Products

Cascade SUMMIT200 Advanced 200 mm Probe Station

Key Features:

• High-accuracy electrical measurements for DC, RF, mmW, and THz applications.
• Up to 5X faster time to accurate data with automated wafer handling.
• Wide thermal range from -60°C to +300°C with IceShield™.
• PureLine™, AttoGuard®, and MicroChamber® technologies for ultra-low noise performance.
• Precision sub-micron positioning with advanced 4-axis stage and VueTrack PRO.
• Flexible platform for device characterization, FA, WLR, and design debug.
• Velox control software with modern UI, workflow guide, and automation tools.
• Ergonomic operation with quick manual wafer access and roll-out stage.

Cascade TESLA300 is a 300 mm semi- and fully-automated probe system for advanced on-wafer power device characterization, ensuring safe, precise, and high-power testing.

Key Features:

• On-wafer device testing up to 10,000 V DC / 600 A
• AttoGuard™ and FemtoGuard™ chuck technologies for low-leakage, high-accuracy measurements
• MicroVac™ chuck ensures thin wafer stability and minimal contact resistance
• TÜV-certified safety system with full enclosure and interlocks
• Wide thermal range: -60°C to +300°C with TopHat chamber
• Roll-out chuck and auxiliary mounts for flexible wafer handling
• Remote operation and full software integration with Velox and analyzers
• Material Handling Unit (MHU301) for automated wafer loading and barcode recognition

Cascade CM300xi-SiPh Probe System – 300 mm Wafer and Die-Level Photonics Testing

Key Features:

• Integrated silicon photonics wafer and die-level probing solution.
• Autonomous SiPh Measurement Assistant for hands-free calibration.
• OptoVue™ technology for real-time, in-situ optical calibrations.
• Supports vertical, horizontal edge, and wafer-level edge coupling.
• Dark, shielded, frost-free environment with SiPh TopHat.
• Thermal capability from -40°C to +125°C.
• Exclusive SiPh-Tools and Photonics Controller Interface (PCI) software.
• Partnerships with Keysight and PI for precision instrumentation.
• Easy setup and automation with Velox and Velox Dash™ interface.

Cascade CM300xi-ULN Probe System – Ultra Low Noise 300 mm Wafer Prober

Key Features:

• Ultra-low noise measurements with patented PureLine™ 3 technology.
• Ideal for flicker noise (1/f), RTN, and phase noise testing of ultra-sensitive devices.
• Fully shielded MicroChamber™ for EMI/RFI protection and frost-free low-temperature operation.
• Plug-and-Go TestCell Power Management eliminating ground-loop noise.
• Autonomous 24/7 operation with optimized motorized probe positioners.
• Wide thermal range from -65°C to +300°C with fA/fF measurement precision.
• Integrated Velox software for simple, efficient automation.

A compact and flexible semi-automated wafer probe system designed for RF/DC modeling, device characterization, and advanced measurement needs.

Key Features:

• Mechanical platen lift for safer RF set-ups and reduced operator errors
• Fully compatible with Autonomous RF/DC measurement assistants and Velox Dash™ app
• Reconfigurable platen inserts (TopHat, PCH, IceShield) for versatile test configurations
• Spacious platen design supporting RF and DC setups with ease
• Compact footprint with field-upgradable components
• Integrated Low-Volume MicroChamber and FemtoGuard thermal triaxial chuck

Key Features

• Supports wafers up to 200 mm (optional 300 mm upgrade)
• Operates at cryogenic temperatures down to 10 K
• Semi-automated with optional full automation via autoloader
• Compatible with liquid nitrogen, liquid helium, or cryo-cooler
• Ice- and condensation-free probing for stable performance
• Up to eight probe positioners or probe card integration
• Solid vibration-isolated frame for precision measurements
• Velox software with intuitive alignment and automation

Key Features

• Entry-level manual wafer probing in vacuum < 1×10⁻⁴ mbar
• Supports wafers up to 150 mm or single dies
• Up to six probe positioners for flexible testing
• Optional thermal chuck from -60°C to +300°C
• Probing possible with open chamber lid at atmosphere
• Stable, vibration-isolated frame for precise results
• Ergonomic design with hinged topside lid for easy access
• Independent control of chuck stage and positioners
• Fast, manual step-and-repeat wafer testing

Cascade PM300 – 300 mm Analytical Probe Station

Key Features:

• Industry benchmark for manual wafer probing and failure analysis.
• Superior mechanical stability with granite base for precision and repeatability.
• High-precision probe positioning with independent X-Y coarse and fine adjustments.
• Configurable for DC, RF, mmW, WLR, FA, and 3D IC testing.
• Wide thermal range: -60°C to +200°C (PM300PS) / +15°C to +300°C (PM300).
• Optional electromagnetic shielding (PM300PS) for ultra-low-noise environments.
• Spacious, ergonomic design supporting up to 12 positioners.
• Upgradeable platform to support future testing needs.

Cascade TESLA300 – Advanced On-Wafer Power Device Characterization

Key Features:

• High-voltage and high-current testing up to 10 kV / 600 A.
• Integrated AttoGuard™ and FemtoGuard™ technology for ultra-low leakage and capacitance.
• MicroVac™ chuck surface for thin wafer handling and low contact resistance.
• TÜV-certified safety system with interlocks and full enclosure.
• Top-lift wafer loading eliminates lift pins for accurate vertical device measurements.
• Full thermal range from -60°C to +300°C with efficient transition times.
• Seamless integration with Keysight and Keithley analyzers.
• Remote operation capability for safe offsite control.
• Velox and Velox Dash™ software for intuitive automation.

The EMI 64k software allows to embed the TDEMI systems in a fully automated test environment.

• Full automation of EMI testing according to all commercial and military standards
• Automated control of turntable, antenna and other equipment
• Height and Angular Scan
• Procedures according to standards as well as customized procedures
• Reducing the cost for EMC and communication testing and certification by tailored packages

The measurement system for all emission measurments in the frequency range 1 Hz – 44 GHz.

• Frequency Range  1 Hz – 30MHz, 1GHz, 3GHz, 6GHz, 9GHz, 18GHz, 26GHz, 40 GHz and 44GHz
• 225 MHz Real-time Analysis Bandwidth
• Weighted Real-time Spectrogram up to 44 GHz
• CISPR Bandwidths 200 Hz, 9 kHz, 120 kHz, 1 MHz
• MIL/DO Bandwidths 10 Hz, 100 Hz, 1 kHz, 10 kHz, 100 kHz, 1 MHz

The measurement system for all emission measurments in the frequency range 1 Hz – 44 GHz.

• Full compliance EMI Reciever according to standard CISPR 16-1· 1, ANSI C63.2, MIL->461, and DO·160
• Spectrum Analyzer
• Integrated LOW Noise Ampllfier (lNAI)
• Integrated Preselect1on
• Tradttional and FFT·based Mode
• Automatic Stepped Attenuator
• Ultra Low Noise Floor
• Excellent spurious Performance
• Real-time Spectrum Analyzer optional
• Vast IQ-Bandwidth

TDEMI Mobile+. The ultra mobile EMI receiver – Emission measurements everytime, everywhere. Fully stand-alone operable.

• Frequency Ranges 10Hz – 1GHz, 3GHz, 6GHz or 7GHz
• 16000x faster than conventional receivers
• Super compact design and 12V supply
• 225 MHz fully gapless real-time analysis bandwidth
• Weighted Real-time Spectrogram

Ultra High Performance RT Spectrum Analyzer. Ultrafast EMI Measurements.

• Frequency Range from 1 Hz up to 50 GHz
• 225 MHz Real-time analysis bandwidth
• 100 dB Dynamic Range
• Ultrahigh performance preselection in all modes
• Up to 510 MHz Real-time IQ-Analysis bandwidth
• Ultra High Performance Spectrum Analyzer

• Frequency Range 10 Hz – 1GHz, 3GHz or 6GHz
• 4000x faster in your pre-certifcation work
• compact design and +12V power supply
• 162.5 MHz full gapless real-time analysis bandwidth
• Weighted Real-time Spectrogram

• requency Range from DC up to 40 GHz
• 685 MHz Real-time analysis bandwidth
• Dynamic range of more than 100 dB
• Multi-GHz real-time scanning up to 40 GHz
• all 6dB RBWs acc. to CISPR, MIL, DO, ANSI, FCC
• fastest super-heterodyn receiver on the planet