Description
Cascade CM300xi-SiPh Probe System Overview
The Cascade CM300xi-SiPh Probe System is the industry’s first fully integrated 300 mm silicon photonics probing solution, delivering unmatched accuracy and speed for wafer and die-level optical testing. Engineered with the Autonomous SiPh Measurement Assistant, the CM300xi-SiPh ensures rapid calibration and verification, allowing labs to begin precise optical measurements immediately after installation.
With OptoVue™ calibration technology and advanced machine vision algorithms, the system automates complex optical alignments and re-calibrations at multiple temperatures. This reduces manual intervention, cuts testing costs, and accelerates time-to-data for silicon photonics devices.
The CM300xi-SiPh supports all major coupling methods – vertical grating coupling, horizontal die-level edge coupling, and wafer-level edge coupling. Each method benefits from collision avoidance technology and automated fiber-to-facet alignment, ensuring repeatable, low-loss measurements even for less experienced users.
For environmental stability, the exclusive SiPh TopHat creates a shielded, frost-free chamber with a thermal range of -40°C to +125°C, minimizing air flow impact on fibers and enabling accurate testing at cryogenic and elevated conditions.
The system’s SiPh-Tools software package integrates machine vision, calibration routines, and automated alignment workflows, while the Photonics Controller Interface (PCI) provides intuitive manual control. This combination allows both flexibility and automation, from engineering experiments to high-volume testing.
As a result of strategic partnerships with Keysight Technologies for instrumentation and Physik Instrumente (PI) for precision motion control, the CM300xi-SiPh delivers production-proven performance with seamless hardware-software integration.
Backed by Velox and Velox Dash™ software, the platform ensures simplified workflows, fast operator training, and reliable automation. With its reconfigurable fiber arm and nanometer-accuracy positioning, the CM300xi-SiPh empowers photonics researchers and manufacturers to reduce time-to-market while guaranteeing consistent, high-quality measurement results.
Technical Highlights of CM300xi-SiPh
| Feature Category | Specification / Capability |
| Wafer Size Support | 200 mm / 300 mm |
| Measurement Applications | Silicon photonics wafer and die-level probing |
| Coupling Methods | Vertical, wafer-edge, and horizontal die-edge coupling |
| Calibration Technology | OptoVue™ with Autonomous SiPh Measurement Assistant |
| Thermal Range | -40°C to +125°C |
| Environment | Dark, shielded, frost-free with SiPh TopHat |
| Software | SiPh-Tools, Photonics Controller Interface (PCI), Velox, Velox Dash™ |
| Automation | Autonomous calibration and re-calibration, optical alignment verification |
| Partnerships | Keysight Technologies (instrumentation), PI (motion control) |
| Fiber Handling | Reconfigurable fiber arm for single fibers and fiber arrays |
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