advanced on-wafer power device characterization, ensuring safe, precise, and high-power testing.

    Key Features:

    • On-wafer device testing up to 10,000 V DC / 600 A
    • AttoGuard™ and FemtoGuard™ chuck technologies for low-leakage, high-accuracy measurements
    • MicroVac™ chuck ensures thin wafer stability and minimal contact resistance
    • TÜV-certified safety system with full enclosure and interlocks
    • Wide thermal range: -60°C to +300°C with TopHat chamber
    • Roll-out chuck and auxiliary mounts for flexible wafer handling
    • Remote operation and full software integration with Velox and analyzers
    • Material Handling Unit (MHU301) for automated wafer loading and barcode recognition

     

  • Cascade CM300xi-SiPh Probe System – 300 mm Wafer and Die-Level Photonics Testing

    Key Features:

    • Integrated silicon photonics wafer and die-level probing solution.
    • Autonomous SiPh Measurement Assistant for hands-free calibration.
    • OptoVue™ technology for real-time, in-situ optical calibrations.
    • Supports vertical, horizontal edge, and wafer-level edge coupling.
    • Dark, shielded, frost-free environment with SiPh TopHat.
    • Thermal capability from -40°C to +125°C.
    • Exclusive SiPh-Tools and Photonics Controller Interface (PCI) software.
    • Partnerships with Keysight and PI for precision instrumentation.
    • Easy setup and automation with Velox and Velox Dash™ interface.

     

  • Cascade CM300xi-ULN Probe System – Ultra Low Noise 300 mm Wafer Prober

    Key Features:

    • Ultra-low noise measurements with patented PureLine™ 3 technology.
    • Ideal for flicker noise (1/f), RTN, and phase noise testing of ultra-sensitive devices.
    • Fully shielded MicroChamber™ for EMI/RFI protection and frost-free low-temperature operation.
    • Plug-and-Go TestCell Power Management eliminating ground-loop noise.
    • Autonomous 24/7 operation with optimized motorized probe positioners.
    • Wide thermal range from -65°C to +300°C with fA/fF measurement precision.
    • Integrated Velox software for simple, efficient automation.

     

  • The ECO-710E/810E ThermoStream® systems are eco-friendly temperature forcing solutions designed for precise electronic testing, delivering fast temperature transitions with quiet, energy-efficient operation.

    Key Features:

    • Wide temperature range: -80°C to +225°C
    • Eco-friendly design compliant with EU 517/2014 (no annual leak testing)
    • Quiet operation at just 56 dBA
    • Energy-efficient performance on a 20-amp circuit
    • Rapid temperature transitions for consistent results
    • Touchscreen controls with embedded software (no Windows® OS)
    • No need for LN2 or LCO2 cooling agents
    • Remote setup and communication capabilities
    • Ideal for 24/7/365 lab or production use

     

  • A compact and flexible semi-automated wafer probe system designed for RF/DC modeling, device characterization, and advanced measurement needs.

    Key Features:

    • Mechanical platen lift for safer RF set-ups and reduced operator errors
    • Fully compatible with Autonomous RF/DC measurement assistants and Velox Dash™ app
    • Reconfigurable platen inserts (TopHat, PCH, IceShield) for versatile test configurations
    • Spacious platen design supporting RF and DC setups with ease
    • Compact footprint with field-upgradable components
    • Integrated Low-Volume MicroChamber and FemtoGuard thermal triaxial chuck

     

  • Key Features

    • Supports wafers up to 200 mm (optional 300 mm upgrade)
    • Operates at cryogenic temperatures down to 10 K
    • Semi-automated with optional full automation via autoloader
    • Compatible with liquid nitrogen, liquid helium, or cryo-cooler
    • Ice- and condensation-free probing for stable performance
    • Up to eight probe positioners or probe card integration
    • Solid vibration-isolated frame for precision measurements
    • Velox software with intuitive alignment and automation

     

  • Key Features

    • Entry-level manual wafer probing in vacuum < 1×10⁻⁴ mbar
    • Supports wafers up to 150 mm or single dies
    • Up to six probe positioners for flexible testing
    • Optional thermal chuck from -60°C to +300°C
    • Probing possible with open chamber lid at atmosphere
    • Stable, vibration-isolated frame for precise results
    • Ergonomic design with hinged topside lid for easy access
    • Independent control of chuck stage and positioners
    • Fast, manual step-and-repeat wafer testing

     

  • Cascade PM300 – 300 mm Analytical Probe Station

    Key Features:

    • Industry benchmark for manual wafer probing and failure analysis.
    • Superior mechanical stability with granite base for precision and repeatability.
    • High-precision probe positioning with independent X-Y coarse and fine adjustments.
    • Configurable for DC, RF, mmW, WLR, FA, and 3D IC testing.
    • Wide thermal range: -60°C to +200°C (PM300PS) / +15°C to +300°C (PM300).
    • Optional electromagnetic shielding (PM300PS) for ultra-low-noise environments.
    • Spacious, ergonomic design supporting up to 12 positioners.
    • Upgradeable platform to support future testing needs.

     

  • RapidTemp™ BT28 ThermoStream® Benchtop Thermal Test System

    Key Features:

    • Compact and lightweight design under 80 lbs (38 kg) for easy benchtop integration
    • Wide temperature range from -28°C to +225°C for versatile testing
    • High airflow capacity of 14 scfm for precise and reliable temperature forcing
    • SwiftTherm™ technology for ultra-fast temperature transitions
    • Detachable 9 ft. touchscreen interface for flexible operation
    • ECO-Stream design: quieter, smaller, and energy-efficient
    • Embedded control system with Ethernet, IEEE-488, RS232, and USB connectivity
    • Customizable test setups with data logging via USB storage

     

  • Cascade TESLA300 – Advanced On-Wafer Power Device Characterization

    Key Features:

    • High-voltage and high-current testing up to 10 kV / 600 A.
    • Integrated AttoGuard™ and FemtoGuard™ technology for ultra-low leakage and capacitance.
    • MicroVac™ chuck surface for thin wafer handling and low contact resistance.
    • TÜV-certified safety system with interlocks and full enclosure.
    • Top-lift wafer loading eliminates lift pins for accurate vertical device measurements.
    • Full thermal range from -60°C to +300°C with efficient transition times.
    • Seamless integration with Keysight and Keithley analyzers.
    • Remote operation capability for safe offsite control.
    • Velox and Velox Dash™ software for intuitive automation.

     

  • Key Features:

    • Wide temperature range from -65°C to +300°C
    • Compatible with 150mm, 200mm, and 300mm wafer sizes
    • Options for mechanical refrigeration, glycol/water, or air cooling
    • Heating methods: ThermoElectric or Resistive, depending on model
    • Retrofits available for existing probe stations
    • Customizable surface plating: gold or nickel
    • Supports advanced applications like low leakage probing (fA level) and high-voltage probing (up to 10kV)

     

  • ThermoSpot Systems – Benchtop Direct Contact Cooling and Heating Solution

    The Temptronic® ThermoSpot® delivers high-performance temperature control for IC testing and high-Watt devices with unmatched cooling capacity.

    Key Features:

    • Reliable thermal cycling without thermoelectric modules
    • Wide temperature range: -65°C to +175°C
    • Cooling power: 40W at -40°C, 55W at -55°C, 120W at -40°C
    • Fast transitions: <35 seconds from +25°C to -40°C
    • Secure thermal contact with ThermoBridge™ design
    • Touch-screen with data logging and programmable settings
    • Multiple communication ports: Ethernet, USB, IEEE, RS232

     

  • ThermoSpot® Systems – Direct Contact Thermal Test Solutions

    Key Features:

    • Temperature range: -65°C to +175°C
    • Cooling power up to 120W at -40°C
    • Fast transition rate (<35 sec from +25°C to -40°C)
    • Reliable thermal cycling without thermoelectric modules
    • Flexible thermal probe with interchangeable ThermoBridge™
    • Touchscreen controller with programmable profiles
    • Connectivity options: Ethernet, USB, IEEE, RS232
    • Easy, secure connection to in-circuit or socketed DUTs

  • The EMI 64k software allows to embed the TDEMI systems in a fully automated test environment.

    • Full automation of EMI testing according to all commercial and military standards
    • Automated control of turntable, antenna and other equipment
    • Height and Angular Scan
    • Procedures according to standards as well as customized procedures
    • Reducing the cost for EMC and communication testing and certification by tailored packages

     

  • The measurement system for all emission measurments in the frequency range 1 Hz – 44 GHz.

    • Frequency Range  1 Hz – 30MHz, 1GHz, 3GHz, 6GHz, 9GHz, 18GHz, 26GHz, 40 GHz and 44GHz
    • 225 MHz Real-time Analysis Bandwidth
    • Weighted Real-time Spectrogram up to 44 GHz
    • CISPR Bandwidths 200 Hz, 9 kHz, 120 kHz, 1 MHz
    • MIL/DO Bandwidths 10 Hz, 100 Hz, 1 kHz, 10 kHz, 100 kHz, 1 MHz