Products

Featuring an ultra-compact 0.35”microLED display with high-brightnessand high-resolution technology,delivering dynamic visuals and seamlessintegration for next-generationautomotive heads-up display (HUD).

Key Features of High Brightness High Resolution 0.35″ Micro-Display:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Power-Efficient Design: Consumes significantly less powercompared to traditional display technologies, extendingbattery life for wearable devices.

Showcasing a large 10” panel withultra-bright, energy-efficientmicroLED technology, deliveringdynamic visuals and seamlessintegration for next-generationintelligent vehicles.

Ket Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Vibrant RGB Color Reproduction: Delivers rich, high-contrast visuals with precise color accuracy, enhancingvisuals for display applications.

Advancing automotive displayswith ultra-bright, energy-efficientmicroLED technology, enablingdynamic visuals and seamlessintegration for next-generationintelligent vehicles.

Key Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Vibrant RGB Color Reproduction: Delivers rich, high-contrast visuals with precise color accuracy, enhancingvisuals for display applications.

Revolutionizing automotivelighting with ultra-bright, energy-efficient microLED displays,enabling adaptive illuminationand seamless integration for next-generation intelligent vehicles.

Key Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Segment-Driven Intelligence: Enables optimal messagingthrough precisely controlled lighting segments, enhancingintelligent lighting capabilities for smart automotiveapplications and other high-performance devices.

Transforming automotive lightingwith ultra-bright, energy-efficientmicroLED displays, deliveringprecision illumination andseamless integration for next-generation vehicles.

Key Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellentvisibility in both indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Power-Efficient Design: Consumes significantly lesspower compared to traditional display technologies.

The DCP-X probe is designed for engineers and scientists in device characterization, R&D, and testing, offering highly accurate and repeatable on-wafer electrical measurements (IV, CV, LFN). It uses MEMS technology to measure advanced devices (2, 3, 5 nm) on various pad materials, micro-bumps, and pads as small as 20 μm, reducing the need for retesting and cleaning while covering the full thermal range at lower testing costs. Compared to traditional probes, the DCP-X provides 1000x lower contact resistance, minimal skate, and over 500,000 contact cycles, ensuring precise measurements and longer probe life.

• 3GHz RF analog signal generator
• AM, FM, PM, Sweep & Pulse Modulation
• Exceptionally Low Phase Noise of -145dBc/Hz @100MHz and 10@kHz offset
• Field ready, with 10” touch screen suited for day and night use and 2 hour battery operation
• Remotely programmable via MATLAB, Python, LabVIEW and other software programming environments.
• Removable uSD card for instrument security

The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables the collection of accurate high-voltage and high-current measurement data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current), with complete operator safety.

• High voltage output to 300Vp-p (±150V)
• Output current to 150 mA
• Full power bandwidth from DC to >500kHz
• Slew rate to 200V/µs
• Low distortion
• Low cost
• Custom Configuration of gain and signal Ground

• Single channel
• High voltage output to 400Vp-p (±200V)
• Output current to 125 mA
• Full power bandwidth from DC to >500kHz
• Slew rate to 400V/µs
• Monitor Output
• Precise signal amplification for multiple applications
• Compatible with any of the Tabor waveform generators

• High voltage output to 300Vp-p (±150V)
• Output current to 100 mA per channel
• Full power bandwidth from DC to >500kHz
• Slew rate to 200V/µs
• Low distortion
• Low cost
• Custom Configuration of: Gain, Signal Ground

• 12GHz RF Analog Signal Generator
• Extremely fast switching speed of <100μs
• AM, FM, PM Sweep & Pulse Modulation
• Extra small, compact module platform
• Exceptionally Low Phase Noise of -145dBc/Hz @100MHz and 10@kHz offset
• SPI and micro-USB integrated interfaces
• Remotely programmable via MATLAB, Python, LabVIEW
• and other software programming environments.
• Flixible modular platform for OEM and custom requirements
• and applications, to satisfy specific customer demands.
• Multi instrument synchronization capability

• 3 GHz RF Analog Signal Generator
• Extremely fast switching speed of <100μs
• AM, FM, PM Sweep & Pulse Modulation
• Extra small, compact module platform
• Exceptionally Low Phase Noise of -145dBc/Hz @100MHz and 10@kHz offset
• SPI and micro-USB integrated interfaces
• Remotely programmable via MATLAB, Python, LabVIEW
• and other software programming environments.
• Flixible modular platform for OEM and custom requirements
• and applications, to satisfy specific customer demands.
• Multi instrument synchronization capability

• 6GHz RF Analog Signal Generator
• Extremely fast switching speed of <100μs
• AM, FM, PM Sweep & Pulse Modulation
• Extra small, compact module platform
• Exceptionally Low Phase Noise of -145dBc/Hz @100MHz and 10@kHz offset
• SPI and micro-USB integrated interfaces
• Remotely programmable via MATLAB, Python, LabVIEW
• and other software programming environments.
• Flixible modular platform for OEM and custom requirements
• and applications, to satisfy specific customer demands.
• Multi instrument synchronization capability

• Vector Network Analyzer (option up to 26.5GHz)
• WinCal XE calibration software
• Uses best measurement practices for optimized measurements
• Known measurement accuracy traced back to independent standards
• Supported by the measurement experts to make you successful
• Best in class RF performance
• Small benchtop footprint
• Industry standard calibration techniques
• Extended 2 Year warranty on FormFactor products for educational customers

• Re-configurable for DC, RF, mmW, FA, WLR and more
• table and repeatable measurements over a wide thermal range
• Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
• Minimize AC and spectral noise
• Manual 3-axis stage with ergonomic controls
• Fast, accurate “hands on” wafer positioning
• Quick, safe, and comfortable wafer access