Products

• Supports up to 12 VNA ports than can be mapped to four logical ports for calibration
• Extensive guidance, wizards and management features automate calibration setup, measurement, result data conversion and report creation
• LRRM-SOLT, multi-line TRL and second-tier calibration methods enable precision and simple multi-port calibrations
• Automatic load inductance compensation function ensures the most repeatable calibrations
• Easy to use Probe to ISS/CSR matching tool
• Additional remoting methods
• Interface with Velox™ over LAN

• Easily create tasks
• Obtain fast results
• Adapts to the user’s needs and skills level
• Reduces working time
• Saves money!
• Designed to operate with maximum intelligence
• Automates workflows
• Enables autonomous measurements

Robust RF Test on PCB and Ceramic

• Replace costly and inflexible test fixtures with easy-to-use probe tips
• Long lifetime – typically over 1,000,000 contacts
• GS/SG footprint up to 4 GHz and GSG up to 20 GHz
• High-power RF test: up to 30 Watts
• Test at temperatures from -60°C to 200°C

High power, High performance probe

• High power – 66 W at 2.4 GHz and 43 W at 5 GHz
• Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
• Excellent contact control and low contact resistance
• High performance on any pad material (Al or Au)
• Longest lifetime – typically one million (1,000,000) touchdowns

Excellent Performance – Longest Lifetime

• Best price per contact – typically over one million (1,000,000) touchdowns
• RF/Microwave signal is shielded and completely air isolated in the probe body
• Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
• Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
• Probe on any pad material with minimal damage

• Highest accuracy in test results
• Easy setup even for less experienced users
• Minimized coupling losses with minimal trench dimensions
• Exclusive FormFactor-developed automated test methodology
• Wide range of tools for capturing, logging and interpreting data
• Enables hands-free autonomous calibration and re-calibration at multiple temperatures
• Search First Light feature enables automated determination of initial position for optimization
• Once aligned, all calibration functions are automated and performed through SiPh-Tool

Key Performance Capabilities:

• Slew rates up to 60 V/µsec.
• Up to 240A DC at +50VDC or –50VDC (4301-240 configuration).
• Can provide pulses of up to 800 amps at voltages of up to ±100V (4301-240 configuration).
• Adjustable compensation allows the system to maintain a 50V/2 µsec rise-time over a wide range of current outputs.

Key Performance Capabilities:

• Bandwidth: DC to 50 kHz
• Voltage: 0 to 250 V_RMS; 0 to 350 VDC
• Current: 100 to 500 A_RMS
• Distortion: 0.1%
• Power: 4 kW to 20 kW*Power levels up to 5X rated power when driving reactive loads
• High power efficiency and density

*Models available with output from 4 kW to 20 kW (capable of up to 125 kVA).

Key Performance Capabilities:

• 4-Quadrant – Can source and sink current
• ±80V – DC supply for 12V to 48V systems; meets 80V surge requirements
• 300 kHz Sine – DC ripple tests for all major standards
• 3µs Rise Time – Exceeds surge and dropout slew rate requirements
• 3mΩ DC Source Impedance – Out-performs ISO 7637-2 requirements
• Supports ground reference and supply offset testing required for ISO 16750-2 Sect. 4.8 and other similar standards

Key Performance Capabilities:

• Up to 900 watts RMS power output (7136 model)
• Small signal response up to 400 kHz
• User-adjustable precision DC offset
• User-adjustable current limit: 1A to 25A
• 4-quadrant operation
• AC/DC coupled

Key Performance Capabilities:

• Up to 900 watts RMS power output (7136 model)
• Small signal response up to 400 kHz
• User-adjustable precision DC offset
• User-adjustable current limit: 1A to 25A
• 4-quadrant operation
• AC/DC coupled

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
• Prevent thin wafers from curling and breaking
• Accurate Rds(on) measurement at high current
• Accurate UIS measurements at high temperature
• Roll-out stage for full wafer access and easy wafer loading/unloading
• Seamless integration between Velox and analyzers/measurement software
• High-throughput wafer autoloading (standard, thinned, warped, TAIKO)
• Easy on-screen navigation, wafer mapping, and operation of accessories with Velox

Enabling single-contact high-current/high-voltage test

• Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
• Even distribution of high current with innovative multi-fingertip design
• Compatible with Tesla 200/300 mm power device characterization system
• Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
• Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
• Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)