Products

• Easily create tasks
• Obtain fast results
• Adapts to the user’s needs and skills level
• Reduces working time
• Saves money!
• Designed to operate with maximum intelligence
• Automates workflows
• Enables autonomous measurements

Robust RF Test on PCB and Ceramic

• Replace costly and inflexible test fixtures with easy-to-use probe tips
• Long lifetime – typically over 1,000,000 contacts
• GS/SG footprint up to 4 GHz and GSG up to 20 GHz
• High-power RF test: up to 30 Watts
• Test at temperatures from -60°C to 200°C

High power, High performance probe

• High power – 66 W at 2.4 GHz and 43 W at 5 GHz
• Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
• Excellent contact control and low contact resistance
• High performance on any pad material (Al or Au)
• Longest lifetime – typically one million (1,000,000) touchdowns

Excellent Performance – Longest Lifetime

• Best price per contact – typically over one million (1,000,000) touchdowns
• RF/Microwave signal is shielded and completely air isolated in the probe body
• Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
• Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
• Probe on any pad material with minimal damage

• Highest accuracy in test results
• Easy setup even for less experienced users
• Minimized coupling losses with minimal trench dimensions
• Exclusive FormFactor-developed automated test methodology
• Wide range of tools for capturing, logging and interpreting data
• Enables hands-free autonomous calibration and re-calibration at multiple temperatures
• Search First Light feature enables automated determination of initial position for optimization
• Once aligned, all calibration functions are automated and performed through SiPh-Tool

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
• Prevent thin wafers from curling and breaking
• Accurate Rds(on) measurement at high current
• Accurate UIS measurements at high temperature
• Roll-out stage for full wafer access and easy wafer loading/unloading
• Seamless integration between Velox and analyzers/measurement software
• High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
• Easy on-screen navigation, wafer mapping, and operation of accessories with Velox

Enabling single-contact high-current/high-voltage test

• Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
• Even distribution of high current with innovative multi-fingertip design
• Compatible with Tesla 200/300 mm power device characterization system
• Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
• Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
• Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)