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  • High power, High performance probe

    • High power – 66 W at 2.4 GHz and 43 W at 5 GHz
    • Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
    • Excellent contact control and low contact resistance
    • High performance on any pad material (Al or Au)
    • Longest lifetime – typically one million (1,000,000) touchdowns

     

  • Excellent Performance – Longest Lifetime

    • Best price per contact – typically over one million (1,000,000) touchdowns
    • RF/Microwave signal is shielded and completely air isolated in the probe body
    • Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
    • Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
    • Probe on any pad material with minimal damage

     

    • Highest accuracy in test results
    • Easy setup even for less experienced users
    • Minimized coupling losses with minimal trench dimensions
    • Exclusive FormFactor-developed automated test methodology
    • Wide range of tools for capturing, logging and interpreting data
    • Enables hands-free autonomous calibration and re-calibration at multiple temperatures
    • Search First Light feature enables automated determination of initial position for optimization
    • Once aligned, all calibration functions are automated and performed through SiPh-Tool

     

  • The new G5.RSS series features

    • High control dynamics
    • An exceptional accuracy
    • A nominal output voltage of up to 3000 VDC
    • A wide current-voltage range with an auto-ranging factor of 3.
    • You get the best value for your investment.

     

    • On-wafer power device characterization up to 10,000 V DC / 600 A
    • Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
    • Prevent thin wafers from curling and breaking
    • Accurate Rds(on) measurement at high current
    • Accurate UIS measurements at high temperature
    • Roll-out stage for full wafer access and easy wafer loading/unloading
    • Seamless integration between Velox and analyzers/measurement software
    • High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
    • Easy on-screen navigation, wafer mapping, and operation of accessories with Velox
  • Enabling single-contact high-current/high-voltage test

    • Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
    • Even distribution of high current with innovative multi-fingertip design
    • Compatible with Tesla 200/300 mm power device characterization system
    • Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
    • Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
    • Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

     

    • compact and completely modular design
    • high effectiveness in all operation modes, few requirements on building infrastructure
    • ability to use an existing liquid cooling system directly
    • optional matched liquid-to-air cooling unit TC.LAE available
    • possibility of upgrading to systems of up to 1 MVA
    • high level of system dynamics, ≤ 5 kHz modulation bandwidth
    • non-restrictive capability of refeeding in the Q4 operation mode
    • possibility of operating as an autonomous 4-Q and 3-phase quasi-analogue amplifier
    • possibility of “Hardware-in-the loop”-operation (HIL mode)
    • user friendly application software with pre-configured test patterns
    • possibility of integrating into a complete SAS simulation and test system
    • galvanic isolation available as an option without derating the simulator port data

     

  • Bidirectional (source & sink), Regenerative 0…65VDC to 0…1500VDC, 20kW up to 1.5 MW 

    • cell system nominal voltage and type of chemistry
    • number of cells
    • internal resistance and associated parameters
    • cell temperature progression
    • allowed current
    • charge efficiency
    • energy computing and management facilities
    • time-dependent and functional dependent parameters

     

    • Setting of operational parameters for each output phase: (frequency, phase, voltage, basic waveform)
    • Defining functional blocks enabling a wide variety of modulation capabilities
    • Defining, editing and storing of even complex and long test sequences
    • Preview window for output voltage waveforms
    • LC load mode, definition of complex equivalent circuits
    • Hand drawing curve tool and FOURIER tool (harmonics synthesis)
    • TC.ACS provides an extensive safety concept in order to detect unwanted or off-limit conditions very quickly and to initiate controlled limiting or even a shutdown.

     

    • compact and completely modular design
    • high effectiveness in all operation modes, few requirements on building infrastructure
    • ability to use an existing liquid cooling system directly
    • optional matched liquid-to-air cooling unit TC.LAE available
    • possibility of upgrading to systems of up to 1 MVA
    • high level of system dynamics, ≤ 5 kHz modulation bandwidth
    • non-restrictive capability of refeeding in the Q4 operation mode
    • possibility of operating as an autonomous 4-Q and 3-phase quasi-analogue amplifier
    • possibility of “Hardware-in-the loop”-operation (HIL mode)
    • user friendly application software with pre-configured test patterns
    • possibility of integrating into a complete SAS simulation and test system
    • galvanic isolation available as an option without derating the simulator port data

     

    • 16K Video Generator & Analyzer
    • Dolby Vision™, HDR 10 and HDR 10+
    • validating DP 1.4a & DP 2.0 Link Layer on DP Sinks and Sources
    • Power Input +12 Vdc (AC/DC converter included)
    • Module Size/Weight TBD for Weight and Size

     
    Unigraf_1.PNG

     

    • Compact sized DisplayPort™ 1.2 compliant Reference Sink
    • HBR2 and MST capable Sink and Branch device
    • Cerified as the platform for DP 1.2 LL CTS Ext1 tests
    • Optional MST Debug panel and AUX Channel Monitor
    • Debug and Test Controller GUI enables monitoring and previewing any MST stream
    • User programmable EDID and DPCD

     

    •  HDMI 2.1 Test Equipment (FRL)
    • Enhanced Gaming Features (VRR, ALLM)
    • FEC, Forward Error Correction
    • HDCP 2.2 & HDCP 2.3 support  TMDS Support
    • Dolby Vision™ Test Tool
    • 8K@60 fps Support (12 Gbps/channel)
    • eARC Support (end of 2019)
    • DSC Support (ESTIMATED 2020)
    • UCD Console GUI for debugging
    • High level API for easy integreation

     

    • Automated tests for USB-C™ DisplayPort™ Alt Mode
    • Electrical Test to verify whole USB-C connector with single cable insert
    • Test USB 2.0 and USB 3.0
    • 4K@60 support
    • Easily set test parameters with provided Software
    • Easily run tests from the commandline
    • Unigraf’s Test System Interface (TSI) Support
    • Third Part Test Management Software
    • Support e.g. NI TestStand Support

     

    • UHD / 4K compliant test equipment
    • HDMI 2.0 and DP 1.2 input and output in one unit
    • DCP Approved HDCP 2.3 CTS Test Tool
    • HDCP 1.3 and HDCP 2.3 support
    • Sink and source video, audio and configuration parameters
    • USB 3.0 connected
    • UCD Console GUI for debugging
    • High level API for easy integration

     

    • Test DP over USB-C video and audio
    • Test USB-C Power Delivery with DP Alt Mode
    • DCP Apporved HDCP 2.3 CTS Tests
    • Verify interface signal continuity
    • 4K@60 support
    • HDCP 1.3 and HDCP 2.3 support
    • Capture video and audio, monitor and control interface parameters
    • USB signal pass-thru
    • UCD Console GUI for debugging
    • High level API for easy integration