Probes

Test Up to 16 RF Signals with One Probe

• Ideal for multiport RF/Microwave and high-speed digital signal testing
• Mix DC and RF/Microwave signals on one probe
• Long lifetime – typically over one million (1,000,000) touchdowns
• Excellent performance in temperatures ranging from 10 K to 200°C
• Probe on any pad material with no damage

Cost-effective, versatile probe card solution

• Accommodates a combination of up to four Cascade Microtech probes
• Configurable for mixed-signal RF/mmW testing
• Quick and easy repairs to be performed in the field, by simply replacing individual probes
• Adaptable to new device layouts by exchanging individual probes

Multicontact Probe for RFIC Engineering Test

• Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
• Online design configuration tool helps you to specify your probe in minutes
• All designs are fully quadrant compatible
• Full solution includes probes, calibration substrates, stations, accessories and software
• Scalable architecture for future needs

HF and DC Signals on One Cost-Effective ProbeWedge

• Flexibility
  • The ProbeWedge family is compatible with your existing Cascade Microtech’s probing systems
  • Plug and play design provides easy handling and strain relief
  • Ideal probe solution for wafer-level reliability, multi-site tests and DC biasing
• Cost effectiveness
  • Alternative to inflexible probe cards, ideal for changing demands in R&D
  • All cables can be re-used and additional single cables can be ordered
  • Probe blades can be repaired individually
• Accuracy
  • Kelvin ProbeWedge is ideal for low-resistance measurements
  • Fully-guarded microstrip blades for low-current measurements down to fA range

A configurable fine-pitch multi-contact RF/mmW probe for mixed-signal probing up to 110 GHz

• Customizable configuration up to 25 contacts: RF, Eye-Pass power, ground, logic
• Lithographically-defined tips allow automated over temperature measurement on pads as small as 30 µm x 50 µm
• Low and repeatable contact resistance on aluminum pads (< 0.05 Ω) ensures accurate results
• Durable probe structure ensures more than 250,000 contacts
• Able to measure from -40°C to +125°C without compromising performance or accuracy of specifications

Multi-Configurable Optical Probe for Photonic Device Characterization

• Flexibility and ease of use
  • Field-replaceable fibers optimized for a variety of applications
  • Wafer mapping capability and visual display of key parameters
• Accuracy
  • Patented contact protection design ensures fast, accurate, and repeatable measurements at the wafer and substrate level
  • Minimized electrical parasitics for at-speed testing
• Compatibility
  • Standard FC type fiber-optic connector
  • Compatible with FormFactor probe stations and accessories

Custom configured for your application

• Choice of Series resistance or Termination (signal line to ground)
• Use of High Performance RF Resistors
• Choice of Resistor values available
• Choice of body styles, Infinity, ACP or FPC

Wafer-level electrical measurement of mmW devices and materials up to 1.1 THz

• Low insertion loss
• Low contact resistance
• 140 GHz – 1.1 THz versions
• Probe pitch as narrow as 25 μm
• Lithographically-defined probe tip
• Nickel contacts

• Supports up to 12 VNA ports than can be mapped to four logical ports for calibration
• Extensive guidance, wizards and management features automate calibration setup, measurement, result data conversion and report creation
• LRRM-SOLT, multi-line TRL and second-tier calibration methods enable precision and simple multi-port calibrations
• Automatic load inductance compensation function ensures the most repeatable calibrations
• Easy to use Probe to ISS/CSR matching tool
• Additional remoting methods
• Interface with Velox™ over LAN

Robust RF Test on PCB and Ceramic

• Replace costly and inflexible test fixtures with easy-to-use probe tips
• Long lifetime – typically over 1,000,000 contacts
• GS/SG footprint up to 4 GHz and GSG up to 20 GHz
• High-power RF test: up to 30 Watts
• Test at temperatures from -60°C to 200°C

High power, High performance probe

• High power – 66 W at 2.4 GHz and 43 W at 5 GHz
• Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
• Excellent contact control and low contact resistance
• High performance on any pad material (Al or Au)
• Longest lifetime – typically one million (1,000,000) touchdowns

Excellent Performance – Longest Lifetime

• Best price per contact – typically over one million (1,000,000) touchdowns
• RF/Microwave signal is shielded and completely air isolated in the probe body
• Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
• Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
• Probe on any pad material with minimal damage

Enabling single-contact high-current/high-voltage test

• Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
• Even distribution of high current with innovative multi-fingertip design
• Compatible with Tesla 200/300 mm power device characterization system
• Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
• Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
• Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

Test power devices on wafer with high-performance and low-contact resistance on smaller pads

• Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
• Measure devices on wafer at high-current conditions over a wide temperature range (-55°C to 300°C)
• Small scrub minimizes damage on Al pad
• Small footprint – tip for small pad probing down to 1 mm x 1 mm pad