200mm Probe Systems

• Re-configurable for DC, RF, mmW, FA, WLR and more
• table and repeatable measurements over a wide thermal range
• Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
• Minimize AC and spectral noise
• Manual 3-axis stage with ergonomic controls
• Fast, accurate “hands on” wafer positioning
• Quick, safe, and comfortable wafer access

• Comfortable and ergonomic operation
• Thermal range ambient to +300°C
• RF/microwave device characterization, FA and design debug
• Seamless integration between Velox and analyzers/measurement software
• Complete solutions using probe positioners and probe cards
• Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
• Shortest signal path test integration for accurate, thermally stable, and low-error data collection
• Powerful automation tools, reduce total test time on wafers, singulated dies, and modules
• Faster time to first data for standard and “hard to test” devices such as thin wafer, small pad and high power
• Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact

• SlimVue Microscope
  • Combined eye-pieces and CCD camera mount
  • 3x zoom and quick lens exchange
  • Quick lens exchange
  • 1 um optical resolution
  • Minimized scope footprin
• Application Specific Sigma Kits
  • Optical feedback on platen position (gauge)
  • Adaptable to any mmW/sub-THz applications
  • Seamless integration with any mmW modules and tuners
  • Fast mounting and setup change
• THz measurement capability
  • Rock-solid mechanical design
  • Submicron stage accuracy
  • Optical feedback on platen and probe position (gauge)
  • Motorized positioner

• Three Probe Technologies
  • nfinity Probe: best for Al (Si)
  • ACP Probe: best for AU (III-Vs)
  • |Z| Probe: robust solution (long lifetime)
• Precise Contact Solution
  •  Precision probe alignment
  • Consistent contact force and overtravel
  • Stable contact performance
• WinCal XE Calibration Software
  • Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
  • Automated calibration monitoring
  • Unique measurement & analysis methods

200 mm semi-/ fully-automated production probe system

• Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
• Faster time to data
• Highest Z-axis resolution of any production prober
• Highest Z-axis resolution of any production prober
• Interfaces to all major analysis instrumentation, optics software and testers
• Backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
• Highly accurate light measurement

• Superior Mechanics
  • Highly stable granite base
  • Excellent measurement accuracy and repeatability
• High Flexibility
  • Re-configurable for DC, RF, mmW, FA, WLR and more
  • 40 mm platen height adjustability
  • Fast transition between wafer and package test
• Ease of use
  •  Low-profile, straightforward design
  • Easy and ergonomic operation
• Double-side option
  • Front or backside probing capability
  • Access to top side and bottom side of device under test (DUT)