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  • Cascade SUMMIT200 Advanced 200 mm Probe Station

    Key Features:

    • High-accuracy electrical measurements for DC, RF, mmW, and THz applications.
    • Up to 5X faster time to accurate data with automated wafer handling.
    • Wide thermal range from -60°C to +300°C with IceShield™.
    • PureLine™, AttoGuard®, and MicroChamber® technologies for ultra-low noise performance.
    • Precision sub-micron positioning with advanced 4-axis stage and VueTrack PRO.
    • Flexible platform for device characterization, FA, WLR, and design debug.
    • Velox control software with modern UI, workflow guide, and automation tools.
    • Ergonomic operation with quick manual wafer access and roll-out stage.

     

  • Cascade TESLA300 is a 300 mm semi- and fully-automated probe system for advanced on-wafer power device characterization, ensuring safe, precise, and high-power testing.

    Key Features:

    • On-wafer device testing up to 10,000 V DC / 600 A
    • AttoGuard™ and FemtoGuard™ chuck technologies for low-leakage, high-accuracy measurements
    • MicroVac™ chuck ensures thin wafer stability and minimal contact resistance
    • TÜV-certified safety system with full enclosure and interlocks
    • Wide thermal range: -60°C to +300°C with TopHat chamber
    • Roll-out chuck and auxiliary mounts for flexible wafer handling
    • Remote operation and full software integration with Velox and analyzers
    • Material Handling Unit (MHU301) for automated wafer loading and barcode recognition

     

  • Cascade CM300xi-SiPh Probe System – 300 mm Wafer and Die-Level Photonics Testing

    Key Features:

    • Integrated silicon photonics wafer and die-level probing solution.
    • Autonomous SiPh Measurement Assistant for hands-free calibration.
    • OptoVue™ technology for real-time, in-situ optical calibrations.
    • Supports vertical, horizontal edge, and wafer-level edge coupling.
    • Dark, shielded, frost-free environment with SiPh TopHat.
    • Thermal capability from -40°C to +125°C.
    • Exclusive SiPh-Tools and Photonics Controller Interface (PCI) software.
    • Partnerships with Keysight and PI for precision instrumentation.
    • Easy setup and automation with Velox and Velox Dash™ interface.

     

  • Cascade CM300xi-ULN Probe System – Ultra Low Noise 300 mm Wafer Prober

    Key Features:

    • Ultra-low noise measurements with patented PureLine™ 3 technology.
    • Ideal for flicker noise (1/f), RTN, and phase noise testing of ultra-sensitive devices.
    • Fully shielded MicroChamber™ for EMI/RFI protection and frost-free low-temperature operation.
    • Plug-and-Go TestCell Power Management eliminating ground-loop noise.
    • Autonomous 24/7 operation with optimized motorized probe positioners.
    • Wide thermal range from -65°C to +300°C with fA/fF measurement precision.
    • Integrated Velox software for simple, efficient automation.

     

  • A compact and flexible semi-automated wafer probe system designed for RF/DC modeling, device characterization, and advanced measurement needs.

    Key Features:

    • Mechanical platen lift for safer RF set-ups and reduced operator errors
    • Fully compatible with Autonomous RF/DC measurement assistants and Velox Dash™ app
    • Reconfigurable platen inserts (TopHat, PCH, IceShield) for versatile test configurations
    • Spacious platen design supporting RF and DC setups with ease
    • Compact footprint with field-upgradable components
    • Integrated Low-Volume MicroChamber and FemtoGuard thermal triaxial chuck

     

  • Key Features

    • Supports wafers up to 200 mm (optional 300 mm upgrade)
    • Operates at cryogenic temperatures down to 10 K
    • Semi-automated with optional full automation via autoloader
    • Compatible with liquid nitrogen, liquid helium, or cryo-cooler
    • Ice- and condensation-free probing for stable performance
    • Up to eight probe positioners or probe card integration
    • Solid vibration-isolated frame for precision measurements
    • Velox software with intuitive alignment and automation

     

  • Key Features

    • Entry-level manual wafer probing in vacuum < 1×10⁻⁴ mbar
    • Supports wafers up to 150 mm or single dies
    • Up to six probe positioners for flexible testing
    • Optional thermal chuck from -60°C to +300°C
    • Probing possible with open chamber lid at atmosphere
    • Stable, vibration-isolated frame for precise results
    • Ergonomic design with hinged topside lid for easy access
    • Independent control of chuck stage and positioners
    • Fast, manual step-and-repeat wafer testing

     

  • Cascade PM300 – 300 mm Analytical Probe Station

    Key Features:

    • Industry benchmark for manual wafer probing and failure analysis.
    • Superior mechanical stability with granite base for precision and repeatability.
    • High-precision probe positioning with independent X-Y coarse and fine adjustments.
    • Configurable for DC, RF, mmW, WLR, FA, and 3D IC testing.
    • Wide thermal range: -60°C to +200°C (PM300PS) / +15°C to +300°C (PM300).
    • Optional electromagnetic shielding (PM300PS) for ultra-low-noise environments.
    • Spacious, ergonomic design supporting up to 12 positioners.
    • Upgradeable platform to support future testing needs.

     

  • Cascade TESLA300 – Advanced On-Wafer Power Device Characterization

    Key Features:

    • High-voltage and high-current testing up to 10 kV / 600 A.
    • Integrated AttoGuard™ and FemtoGuard™ technology for ultra-low leakage and capacitance.
    • MicroVac™ chuck surface for thin wafer handling and low contact resistance.
    • TÜV-certified safety system with interlocks and full enclosure.
    • Top-lift wafer loading eliminates lift pins for accurate vertical device measurements.
    • Full thermal range from -60°C to +300°C with efficient transition times.
    • Seamless integration with Keysight and Keithley analyzers.
    • Remote operation capability for safe offsite control.
    • Velox and Velox Dash™ software for intuitive automation.

     

  • A professional-grade video generator designed for testing Dolby Vision, HDR, and DSC on DisplayPort™ 1.4a sink devices. Ideal for R&D debugging, compliance testing, and high-resolution validation.

    Key Features:

    • Supports 8K @ 30 Hz and 4K @ 120 Hz resolutions (8K @ 60 Hz with DSC)
    • DP 1.4a Link Layer CTS tool for sink testing*
    • HDCP 2.2/2.3 CTS tool for transmitter compliance*
    • HDR and Dolby Vision test capability with 32 GB extended memory
    • Supports DSC, FEC, LTTPR, and MST (4 streams)
    • USB-C output with included converter
    • No restrictions on video format, audio format, frame rate, or infoframes

     

  • A versatile and cost-effective interoperability test solution for HDMI 1.4 source devices, designed to streamline R&D debugging and automated testing.

    Key Features:

    • HDMI 1.4 and DisplayPort interface support
    • Compatible with TSI Test System Interface API
    • Ready-made test routines for streamlined functionality testing
    • Comprehensive analysis of video, audio, CEC, and metadata
    • Ideal for testing Blu-Ray players, laptops, set-top boxes, game consoles, and tablets
    • Supports both R&D debugging and test automation environments

     

    • 16K Video Generator & Analyzer
    • Dolby Vision™, HDR 10 and HDR 10+
    • validating DP 1.4a & DP 2.0 Link Layer on DP Sinks and Sources
    • Power Input +12 Vdc (AC/DC converter included)
    • Module Size/Weight TBD for Weight and Size

     
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    • Compact sized DisplayPort™ 1.2 compliant Reference Sink
    • HBR2 and MST capable Sink and Branch device
    • Cerified as the platform for DP 1.2 LL CTS Ext1 tests
    • Optional MST Debug panel and AUX Channel Monitor
    • Debug and Test Controller GUI enables monitoring and previewing any MST stream
    • User programmable EDID and DPCD

     

    •  HDMI 2.1 Test Equipment (FRL)
    • Enhanced Gaming Features (VRR, ALLM)
    • FEC, Forward Error Correction
    • HDCP 2.2 & HDCP 2.3 support  TMDS Support
    • Dolby Vision™ Test Tool
    • 8K@60 fps Support (12 Gbps/channel)
    • eARC Support (end of 2019)
    • DSC Support (ESTIMATED 2020)
    • UCD Console GUI for debugging
    • High level API for easy integreation

     

    • Automated tests for USB-C™ DisplayPort™ Alt Mode
    • Electrical Test to verify whole USB-C connector with single cable insert
    • Test USB 2.0 and USB 3.0
    • 4K@60 support
    • Easily set test parameters with provided Software
    • Easily run tests from the commandline
    • Unigraf’s Test System Interface (TSI) Support
    • Third Part Test Management Software
    • Support e.g. NI TestStand Support

     

    • UHD / 4K compliant test equipment
    • HDMI 2.0 and DP 1.2 input and output in one unit
    • DCP Approved HDCP 2.3 CTS Test Tool
    • HDCP 1.3 and HDCP 2.3 support
    • Sink and source video, audio and configuration parameters
    • USB 3.0 connected
    • UCD Console GUI for debugging
    • High level API for easy integration