Semiconductor Test & Measurement

Showing 65–68 of 68 results


  • Excellent Performance – Longest Lifetime

    • Best price per contact – typically over one million (1,000,000) touchdowns
    • RF/Microwave signal is shielded and completely air isolated in the probe body
    • Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
    • Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
    • Probe on any pad material with minimal damage

     

    • Highest accuracy in test results
    • Easy setup even for less experienced users
    • Minimized coupling losses with minimal trench dimensions
    • Exclusive FormFactor-developed automated test methodology
    • Wide range of tools for capturing, logging and interpreting data
    • Enables hands-free autonomous calibration and re-calibration at multiple temperatures
    • Search First Light feature enables automated determination of initial position for optimization
    • Once aligned, all calibration functions are automated and performed through SiPh-Tool

     

    • On-wafer power device characterization up to 10,000 V DC / 600 A
    • Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
    • Prevent thin wafers from curling and breaking
    • Accurate Rds(on) measurement at high current
    • Accurate UIS measurements at high temperature
    • Roll-out stage for full wafer access and easy wafer loading/unloading
    • Seamless integration between Velox and analyzers/measurement software
    • High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
    • Easy on-screen navigation, wafer mapping, and operation of accessories with Velox
  • Enabling single-contact high-current/high-voltage test

    • Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
    • Even distribution of high current with innovative multi-fingertip design
    • Compatible with Tesla 200/300 mm power device characterization system
    • Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
    • Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
    • Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

     


Showing 65–68 of 68 results