Uncategorized

200 mm semi-/ fully-automated production probe system

• Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
• Faster time to data
• Highest Z-axis resolution of any production prober
• Highest Z-axis resolution of any production prober
• Interfaces to all major analysis instrumentation, optics software and testers
• Backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
• Highly accurate light measurement

with Autonomous Silicon Photonics Measurement Assistant

• Revolutionary technology advancement for wafer and die-level photonics probing
• Enables autonomous measurements
• Highest accuracy in test results
• Reduced risk of damaging fibers with collision avoidance technology
• Easy setup even for less experienced users
• Minimized coupling losses with minimal trench dimensions
• Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
• Other integrated features: Incident Angle Cal, Optical Rotation Scan, Optical Scan Data Analysis, Optical Tracking, Align Optical Probes
• 40°C to +125°C
• Enables hands-free autonomous calibration and re-calibration at multiple temperatures

• Rapid image acquisition
• High resolution imaging
• SQUID sensor autotuning
• Unattended operation
• Sample size
• Closed-loop scanner stage
• Magnetic shielding
• Magnetic field control
• Flexible sensor integration
• Cryogen-free

• Cryogenic Temperaturesy
  • Fully isolated experiment space for true 4K temperatures during probing
  • Cryogenic positioners to provide large travel ranges without warming up the device
• Low Vibration
  • Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
  • A soft vacuum bellows provides a compliant mounting interface for the cryocooler
• Configurability
  • Quick release vacuum feedthroughs for easy configurability
  • A large rectangular port for high signal capacity
  • Multiple stage feedthroughs for thermally intercepting the signals
  • Many available system options and add ons to choose from

• Low vibration from < 1 Hz to 1 kHz
  • Opposed bellows
  • Passive isolation
  • Active isolation (optional)
• 4 K platform with quick access
• 4 K electrical and fiber optic feedthroughs
• Expandable, modular construction
• Easy, flexible I/O
  • 8x NW50 flanges below the table
  • 8x HPD standard cable feethrough flanges on 50 K and 3 K plates
  • Cable feedthroughs on base flange above the table
  • Standard ports for DC, RF & optical fibers 8x HPD standard cable
• Smart controls
  • Pushbutton auto cooldown from atmosphere TCP/IP control
  • Cryogen-free

• FormFactor probe system: T300, TESLA200, T200, EPS150TESLA (others available)
• Manual, semi-automatic and fully automatic probes station options
• FormFactor analytical probes: High Voltage Probes, High Current Probes, High-Power Probes
• I.P.S. “LuPo” High Voltage / High Power Probe Card (optional)
• Full over temperature measurements and automation from -60°C to +300°C
• Keysight power device analyzer (PDA): B1505A (others available)
• Keysight automation and modeling software: EasyEXPERT group+
• To complete the system: cables, adapters, mounting hardware, etc.

for 1/f flicker noise, RTN, phase noise, device characterization, and other low-frequency noise measurements

• FormFactor probe system: CM300xi-ULN, SUMMIT200 (others available)
• Manual, semi-automatic and fully automatic probes station options
• FormFactor analytical probes: DCP probes (others available) on manual or motorized positioners
• FormFactor DC automation software: Autonomous DC Measurement Assistant for unattended probing over temperature on small pads
• Full over temperature measurements and automation from -60°C to +300°C
• Keysight advanced low-frequency noise analyzer (A-LFNA): E4727B
• Keysight automation and modeling software: PathWave WaferPro (WaferPro Express)
• To complete the system: cables, adapters, mounting hardware, etc.

• FormFactor probe system: CM300xi, SUMMIT200, MPS150 (others available)
• Manual, semi-automatic and fully automatic probes station options
• FormFactor analytical probes: RF and DC probes on manual or motorized positioners
• FormFactor Integrated Single, Dual or 3 sided HexNano Optical Positioning
• FormFactor photonics automation software: SiPh-Tools and Photonics Controller Interface for automated optical positioner calibrations and control
• Temperature measurements and automation from -40°C to +125°C
• Tunable lasers, power meters, and polarization synthesizer: Keysight N7776C, N7778C, N7744C, N7745C, N7786C, N7788C (others available)
• Modular lasers: Keysight 81606A, 81607A, 81608A and 81602A (others available)
• Keysight semiconductor parameter analyzer or PXIe SMUs for Optical to Electrical (O-E): B2901A, B1500A, M9601A PXI SMU (others available)
• Keysight test and automation oftware: Photonics Application Suite (PAS),  PathWave Test Automation with FormFactor Wafer prober plug-in
• To complete the system: cables, adapters, mounting hardware, etc.

• FormFactor probe system: T300, TESLA200, T200, EPS150TESLA (others available)
• Manual, semi-automatic and fully automatic probes station options
• FormFactor analytical probes: High Voltage Probes, High Current Probes, High-Power Probes
• I.P.S. “LuPo” High Voltage / High Power Probe Card (optional)
• Full over temperature measurements and automation from -60°C to +300°C
• Keysight power device analyzer (PDA): B1505A (others available)
• Keysight automation and modeling software: EasyEXPERT group+
• To complete the system: cables, adapters, mounting hardware, etc.

• Cryogenic Temperaturesy
  • Fully isolated experiment space for true 4K temperatures during probing
  • Cryogenic positioners to provide large travel ranges without warming up the device
  • Integrated helium pot for high temperature stability of the device under test
  • Fully dry cryogen-free cooler eliminates the need for expensive helium circulation systems
  • Rapid cool liquid nitrogen option for faster cool down times
• Low Vibration
  • Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
  • A soft vacuum bellows provides a compliant mounting interface for the cryocooler
  • Rigid support tube to direct vibrations from the cryocooler away from the sample
• Configurability
  • Quick release vacuum feedthroughs for easy configurability
  • A large rectangular port for high signal capacity
  • Multiple stage feedthroughs for thermally intercepting the signals
  • Large experimental space provides more workroom and configurable ports
  • Many available system options and add ons to choose from

For ACP, Infinity, and FPC Probes

150 mm modular probe station

• Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
• Re-configurable and upgradable as requirements grow
• Minimizes setup times with no loss in performance or accuracy
• Seamless integration of various measurement instruments

• Lithographic thin-film construction
• Excellent crosstalk characteristics
• Non-oxidizing nickel alloy tips
• Innovative force delivery mechanism
• 40GHz, 50GHz, 67GHz, 110GHz and 145GHz connectors available
• GSG, SG, GS, GSGSG, GSSG, SGS configurations
• 50 to 250 µm pitches (other pitches available on request)
• High current version (2 A) available

A configurable fine-pitch multi-contact RF/mmW probe for mixed-signal probing up to 110 GHz

• Customizable configuration up to 25 contacts: RF, Eye-Pass power, ground, logic
• Lithographically-defined tips allow automated over temperature measurement on pads as small as 30 µm x 50 µm
• Low and repeatable contact resistance on aluminum pads (< 0.05 Ω) ensures accurate results
• Durable probe structure ensures more than 250,000 contacts
• Able to measure from -40°C to +125°C without compromising performance or accuracy of specifications

Repeatable measurements up to 500 GHz with improved crosstalk performance

• Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
• Reduced unwanted couplings and transmission modes
• Able to shrink pad geometries to 25 x 35 µm (best case)
• Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
• WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.