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Key Features:

• PXI/cPCI JTAG controller for seamless integration into PXI-based test systems
• Supports up to 4 JTAG chains on a Unit Under Test (UUT)
• Configurable I/O pin-out for maximum flexibility across projects
• Fully compatible with other XJLink2 controllers
• TCK clock speeds up to 166 MHz
• Programmable voltage domains from 1.1 V to 3.3 V in 0.1 V steps
• Built-in voltage meter and frequency counter on all I/O pins
• Adjustable signal termination with auto-skew control
• Includes LabVIEW™ Virtual Instruments (VIs) for easy integration
• Self-contained licence for use on multiple PXI racks or servers

RapidTemp™ BT28 ThermoStream® Benchtop Thermal Test System

Key Features:

• Compact and lightweight design under 80 lbs (38 kg) for easy benchtop integration
• Wide temperature range from -28°C to +225°C for versatile testing
• High airflow capacity of 14 scfm for precise and reliable temperature forcing
• SwiftTherm™ technology for ultra-fast temperature transitions
• Detachable 9 ft. touchscreen interface for flexible operation
• ECO-Stream design: quieter, smaller, and energy-efficient
• Embedded control system with Ethernet, IEEE-488, RS232, and USB connectivity
• Customizable test setups with data logging via USB storage

Any shielded room can be transformed into a reverberation chamber with this retrofit solution. Designed with aluminum panels and customizable stirrers, it ensures improved Q factor and precise EMC testing conditions.

Key Features:

• Converts shielded rooms into functional reverberation chambers
• High Q factor for enhanced electromagnetic testing
• Customizable stirrer configurations (1 or 2+ stirrers)
• Ensures strong electrical bonding to prevent oxidation
• Suitable for automotive, avionics, military, space, and telecom markets
• Compatible with IEC/EN 61000-4-20 & IEC/EN 61000-4-3 standards

Showcasing a large 10” panel withultra-bright, energy-efficientmicroLED technology, deliveringdynamic visuals and seamlessintegration for next-generationintelligent vehicles.

Ket Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Vibrant RGB Color Reproduction: Delivers rich, high-contrast visuals with precise color accuracy, enhancingvisuals for display applications.

Advancing automotive displayswith ultra-bright, energy-efficientmicroLED technology, enablingdynamic visuals and seamlessintegration for next-generationintelligent vehicles.

Key Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Vibrant RGB Color Reproduction: Delivers rich, high-contrast visuals with precise color accuracy, enhancingvisuals for display applications.

SB3G Shielded Box – EMI & RF Protection provides advanced shielding for sensitive equipment in high-interference environments.

Key Features:

• Superior EMI/RF shielding up to 60 dB attenuation
• Wideband performance: DC – 3 GHz
• Integrated AC power filter (120/230V, 10A fuse)
• Multiple I/O ports: RF, fiber optic, USB, Ethernet
• Active cooling with thermostat-controlled fan
• Shielded viewing window for real-time monitoring
• Durable, lightweight aluminum enclosure (19 kg)

Shielded Chamber and Box Solutions are engineered for high-performance RF, EMI, and EMC testing across industries. Designed for 5G, aerospace, automotive, and military use, these solutions deliver exceptional shielding effectiveness with customizable options.

Key Features:

• Wide range of shielded chambers and boxes for commercial, industrial, and defense applications
• Effective for RF immunity testing, antenna measurements, and shielding verification
• Supports 5G and wireless/telecom testing environments
• Compatible with IEC/EN 61000-4-20 and IEC/EN 61000-4-3 standards
• Available in multiple models: SHB-50, SHB-50A, SHB-100, SHB-200, and Aluminum Shelter
• Custom-built solutions to meet specific testing needs
• Supports shielding effectiveness test setup with advanced antenna configurations

Revolutionizing automotivelighting with ultra-bright, energy-efficient microLED displays,enabling adaptive illuminationand seamless integration for next-generation intelligent vehicles.

Key Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellent visibility inboth indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Segment-Driven Intelligence: Enables optimal messagingthrough precisely controlled lighting segments, enhancingintelligent lighting capabilities for smart automotiveapplications and other high-performance devices.

Transforming automotive lightingwith ultra-bright, energy-efficientmicroLED displays, deliveringprecision illumination andseamless integration for next-generation vehicles.

Key Features:

• OVERVIEWUltra-High Brightness: Engineered to perform in a widerange of lighting conditions, ensuring excellentvisibility in both indoor and outdoor environments.
• Robust Durability: Built to withstand demandingconditions for long-term reliability.
• Ultra-Thin & Lightweight: Designed for seamlessintegration into compact spaces, leveraging microLED’sinherently slim profile without compromisingperformance.
• Power-Efficient Design: Consumes significantly lesspower compared to traditional display technologies.

The TESLA200 is a semi- or fully-automated 200 mm on-wafer probing solution designed for advanced power semiconductor testing.

Key Features:

• On-wafer device testing up to 10,000 V DC and 600 A.
• Supports IGBT, GaN, SiC, and Si devices.
• Advanced MicroVac™ and FemtoGuard™ technologies for low-noise, accurate measurements.
• Wide thermal range from -55°C to +300°C.
• Safety-certified interlock system with ergonomic clear enclosure.
• Compatible with T.I.P.S. “LuPo” High Voltage / High Power Probe Cards.
• Fully automated wafer handling, including thinned/warped wafers.
• Field-upgradeable to scale with growing test requirements.

Cascade TESLA300 – Advanced On-Wafer Power Device Characterization

Key Features:

• High-voltage and high-current testing up to 10 kV / 600 A.
• Integrated AttoGuard™ and FemtoGuard™ technology for ultra-low leakage and capacitance.
• MicroVac™ chuck surface for thin wafer handling and low contact resistance.
• TÜV-certified safety system with interlocks and full enclosure.
• Top-lift wafer loading eliminates lift pins for accurate vertical device measurements.
• Full thermal range from -60°C to +300°C with efficient transition times.
• Seamless integration with Keysight and Keithley analyzers.
• Remote operation capability for safe offsite control.
• Velox and Velox Dash™ software for intuitive automation.

Key Features:

• Wide temperature range from -65°C to +300°C
• Compatible with 150mm, 200mm, and 300mm wafer sizes
• Options for mechanical refrigeration, glycol/water, or air cooling
• Heating methods: ThermoElectric or Resistive, depending on model
• Retrofits available for existing probe stations
• Customizable surface plating: gold or nickel
• Supports advanced applications like low leakage probing (fA level) and high-voltage probing (up to 10kV)

ThermoSpot Systems – Benchtop Direct Contact Cooling and Heating Solution

The Temptronic® ThermoSpot® delivers high-performance temperature control for IC testing and high-Watt devices with unmatched cooling capacity.

Key Features:

• Reliable thermal cycling without thermoelectric modules
• Wide temperature range: -65°C to +175°C
• Cooling power: 40W at -40°C, 55W at -55°C, 120W at -40°C
• Fast transitions: <35 seconds from +25°C to -40°C
• Secure thermal contact with ThermoBridge™ design
• Touch-screen with data logging and programmable settings
• Multiple communication ports: Ethernet, USB, IEEE, RS232

ThermoSpot® Systems – Direct Contact Thermal Test Solutions

Key Features:

• Temperature range: -65°C to +175°C
• Cooling power up to 120W at -40°C
• Fast transition rate (<35 sec from +25°C to -40°C)
• Reliable thermal cycling without thermoelectric modules
• Flexible thermal probe with interchangeable ThermoBridge™
• Touchscreen controller with programmable profiles
• Connectivity options: Ethernet, USB, IEEE, RS232
• Easy, secure connection to in-circuit or socketed DUTs