Probes

• Current measurement from insulated probing of conductor
• Suitable for observation and measurement of current in PCB tracks, component leads and ground planes
• Wide dynamic range of 10mA to 20A peak to peak
• Wide bandwidth of DC to 5MHz
• Low noise figure equivalent to <6mA rms at full B/W
• Safety rated to 300V Cat II (600V Cat 1)
• Suitable for connection to any oscilloscope
• High accuracy general purpose H-field probe
• Converts to ‘closed magnetic circuit’ current probe

The DCP-X probe is designed for engineers and scientists in device characterization, R&D, and testing, offering highly accurate and repeatable on-wafer electrical measurements (IV, CV, LFN). It uses MEMS technology to measure advanced devices (2, 3, 5 nm) on various pad materials, micro-bumps, and pads as small as 20 μm, reducing the need for retesting and cleaning while covering the full thermal range at lower testing costs. Compared to traditional probes, the DCP-X provides 1000x lower contact resistance, minimal skate, and over 500,000 contact cycles, ensuring precise measurements and longer probe life.

• Highest accuracy with backlash-free positioning
• Drift-free measurements over temperature and time*
• Easy, and safe swapping between arms
• Best signal integrity using optimized probe cabling systems
• Full thermal capability*
• Manual or progammable

Accurate and precise measurement of device parameters up to 3,000 V

• Coaxial and triaxial measurements up to 3,000 V
• High-quality construction with low-noise electrical performance
• Replaceable probe tips in a variety of tip sizes
• Temperature range of -55 to 300ºC
• Triaxial measurement ensures a much better understanding of device leakage in the off state
• Highly reliable, stable and repeatable measurements
• Integrally designed as part of a complete measurement solution

Delivers superior guarding and shielding

• High-quality construction with low-noise electrical performance
• Kelvin version for convenient 4-point measurements
• Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
• SSMC 50 connectors
• Ultra-low, fA and fF measurements from -65 º C to 150 º C

• Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
• Application flexibility, ideal for use in high frequency applications
• Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
• Suitable for integration with vibration isolating tables

• Functional temperature range of -263 to +150°C
• Stainless steel tip material for thermal decoupling
• Coaxial cable with TCE matched inner and outer conductors
• Consistent tip geometry even at cryogenic temperatures

High-performance DC Parametric Probe

• Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
• Guarantees fully-guarded measurements to fA and fF levels
• Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
• Allows probing of different pad materials and sizes
• Fast replacement of worn probes without the need for tools

Multi-contact DC Probe with flat tip needles

• Power bypass inductance: 8 nH
• Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
• Supports collinear and non-standard needle configurations
• Up to 16 DC for standard; maximum of 24 DC for custom
• Ideal for probing the entire circuit for functional test
• DC probes can provide power or slow logic to circuit under test

Multi-contact DC Probe with full-radius needles

• Full-radius, nickel-plated tungsten needles
• Power bypass inductance: 16 nH
• Supports collinear and non-standard needle configurations
• Support up to a maximum of 12 ceramic blades DC needles / contacts
• Ideal for probing the entire circuit for functional test
• DC probes can provide power or slow logic to circuit under test

Rugged, deep reach RF probing for modules and circuit boards

• DC-40 GHz bandwidth
• 10 ps rise time
• Low insertion and return loss
• 2 mils of tip-to-tip compliance
• High probing angle and clearance

Perfectly matched to the |Z| Probe®

The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.

Durable multi-contact wafer probe with controlled impedance power bypass technology

• High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
• RF bandwidth to 500 MHz
• Long probe life: > 250,000 contacts
• Beryllium-copper tips for gold pads or tungsten for aluminum pads
• Oscillation-free testing of wide-bandwidth analog circuits
• Use with ACP series probes to provide functional at-speed testing for known-good-die
• Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
• Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)

Multiline TRL Substrates for T-Wave Probes

• Substrate material: High-resistivity silicon
• Substrate thickness: 275 µm
• Dielectric constant: 11.8
• Nominal Z₀: 50 Ω

Long-lasting, rugged RF and microwave on-wafer probes

• Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material
• DC to 110 GHz models available in single and dual line versions
• Low insertion and return loss with ultra-low-loss ( -L ) versions
• Excellent crosstalk characteristics
• Wide operating temperature -65 ° C to + 200 ° C
• Wide range of pitches available, from 50 to 1250 µm
• Individually supported contacts
• Reduced contact (RC) probe tips for small pads
• BeCu tip provides rugged, repeatable contact on gold pads