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inTEST Thermal Temptronic ThermoSpot® DCP-101 Bench Top Temperature Forcing System

inTEST Thermal Temptronic ThermoSpot® DCP-101 Bench Top Temperature Forcing System

  • High reliability thermal cycling without thermoelectric modules
  • Temperature range: -65 to 175°C
  • Cooling power:
    • 40W at -40°C for lower power devices
    • 55W at -55°C and 120W at -40°C.
  • Transition rate: up to <35 sec over 25 to -40°C
  • Easy and secure thermal connection to in-circuit or test socked DUT
  • Touch-screen controller: user-programmable temperatures, graphing, data logging
  • Communications options: Ethernet, USB, IEEE, RS232

 

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SKU: DCP-101 Category:



Introducing the inTEST Thermal Temptronic ThermoSpot® DCP-101 Bench Top Temperature Forcing System

The ThermoSpot Model DCP-101 benchtop temperature forcing system provides a highly responsive, thermally conductive path to quickly induce temperatures to the DUT. This highly reliable system – without thermoelectric modules – uses a thermal probe designed with an interchangeable ThermoBridgeTM to mate directly your IC or other device under test. Using proprietary, robust refrigeration technology, ThermoSpot can perform thermal cycling without the worry of cooling degradation so common with thermoelectric modules employed in competitive systems.

User-programmable temperatures, graphing, and data logging are established through the controller’s touch-screen or remote communications. The system provides fast and precise transitions of temperature at the IC, even with variations in device power, and can be used with Temptronic’s proven DUT Control technology using an imbedded diode or external thermocouple.

 

inTEST Thermal Temptronic ThermoSpot® DCP-101 Bench Top Temperature Forcing System



inTEST Thermal Temptronic ThermoSpot® DCP-101 Bench Top Temperature Forcing System

Key Features

 

The Temptronic® ThermoSpot family of benchtop direct contact systems provide an efficient source for IC temperature characterization, including high-Watt emitting devices. Highly responsive and reliable, the unit feeds a thermal probe head through a flexible umbilical – without the use of thermoelectric modules. The thermal probe is designed with an interchangeable ThermoBridgeTM to mate directly to your IC or other device under test.

Using proprietary, robust refrigeration technology ThermoSpot can perform thermal cycling without the worry of cooling degradation so common with thermoelectric modules employed in competitive systems. Furthermore, these systems provide the highest cooling capacity of direct contact systems on the market today.

  • High reliability thermal cycling without thermoelectric modules
  • Temperature range: -65 to 175°C
  • Cooling power:
    • 40W at -40°C for lower power devices
    • 55W at -55°C and 120W at -40°C.
  • Transition rate: up to <35 sec over 25 to -40°C
  • Easy and secure thermal connection to in-circuit or test socked DUT
  • Touch-screen controller: user-programmable temperatures, graphing, data logging
  • Communications options: Ethernet, USB, IEEE, RS232

 



Key Benefits

Using proprietary, robust refrigeration technology ThermoSpot can perform thermal cycling without the worry of cooling degradation so common with thermoelectric modules employed in competitive systems. Furthermore, these systems provide the highest cooling capacity of direct contact systems on the market today.


inTEST Thermal Temptronic ThermoSpot® DCP-101 Bench Top Temperature Forcing System


Trust the Experts at ACA TMetrix Inc.

ACA TMetrix Inc. is a leading Canadian distributor of test and measurement instruments and design tools. For over 55 years we have provided products manufactured by the world’s leading instrument manufacturers. Leading Distributor of Design Tools and Test Equipment in Canada.

Specifications

Temperature Performance1, 2 Range: -55 to 175°C @ 23°C ambient
Accuracy: ±1.0°C; Stability: ±0.4°C
Cooling Power4 40W @ -40°C
Transition Rates1 25 to -40°C, <1.5 min.
Temperature Sensors Main sensor: RTD, DUT sensors: K thermocouple, Diode, 100Ω RTD, Analog
Temperature Calibration Software calibrated
Communications Interface Ethernet (TCP/IP), USB / Optional IEEE488, RS232
Maximum Force Allowable on Thermal Head 980.6 N (220.4 Lbf)
DUT Dimensions From 2 x 2mm to 50 x 50mm (0.079” x 0.079” to 2.0 x 2.0”)
Operator Interface 5.25” color touch-screen, programmable with 0.1°C resolution
Preset temperatures,ramp,soak,cycle.
Ramp rate control, Graphing and data logging, Web server, Offset calibration
Analog temperature inputs
Thermal Head 89mm (3.5”) diameter
Thermal Head Hose 1.8 meters (70”) long, optional 3.0 meters (118”) long
Frost Free Thermal Head Low flow dry air or nitrogen purge 0.05cfm, -70°C (-94°F) dew point
Controlled automatically
Physical Dimensions 445mm D x 356mm W x 299mm H (17.5”D x 14.0”W x 11.75”H)
System Weigh 27.2 Kg (60.0 lbs.)
Noise Leve 27.2 Kg (60.0 lbs.)
Noise Level 5 55 dBA
Power Requirements 115 VAC (±10%), 15 amp, 50/60Hz
208/230 VAC (±10%), 10 amp, 50/60Hz
Purge Dry Air Supply User supplied, regulated, -70°C (-94°F) air or nitrogen, 0.1cfm at 0.2 BAR
Operating Environment Temperature: 5 to 35°C (40 to 95°F), Humidity: 20 to 95% RH
Compliance CE | RoHS | EU 517/2014 | designed to meet UL61010

 

Datasheet


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